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Content archived on 2024-05-14

AN ELECTROFORMATION TECHNIQUE FOR BUMPING SEMI-CONDUCTOR DIES

Objective



As a part of a LINK Nanotechnology research project funded by the UK DTI, an electroforming technique has been developed capable of producing microscopic metal component structures to a high specification. This Technology Validation project will apply this expertise to the production of bumped dies for the semiconductor industry.

Call for proposal

Data not available

Coordinator

FOTOMECHANIX LTD
EU contribution
No data
Address


United Kingdom

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Total cost
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Participants (2)