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Content archived on 2024-05-14

Assessment of an excimer laser based tool to achieve perfect dry single step resist and polymer stripping for submicron technology

Objective

To evaluate the L-Stripper system to obtain:

Photoresist stripping results for the advanced processes of sub-micron technologies.

Cost of ownership figures for reference to other equipment.

Assessment of installation and equipment functionality for future improvements.

Assessment of yield improvement.

Removal of tough compounds which are formed during semiconductor wafer fabrication, is one of the tough challenges in photoresist stripping of sub half micron semiconductor wafers. The L-Stripper, a novel DUV-excimer laser based system, was developed by Oramir Ltd. to solve those demands. The fully automatic equipment comprises an industrial excimer laser, specially designed UV optics and a process chamber where the stripping process is achieved.
The L-Stripper will be evaluated for its capability to achieve perfect dry single step (no post dry strip wet processing) resist and polymer stripping on deep sub-micron 150 mm and 200 mm semiconductor wafers.
Expected results include single step dry photoresist stripping with reduction of cost of ownership (CoO), improved process yield and uptime.

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ACM - Preparatory, accompanying and support measures

Coordinator

FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG
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Leonrodstrasse 54
80636 MÜNCHEN
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