Light-based Ultrafast Modules for Efficient Nanolaser-enhanced processors

Objectif

The rapid growth of Artificial Intelligence and other advanced technologies is driving a strong demand for high-performance electronics and faster computing. System-in-Package (SiP) technology addresses this need by combining digital, analogue and memory components within a single package to reduce latency. However, traditional copper interposers are reaching their limits. They struggle to provide the bandwidth, chiplet-to-chiplet connectivity and thermal management required for modern applications, which hinders overall efficiency and performance.

Optical interposers are emerging as a promising alternative. By using light instead of electrical signals, they enable faster data transfer, improved energy efficiency and better heat control. This is particularly important for applications such as AI, machine learning and high-performance computing. Compared with copper-based systems, optical interposers reduce latency, increase bandwidth and offer a more scalable and sustainable architecture.

NcodiN’s LUMEN project focuses specifically on enabling optical communication between chiplets within the same package. It introduces photonic crystals as a new platform for building nanolasers and nanodetectors that form the core of optical links between chiplets. These components are designed to be extremely compact, energy-efficient and fully compatible with CMOS processes. With this approach, NcodiN aims to overcome the major bottlenecks of current interposer technologies and deliver the next generation of high-density, high-performance optical interconnects for chiplet-based computing systems.