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Sustainable production line delivering advanced packaging for space missions

Objective

To secure EU non-dependence in critical space electronics, the SUPERPACS consortium will build a European supply chain for advanced packaging technologies such as silicon interposer and ultra high-density organic interposers. Reduced line width and spacing (below 5 µm) for very-high-density integration, smaller form factors and improved mass/power efficiency will unlock chiplet-based devices such as RF integrated circuits, digital to analog converters, digital core or high bandwidth memories to be implemented into advanced System in Package.
The SUPERPACS project pursues two complementary concepts: Silicon interposer and an ultra-high-density organic carrier to accelerate demonstration while mitigating IP and manufacturability risks. It mobilises an open “SIPACK” pilot line to validate an industrial route at 1,000-100,000 SiP modules per year, anchoring a European supply chain from material to module and supporting dual-use markets. SUPERPACS covers the full sequence from material selection & characterisation, design & simulation, fabrication & assembly, to testing, reliability and validation. Target application domains are Galileo, EGNOS, Copernicus, SST and IRIS², allowing the project to advance from initial TRL 3-4 to TRL 6-7 for Navigation, Earth Observation and Telecommunication.
The SUPERPACS consortium consists of experienced space actors, independent research institutes and test labs, and technology providers for both commercial and high-reliability applications. The work plan consists of determining the SiP requirements for space, developing Si interposer and organic UHDI interposer technology, combined assembly of components and submitting the respective test vehicles and demonstrators to reliability testing up to TRL6. For risk mitigation, two design/manufacturing/test cycles will be implemented supported by APQP MRL/TRL assessment techniques. Finally, for broader impact on the project output, a SiP design kit will be presented at the end of the project.

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Keywords

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Programme(s)

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Topic(s)

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Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

HORIZON-RIA - HORIZON Research and Innovation Actions

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) HORIZON-CL4-2025-02

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Coordinator

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 349 750,00
Address
KAPELDREEF 75
3001 Leuven
Belgium

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Region
Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven
Activity type
Research Organisations
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 349 750,00

Participants (6)

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