Objective
As a part of a LINK Nanotechnology research project funded by the UK DTI, an electroforming technique has been developed capable of producing microscopic metal component structures to a high specification. This Technology Validation project will apply this expertise to the production of bumped dies for the semiconductor industry.
Fields of science
Call for proposal
Data not availableFunding Scheme
CSC - Cost-sharing contractsCoordinator
FOTOMECHANIX LTD
Links
Participants (2)
EGLI RESEARCH
United Kingdom
Links
ELTEK TECHNOLOGY SEMI-CONDUCTORS SA
France
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