Periodic Reporting for period 1 - io600 (A cutting-edge digital dispensing system for next-gen electronics manufacturing)
Reporting period: 2024-10-01 to 2025-09-30
The semiconductor industry is aiming at producing smaller and more powerful chips. However, semiconductor packaging (back-end) technologies have reached their limits in terms of material deposition. Backend solutions for material deposition are 1) Subtractive technologies - etching and electroplating - highly polluting and, thus, unsustainable: and 2) Additive Manufacturing techniques that have reached their resolution limit considering the material fillers and/or viscosity, making it impossible to do smaller packaging and thus smaller chips. Our solution is the io600 system. It uses the CLAD (Continuous Laser-Assisted Deposition) technology to deliver high-volume deposition of any material on any kind of substrate, at a high throughput, highest resolution and without employing polluting materials. Io600 is a game changer in the semiconductor backend process with times higher viscosity than inkjet without any risk of clogging; 50% to 100% higher resolution compared to screen printers, jetters and needle dispensers; 35 times faster than dispensing systems; higher packaging density (10% die-density improvement) and 40% lower CAPEX; Less clean room space (80% lower area); does not employ hazardous chemicals and saves 1 m3 of water per m2 in PCB manufacturing.
IO600 customers are semiconductor packaging companies. They will benefit from the improved resolution, higher throughput, lower CAPEX and, because it is a not polluting process, the potential for reshoring the back-end process to the US and Europe.
Io600 aligns with EU strategic policies on Green Deal and sustainability, Digital transformation (better chip designs) and the EU Chips Act as allows reshoring of the backend process and bolsters Europe’s competitiveness and resilience in semiconductor technologies.
IO600 customers are semiconductor packaging companies. They will benefit from the improved resolution, higher throughput, lower CAPEX and, because it is a not polluting process, the potential for reshoring the back-end process to the US and Europe.
Io600 aligns with EU strategic policies on Green Deal and sustainability, Digital transformation (better chip designs) and the EU Chips Act as allows reshoring of the backend process and bolsters Europe’s competitiveness and resilience in semiconductor technologies.
During the first 12 months of the project, the main activities carried out are:
Handling system
The design covers all the requirements of a high-volume manufacturing system:
• Design of a novel conveyer system that enables the machine to connect to standard inline system and to move in X&Y directions to cover the entire 600X600mm substrates. This concept enables static-laser system with simpler motion systems.
• Design lift with 600X600mm2 vacuum chuck to hold and flatten the substrate above the conveyer.
Increase the foil size
Main design features to enable increased foil size:
1) Enabling dynamic coplanarity:
i) Tip/ tilt mechanism on the foil
ii) Tip/ tilt mechanism on the chuck
iii) Sensors to measure the planarity and distance between the foil head to the substrate below to measure and control this distance.
High-speed motion systems
Design of high TPT motion systems which include:
• Power full linear motors
• High end guiding system
• High resolution encoders
• Structural design with FEA analysis to reinforce and increase structure stiffness for high TPT impacts. The reinforcement design improved the structure resonance from 45Hz to 75Hz.
Coating system - reuse material system, coating speed
• Coating system improvements:
• Adding touch sensors to directly measure the gap with an accuracy of <1um
• Adding breaks to remove runout error
• Tested a setup on the existing machine of the coating uniformity
• Design roller cleaning device to reduce scratches and increase mean time between maintenance.
• Tested several versions for performance and EOU improvements.
Full automation
Developed automated fiducial detection and print scheme in the SW:
1) Training a fiducial
2) Define the fiducial position in the substrate
3) Automatic detection and coordinate correction
Machine design
Design full IO600 machine with all the industry standards requirements:
1) Operator interface
2) Compatible with safety regulations.
3) Doors and covers for operation and maintenance axes.
4) Handling and motion system.
5) Material dispenser, foils system and coating system
6) Laser and optical system
7) Electrical and pneumatic cabinet.
Communication & Dissimilation activities as per WP 4
Project Management activities as per WP 6
Handling system
The design covers all the requirements of a high-volume manufacturing system:
• Design of a novel conveyer system that enables the machine to connect to standard inline system and to move in X&Y directions to cover the entire 600X600mm substrates. This concept enables static-laser system with simpler motion systems.
• Design lift with 600X600mm2 vacuum chuck to hold and flatten the substrate above the conveyer.
Increase the foil size
Main design features to enable increased foil size:
1) Enabling dynamic coplanarity:
i) Tip/ tilt mechanism on the foil
ii) Tip/ tilt mechanism on the chuck
iii) Sensors to measure the planarity and distance between the foil head to the substrate below to measure and control this distance.
High-speed motion systems
Design of high TPT motion systems which include:
• Power full linear motors
• High end guiding system
• High resolution encoders
• Structural design with FEA analysis to reinforce and increase structure stiffness for high TPT impacts. The reinforcement design improved the structure resonance from 45Hz to 75Hz.
