Objective
To develop and evaluate 6"x 6" substrates for 0.35 um processing.
To develop and evaluate 7"x 7" substrates for 0.35 and 0.25 um processing taking into account material resistance to 248 nm excimer laser radiation damage.
To develop equipment and technology for large area substrates (9"x 9"), which includes process steps like melting, squaring, slicing, lapping, polishing and cleaning.
To develop large area substrate material which is resistant to radiation damage at
193 nm exposure wavelength (for 0.18 um technologies and beyond).
At present photomask substrates are produced by Japanese suppliers only, who also dominate the photomask blank market. LAPS aims to establish a European source of substrates and blanks, which meet the requirements of 193 nm excimer laser exposure, 0.18 um technology level, and 300 mm wafer size.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
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Call for proposal
Data not availableFunding Scheme
CSC - Cost-sharing contractsCoordinator
7745 Jena-Burgau
Germany