Objective
The objective of this project was to conduct basic research in the field of high-resolution optical sensors for CIM applications, eg robotics, pattern recognition and optical character recognition. The project provided fundamental technologies which will permit the development of the next generation of image sensors with more than 1 million pixels per chip.
The objective of this project was to conduct basic research in the field of high resolution optical sensors for computer integrated manufacture (CIM) applications (eg robotics, pattern recognition and optical character recognition). The project provided fundamental technologies which will permit the development of the next generation of image sensors with more than 1 million pixels per chip.
With the use of transparent conductive electrodes made out of indium tin oxide layers, instead of polycrystalline silicon electrodes, the loss in light sensitivity due to area reduction of the pixels can now be completely compensated for. The results of working devices show that the overall sensitivity can be increased by a factor of 2 or more for blue light by replacing 3 levels of polysilicon with 2 levels of indium tin oxide.
A complete system for the automatic functional testing of image sensors with respect to the most important operating parameters has been developed.
By optimizing the output stage onchip as a buried channel N-channel metal oxide semiconductor (NMOS) source, followed by 2 or 3 amplification stage for 1.5 micron NMOS technology, and using correlated double sampling of the charge coupled device (CCD) signal, an operation has been realised at 20 MHz driving frequency.
Differentstructures for 1.5 micron NMOS technology have been analyzed by computer simulation. Horizontal antiblooming structures with buried channel and with surface channel diode drains were realized with good spectral response in the whole visible and near infrared spectrum.
An imaging architecture has been proposed with a bus system where the data addresses and control are freely communicated between the sensor, the buffer and the associated processors, realizing the suite of specific functionalities.
The following results were obtained:
-Improved sensitivity: with the use of transparent conductive electrodes made out of indium-tin-oxide layers, instead of polycrystalline silicon electrodes, the loss in light sensitivity due to area reduction of the pixels can now be completely compensat ed for. All processing steps have been worked out, and the results of working devices show that the overall sensitivity can be increased by a factor of two or more for blue light by replacing three levels of polysilicon with two levels of indium-tin-oxide.
-Automated functional test: a complete system for the automatic functional testing of image sensors with respect to the most important operating parameters has been developed. It is suitable for laboratory applications and gains further improvement withan increased address space of the computer and larger capacity of the image-processing system for use in a production environment.
-Reduction of amplifier noise: high-resolution image sensors require high speed and low noise output amplifiers. By optimising the output stage on-chip as a buried channel NMOS source, followed by two or three amplification stages for 1.5 micron NMOS tec hnology, and using correlated double sampling of the CCD signal, an operation has been realised at 20 MHz driving frequency.
-Suppression of blooming: different structures for 1.5 micron NMOS technology have been analysed by computer simulation. Horizontal anti-blooming structures with buried channel and with surface channel diode drains were realised with good spectral respon se in the whole visible and near-infrared spectrum.
-Study of image-processing systems: an imaging architecture has been proposed with a bus system where data addresses and control are freely communicated between the sensor, the buffer and the associated processors, realising the suite of specific functio nalities.
Exploitation
The results of this project will be used in further high-resolution sensor developments, with industrial exploitation expected in the early 1990s.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology electrical engineering, electronic engineering, information engineering electronic engineering sensors optical sensors
- natural sciences chemical sciences inorganic chemistry inorganic compounds
- natural sciences chemical sciences inorganic chemistry post-transition metals
- natural sciences computer and information sciences artificial intelligence pattern recognition
- natural sciences mathematics applied mathematics mathematical model
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
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Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
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Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
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Coordinator
20095 Hamburg
Germany
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.