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AN ELECTROFORMATION TECHNIQUE FOR BUMPING SEMI-CONDUCTOR DIES

Objective



As a part of a LINK Nanotechnology research project funded by the UK DTI, an electroforming technique has been developed capable of producing microscopic metal component structures to a high specification. This Technology Validation project will apply this expertise to the production of bumped dies for the semiconductor industry.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

FOTOMECHANIX LTD

Participants (2)

EGLI RESEARCH
United Kingdom
ELTEK TECHNOLOGY SEMI-CONDUCTORS SA
France