AN ELECTROFORMATION TECHNIQUE FOR BUMPING SEMI-CONDUCTOR DIES

Objective

As a part of a LINK Nanotechnology research project funded by the UK DTI, an electroforming technique has been developed capable of producing microscopic metal component structures to a high specification. This Technology Validation project will apply this expertise to the production of bumped dies for the semiconductor industry.

Programme(s)

• FP4-INNOVATION - Specific programme for the dissemination and exploitation of the results of activities in the field of research, technological development and demonstration, 1994-1998

Topic(s)

• 1 - Technology Transfer and Technology Validation project funding (TTP+TVP)

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

FOTOMECHANIX LTD

Participants (2)

EGLI RESEARCH

United Kingdom

ELTEK TECHNOLOGY SEMI-CONDUCTORS SA

France