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In industrial electronic equipment, demand for the integration of whole systems on a chip becomes greater every day. Deep submicron processes now allow hundreds of thousands of digital gates to be integrated on the same integrated circuit (IC). But this is not sufficient: the interface with the external world is analogue and high performance analogue-digital (AD) and digital-analogue (DA) converter macrocells available in the same deep submicron processes, are a real need. The term 'virtual component' is now preferred to 'macrocell' and normalized by the international organization VSIA. Under the NAOMI project, high performance analogue-to-digital converter (ADC) virtual components (VC) are being developed for two kinds of applications, corresponding to strong market trends: a high speed analogue-to-digital converter for telecommunications, compatible with the ANSI specifications and targeted to asymmetric digital subscriber line (ADSL) modems applications; a high resolution flexible ADC for data acquisition, measurement and instrumentation in the industrial field. The performances of the VCs are measured through test circuits fabricated in three processes: 0.5 um 0.35 um CMOS processes from Alcatel Mietec; and 0.35 um CMOS process from ATMEL-ES2. These VCs are developed with a multi-foundry portability methodology which permits them to be retargeted in any submicron 0.5 um or 0.35 um CMOS processes of any foundry, and in the near future in 0.25 um and below
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