Objective
To develop a thin chip scale BGA package of medium ball count, with a grid pitch of 0.5 mm and a thickness of 1.4 mm
To fully characterise the developed BGA packages and make them available for reliability assessment, surface mounting on PCB and product validation.
To develop suitable systems for the handling and inspection of thin BGA packages.
To develop specific printed circuit board assembly techniques for the developed high density array packages.
To perform a thorough evaluation of the related plastic packaging enhanced reliability problems through advanced test vehicles and characterisation methods.
To qualify the developed thin chip scale BGA packages by product validation techniques using a selected telecom demonstrator circuit.
To monitor the cost-effectiveness of the developed BGA packages.
To issue guidelines for exploitation of the developed BGA packages in typical telecom system applications.
In the BATEL project plastic ball grid array (BGA) packages, which are currently the best choice with respect to high pincount, high density, high performance and SMT capabilities, will be developed to meet a number of stringent telecom application requirements, such as the need for thinner packages with high pincounts and reduced grid pitches.
Medium ballcount (+/- 200 balls) thin BGA's with a grid pitch down to 0.5 mm and a reduced profile down to 1.4 mm total thickness with chip scale potential will be developed. The developed BGA packages will be validated by means of an advanced GSM telecom demonstrator, processed in 0.35 um CMOS.
Fields of science (EuroSciVoc)
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
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Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
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Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
9700 Oudenaarde
Belgium
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.