BNXFLOW™: QUANTUM BN AEROGEL NANOFLUID ENDING THE €5B AI THERMAL CRISIS & ENABLING CARBON-NEUTRAL COMPUTING

Objetivo

AI processors now exceed 700 W, EV power electronics approach 800 kW, and today’s thermal interface materials (TIMs) have hit their physical limits. Greases (5–12 W/mK) pump out and age, while liquid metals, though conductive, are toxic, corrosive and prone to shorting. As a result, data-centre GPUs throttle under load and fail at >5%/year, costing hyperscalers over $100 M annually.
BNxFlow, Next-Ion’s liquid boron nitride aerogel, directly overcomes this bottleneck. Built on a quantum-engineered BN aerogel architecture (validated by two Seals of Excellence), it forms a continuous, electrically insulating 3D network delivering 70–90 W/mK through-plane conductivity, a 6–18× leap over dielectric TIMs. Its patented shear-thinning and self-healing behaviour allows it to flow during application, then lock into a robust solid network that resists pump-out, vibration and thermal fatigue.
The value for end-users is immediate: i) 5–10% sustained GPU performance, >50% fewer failures, and ROI within months. ii) A hyperscaler with 100,000 GPUs can recover >$100 M/year through reduced failures, lower cooling load and recaptured compute capacity. In EV power electronics, BNxFlow provides the dielectric, high-cycle-life TIM required for 800 V SiC inverters, onboard chargers and fast-charging systems, a fast-growing €1B+ market lacking viable solutions. Fully manufacturable in Turkey (a Widening country), BNxFlow strengthens Europe’s strategic autonomy by establishing a sovereign supply chain for high-performance TIMs, reducing dependence on Asian materials, and creating >180 high-skilled jobs by 2030. With extreme performance, electrical safety and scalable processing, BNxFlow is positioned to become Europe’s flagship thermal-management platform for AI, data-centres, EVs and next-generation electronics.