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Breakthrough Integration and Resolution in Defect Repair

Project description

Precision repair for displays and semiconductors

High-precision industries such as display manufacturing and semiconductors are increasingly challenged by nanoscale defects, which can lead to expensive failures, such as pixel misalignments and uneven luminance. The EIC-funded BIRD project will address this with an innovative solution: High-Precision Capillary Printing (HPCaP). This additive manufacturing technique allows repair at resolutions between 100 nanometres and 50 microns, depositing any liquid material on any surface with exceptional accuracy. Building on the successful NAZCA prototyping tool, now sold worldwide, BIRD aims to scale HPCaP into a commercial repair module integrated into production lines. By improving yield and reducing waste, the project aligns with the European Green Deal, boosting sustainability and Europe’s competitive edge in advanced manufacturing.

Objective

The BIRD European project (Bringing Intelligent Resolution to Defect-repair) aims to revolutionize the repair of defects in high-precision industries, such as display manufacturing and semiconductors. It will develop and integrate a groundbreaking additive manufacturing technology that enables nanometric-scale defect resolution, addressing critical issues like luminance inconsistencies and pixel misalignments. This solution, called High Precision Capillary Printing (HPCaP), perfectly addresses the challenges encountered due to miniaturization and complexity at nanoscales, and even goes far beyond expectations. Not only does the process provide unparalleled high resolution (between 100 nm and 50 microns), but it also enables the deposition of any liquid material on any surface with a high degree of design freedom.
The company's flagship product, the NAZCA prototyping tool, has reached TRL 8 and has been sold to leading clients in Europe, the U.S. and Asia. The next step involves scaling this innovation to create a commercial-grade repair module designed for seamless integration into display and semiconductor industries production lines. This HPCaP module will address a serviceable obtainable market (SOM) estimated at over €91M by 2028.
By partnering with top European research institutions and industry players, BIRD will ensure the validation and scalability of this innovative technology, targeting high-yield, defect-free production. As the display and semiconductor industries face increasing demand for precision manufacturing, Hummink’s solutions provide a timely response to growing concerns over waste and yield losses. This project supports the objectives of the European Green Deal by promoting sustainable, resource-efficient manufacturing, reducing waste, and contributing to Europe’s technological sovereignty. Through this, BIRD will significantly enhance the competitiveness of European industries in high-volume manufacturing and semiconductor repair markets.

Fields of science (EuroSciVoc)

Keywords

Programme(s)

Topic(s)

Funding Scheme

HORIZON-EIC-ACC - HORIZON EIC Accelerator

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Call for proposal

(opens in new window) HORIZON-EIC-2024-ACCELERATOR-02

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Coordinator

HUMMINK
Net EU contribution
€ 2 499 087,50
Address
5 RUE CHARLOT
75003 Paris
France
SME
Yes
Region
Ile-de-France Ile-de-France Paris
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost
No data