Project description
New semiconductor packaging with sustainable technology
Semiconductor packaging technologies are facing critical challenges as the demand for smaller, more powerful chips grows. Traditional methods like etching and electroplating are environmentally harmful and no longer effective at meeting these demands. Meanwhile, additive manufacturing struggles to achieve the necessary resolution due to material limitations. This results in slow progress in creating smaller chips for advanced electronics. In this context, the EIC-funded io600 project addresses these challenges with its innovative CLAD technology. It offers high-resolution, high-speed material deposition without harmful chemicals, making the process more sustainable and efficient. This breakthrough allows for smaller, denser chip packaging, reducing costs and improving throughput, ultimately helping the semiconductor industry meet future demands while supporting EU sustainability goals.
Objective
The semiconductor industry is aiming at producing smaller and more powerful chips. However, semiconductor packaging (back-end) technologies have reached their limits in terms of material deposition. Backend solutions for material deposition are 1) Subtractive technologies - etching and electroplating - highly polluting and, thus, unsustainable: and 2) Additive Manufacturing techniques that have reached their resolution limit considering the material fillers and/or viscosity, making it impossible to do smaller packaging and thus smaller chips.
Our solution is the io600 system. It uses the CLAD (Continuous Laser-Assisted Deposition) technology to deliver high-volume deposition of any material on any kind of substrate, at a high throughput, highest resolution and without employing polluting materials.
Io600 is a game changer in the semiconductor backend process with times higher viscosity than inkjet without any risk of clogging; 50% to 100% higher resolution compared to screen printers, jetters and needle dispensers; 35 times faster than dispensing systems; Smaller KOZ means higher packaging density (10% die-density improvement) and 40% lower CAPEX; Less clean room space (80% lower area); does not employ hazardous chemicals and saves 1 m3 of water per m2 in PCB manufacturing.
IO600 customers are semiconductor packaging companies. They will benefit from the improved resolution, higher throughput, lower CAPEX and, because it is a not polluting process, the potential for reshoring the back-end process to the US and Europe. Io600 users of the chips built with io600 systems are electronic equipment manufacturers, which will design smaller, more powerful chips, key in electronics.
Io600 aligns with EU strategic policies on Green Deal and sustainability, Digital transformation (better chip designs) and the EU Chips Act as allows reshoring of the backend process and bolsters Europe’s competitiveness and resilience in semiconductor technologies.
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Keywords
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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HORIZON.3.1 - The European Innovation Council (EIC)
MAIN PROGRAMME
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Topic(s)
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Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
HORIZON-EIC-ACC - HORIZON EIC Accelerator
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) HORIZON-EIC-2024-ACCELERATOR-02
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
7177871 Modiin
Israel
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.