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Content archived on 2024-05-29

Photonic integrated circuits for ultrahigh speed reconfigurable data networking

Objective

Dramatic progress has recently been made in the development and convergence of communication and computing technologies. Increasing numbers of networked consumer goods and remote electronic services requiring instant bandwidth are adding a huge burden to existing electronic infrastructure.

While optical technologies are being deployed in increasingly diverse information systems, making a major impact on the use of Ethernet networks, switching and routing functions remain in the electronic domain.

This results in major bottlenecks, and while photonic integrated circuits have the promise to process ultrahigh speed data, stringent cost, power and space constraints have so far prevented deployment. TERABIT CHIPS provides a route map to high capacity active integrated photonic circuits using cutting edge fabrication solutions, advanced photonic design concepts, and sub-system architectures by exploiting parallel processing concepts.

While the size of photonic circuits may be constrained by the wavelength of light, interaction lengths for electro-optic phenomena and limits to lithography, exploiting parallelism through wavelength multiplexing within the photonic circuit is identified as a highly efficient way to unleash a potential multi-terabit capacity without prohibitive space, management or power overheads.

This work proposes the multi-wavelength components to realise such circuits. This proposal targets fast nanosecond reconfigurable routers for data traffic as the demonstration technology for prototyping high functionality high capacity integrated circuits.

The designs will be deployed to ensure near digital operation with minimal signal impairment. Prototypes will be fabricated and demonstrated for broadband loss-free transmission, and nanosecond scale network reconfiguration times. The technology will exploit cutting edge fabrication, being compatible with off the shelf hardware, linking in to existing physical layer standards.

Fields of science (EuroSciVoc)

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Keywords

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Topic(s)

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Call for proposal

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FP6-2004-MOBILITY-10
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Funding Scheme

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EXC - Marie Curie actions-Chairs

Coordinator

TECHNISCHE UNIVERSITEIT EINDHOVEN
EU contribution
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Total cost

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