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Scalable Photonic pAckaging for high-peRformance optiCal interconnects

Objective

The exponential growth of AI, cloud computing, and quantum technologies is driving a revolution in digital infrastructure, with optical connectivity emerging as the backbone for high-capacity, energy-efficient data transfer. However, the physical interface between optical fibers and photonic chips remains a critical bottleneck, limiting scalability, serviceability, and cost-effectiveness in next-generation systems such as data centers, telecom networks, and quantum computers. Current fiber-to-chip interconnect solutions are bulky, fragile, expensive, and not designed for mass production or modularity, threatening to stall the optical revolution at the interface where light meets silicon.

ICON Photonics addresses this urgent challenge by pioneering the world's most compact, high-precision, and detachable Co-Packaged-Optics fiber-to-chip connector. Inspired by the simplicity and versatility of USB-C, ICON’s technology enables passive, self-aligned assembly and true modularity—unlocking scalable, serviceable, and cost-efficient optical infrastructure. The solution is compatible with wafer-level manufacturing, enabling integration densities exceeding 1,000 fibres per switch and delivering significant reductions in assembly steps and costs.

This solution enables the mass deployment of advanced photonic systems for AI, quantum computing, and high-performance computing while reducing energy consumption and environmental impact. This breakthrough positions ICON Photonics as a foundational enabler of the optical era, setting new standards for manufacturability, performance, and sustainability in digital infrastructure.

Fields of science (EuroSciVoc)

CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.

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Keywords

Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)

Programme(s)

Multi-annual funding programmes that define the EU’s priorities for research and innovation.

Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

HORIZON-EIC-ACC - HORIZON EIC Accelerator

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Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

(opens in new window) HORIZON-EIC-2026-ACCELERATOR-02

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Coordinator

ICON PHOTONICS
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 2 498 825,00
Address
2 BIS RUE ALFRED NOBEL
77420 Champs-Sur-Marne
France

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SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Ile-de-France Ile-de-France Seine-et-Marne
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

No data