Skip to main content

Reliable and Variability tolerant System-on-a-chip Design in More-Moore Technologies

Project description


Next-Generation Nanoelectronics Components and Electronics Integration
The "REALITY" project activity provides solutions for coping with variability and reliability issues that occur when scaling to and beyond the 32 nm technology node.

Call for proposal

FP7-ICT-2007-1
See other projects for this call

Coordinator Contact

Miguel Miranda Corbalan (MR.)

Coordinator

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Address
Kapeldreef 75
3001 Leuven
Belgium

See on map

Activity type
Research Organisations
Administrative Contact
Christine Van Houtven (Mrs.)
EU contribution
€ 711 914

Participants (5)

KATHOLIEKE UNIVERSITEIT LEUVEN
Belgium
EU contribution
€ 376 794
Address
Oude Markt 13
3000 Leuven

See on map

Activity type
Higher or Secondary Education Establishments
Administrative Contact
Maria Vereeken (Ir)
STMICROELECTRONICS SRL
Italy
EU contribution
€ 594 141
Address
Via C.olivetti 2
20864 Agrate Brianza

See on map

Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Maria Grazia Podesta (Dr)
ALMA MATER STUDIORUM - UNIVERSITA DI BOLOGNA
Italy
EU contribution
€ 401 838
Address
Via Zamboni 33
40126 Bologna

See on map

Activity type
Higher or Secondary Education Establishments
Administrative Contact
Eleonora Medeot (Ms.)
UNIVERSITY OF GLASGOW
United Kingdom
EU contribution
€ 375 058
Address
University Avenue
G12 8QQ Glasgow

See on map

Activity type
Higher or Secondary Education Establishments
Administrative Contact
Joe Galloway (Mr.)
ARM LIMITED
United Kingdom
EU contribution
€ 440 138
Address
110 Fulbourn Road
CB1 9NJ Cambridge

See on map

Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Stephen Doel (Mr.)