Coating system - reuse material system, coating speed
• Coating system improvements:
• Adding touch sensors to directly measure the gap with an accuracy of <1um
• Adding breaks to remove runout error
• Tested a setup on the existing machine of the coating uniformity
• Design roller cleaning device to reduce scratches and increase mean time between maintenance.
• Tested several versions for performance and EOU improvements.
Full automation
Developed automated fiducial detection and print scheme in the SW:
1) Training a fiducial
2) Define the fiducial position in the substrate
3) Automatic detection and coordinate correction
Machine design
Design full IO600 machine with all the industry standards requirements:
1) Operator interface
2) Compatible with safety regulations.
3) Doors and covers for operation and maintenance axes.
4) Handling and motion system.
5) Material dispenser, foils system and coating system
6) Laser and optical system
7) Electrical and pneumatic cabinet.
Communication & Dissimilation activities as per WP 4
Project Management activities as per WP 6
As part of the expected results of the io600 projecr, we aim to achieve 50% to 100% higher resolution compared to screen printers, jetters and needle dispensers; 35 times faster than dispensing systems; Higher packaging density (10% die-density improvement) and 40% lower CAPEX; Less clean room space (80% lower area); does not employ hazardous chemicals and saves 1 m3 of water per m2 in PCB manufacturing. IO600 customers are semiconductor packaging companies.
In addition, the following Impacts:
• Environmental:
IoTech’s Additive Manufacturing processes lead to drastic reduction and in some cases, elimination of emissions
and pollution. With subtractive processes, machining and cutting operations can generate dust, chips, acids and
other waste materials that may require additional treatments and disposal measures. In contrast, ioTech AM
processes emit no pollutants. Our process avoid the use of approximately 1.5 litre of 1-methyl-2-pyrrolidone per 300 mm wafer3.
• Removing electro plating process: ioTech avoids the impurities due to bath pollution, therefore not requiring
the addition of nickel interlayer: 196 mm3 of nickel saved.
• Economic:
Our systems offer higher productivity and throughput compared to traditional manufacturing methods. By
optimizing production processes and leveraging AM's design flexibility and automation capabilities, companies
can achieve higher output with fewer machines.
In addition, our systems enable the creation of smaller, more efficient cleanrooms and production facilities. This
optimization minimizes energy consumption, space requirements, and environmental impact, contributing to
the sustainable development of industry infrastructure. This makes our system contribute to industry innovation
and infrastructure (SDG 9).
It is also relevant the decent work and economic growth (SDG 8) due to the job creation in Europe through
reshoring chip manufacturing. io600´s clean and less labour-intensive AM technology fosters the reshoring of
key processes back to the EU. As a result, more jobs will be available for the already existing high-level trained European workers.
• Societal:
Consumers and companies are looking for sleeker, more powerful and smaller devices for consumer electronics, automotive sector, and others. ioTech meets these demands. The miniaturization of the design
achieved with ioTech technology contributes to the development of innovative technologies and enables
advancements in sectors such as health, mobility, communications, and electronics with a huge impact on our
well-being.
In addition, the following Impacts:
• Environmental:
IoTech’s Additive Manufacturing processes lead to drastic reduction and in some cases, elimination of emissions
and pollution. With subtractive processes, machining and cutting operations can generate dust, chips, acids and
other waste materials that may require additional treatments and disposal measures. In contrast, ioTech AM
processes emit no pollutants. Our process avoid the use of approximately 1.5 litre of 1-methyl-2-pyrrolidone per 300 mm wafer3.
• Removing electro plating process: ioTech avoids the impurities due to bath pollution, therefore not requiring
the addition of nickel interlayer: 196 mm3 of nickel saved.
• Economic:
Our systems offer higher productivity and throughput compared to traditional manufacturing methods. By
optimizing production processes and leveraging AM's design flexibility and automation capabilities, companies
can achieve higher output with fewer machines.
In addition, our systems enable the creation of smaller, more efficient cleanrooms and production facilities. This
optimization minimizes energy consumption, space requirements, and environmental impact, contributing to
the sustainable development of industry infrastructure. This makes our system contribute to industry innovation
and infrastructure (SDG 9).
It is also relevant the decent work and economic growth (SDG 8) due to the job creation in Europe through
reshoring chip manufacturing. io600´s clean and less labour-intensive AM technology fosters the reshoring of
key processes back to the EU. As a result, more jobs will be available for the already existing high-level trained European workers.
• Societal:
Consumers and companies are looking for sleeker, more powerful and smaller devices for consumer electronics, automotive sector, and others. ioTech meets these demands. The miniaturization of the design
achieved with ioTech technology contributes to the development of innovative technologies and enables
advancements in sectors such as health, mobility, communications, and electronics with a huge impact on our
well-being.