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Wafer Scale Ultra-Clean Van der Waals Heterostructures

Project description

Inorganic clean assembly of Van der Waals heterostructures

2D materials (2DM) with van der Waals (vdW) heterostructures exhibit remarkable electrical, optical, thermal and mechanical properties. They also have a wide range of applications in wafer-thin optoelectronic and electronic devices. Currently, the transfer process of 2DM from their growth substrate to their designated substrate involves using organic polymers to support 2DM. However, this can cause significant contamination and mechanical damage to the transferred layers. To address this, the ERC-funded 2D-TRANSFER project aims to develop a completely inorganic transfer technique – and instrumentation device – based on industrial needs for versatility, quality standards and reliability. This novel technique will not only enable contamination-free transfer, but will provide better mechanical stability and facilitate alternative methods for vdW heterostructure assembly.

Objective

Two dimensional materials (2DM) and their van der Waals (vdW) heterostructures have opened new opportunities to develop
atomically thin electronic and optoelectronic devices with a wide range of functionalities. While thousands of research papers
demonstrate proof-of-concept studies with improved and novel performance using small-scale exfoliated crystals, a number of
challenges still remains when these are attempted to be scaled up on wafer-scale with CVD grown 2DM. One of the key challenges is
the transfer process of 2DM from their growth substrate to another 2DM or a target substrate for intended use. Currently, this process
is performed using organic polymers to support 2DM, which introduces considerable amount of contamination and mechanical
damage to the transferred layers.
We propose to circumvent the existing issues of the transfer process by employing a new technique recently invented in NGI, which
completely avoids use of organic compounds. This approach enables production of heterostructures with perfect interfaces free from
interlayer contamination and correspondingly excellent (opto)electronic behaviour. In addition, eliminating polymeric supports
allows new possibilities for vdW heterostructure fabrication: assembly at temperatures up to 600°C, and in different environments
including ultra-high vacuum (UHV), liquid submersion and improved mechanical stability.
This project will apply our novel approach for wafer-scale use, considering requirements of industrial companies, such as the choice of
2DMs and wafers, quality standards, throughput and reliability. The improved inorganic transfer technology will be then licensed to a
selected 2DM foundry. In addition, we will develop an instrument for wafer-scale 2DM transfer that employs our innovative approach,
which will be made available via spin-out company. Successful completion of the project can bring life to a wide range of industrial
exploitation of 2DM in industrial nanotechnology applications.

Fields of science (EuroSciVoc)

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Programme(s)

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Topic(s)

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Funding Scheme

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HORIZON-ERC-POC - HORIZON ERC Proof of Concept Grants

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) ERC-2024-POC

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Host institution

THE UNIVERSITY OF MANCHESTER
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 150 000,00
Address
OXFORD ROAD
M13 9PL Manchester
United Kingdom

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Region
North West (England) Greater Manchester Manchester
Activity type
Higher or Secondary Education Establishments
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Total cost

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Beneficiaries (1)

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