Final Report Summary - PRIMAE (Packaging of futuRe Integrated ModulAr Electronics)
Executive Summary:
Project executive summary
Affordable transport for the citizen relies on innovative solutions and technologies that will result in lower costs and lead-time of the aircraft and its systems. In this area, the packaging of on-board computers is an important contributor.
The Packaging of future Integrated ModulAr Electronics (PRIMAE) objective is to develop a new flexible, robust and open aeronautical packaging for the next generation of electronics and particularly to Integrated Modular Avionics. This new concept after standardization will be able to replace the 35 year old existing standard.
PRIMAE technical objectives are:
- Reduce electronics packaging in terms of volume and weight and offer flexibility and growth capability
- Reduce costs using market standard components
- Enhance reliability through thermal and vibratory breakthrough
- Mitigate EMC protection penalties in composite fuselage environment
- Ensure fast production ramp up and support rapid final assembly on aircraft
- Improve availability and reduce maintenance cost.
In these domains significant technological studies, beyond the state of the art (cooling, lightweight composite materials, electromagnetic interferences, power supply, connectivity), have been carried out in respect to airworthiness regulations.This project grouping together the major European aerospace players has been a unique opportunity to define common requirements and propose solutions in the complex and multidomain field of equipment packaging for the future aerospace equipment. The results are positive and several above the state of the art technologies have been successfully implemented (New cooling technologies, direct aircraft connectivity, modular versatile connectors, and composite lightweight structures):
• Three racks versions have been developed during the PRIMAE project. These racks families share the same blades and have been designed for different functions and environments.
• Two Modular connectors have been produced; these connectors propose direct aircraft connectivity and are compatibles for the PRIMAE racks.
• New advanced cooling techniques have been developed and tested positively, these technique are capable of hot spot up to 30 w and 100 w for total power dissipation.
• A composite version of CPC rack has been developed and has demonstrated the feasibility of a weight reduction of minimum 30%, new shielding technique have been implemented.
• A market standard form factor has been proposed for the blades: called “6U”, with standardized interfaces.
• A centralized smart power-supply has been developed in the PRIMAE project and shielding recommendations have been produced, as well as new shielding effectiveness measurement methods.
The concept after harmonization among the project partners has been proposed as a draft standard (ASD-STAN) for the future generation of large and regional aircraft, and helicopters.
The new packaging concept strengthens competitiveness of the market and supports the effort of industrial avionics suppliers to improve costs and environmental impacts.
Project Context and Objectives:
The overall objective of the PRIMAE project is to develop a robust open worldwide packaging standard able to replace the current ARINC 600 standard.
The PRIMAE concept approach is “Modular Integrated Packaging” (MIP) offering the same standard in the form of a mechanical packaging toolbox able to support the following functional modules:
• High power: core processing, mass memory, video, graphics, power supply…
• Low power: remote core processing, network switches…
• I/O intensive: Input /Output data concentrator and gateway
• High emissive: Radio frequency, power supply
With versatile technologies including air & liquid cooling solutions to support large and regional aircraft needs. The packaging will have to fulfill the multi-domain requirements resulting from the breakthrough of new requirements from embedded electronics including Integrated Modular Electronics of 2nd Generation (IMA2G concepts include high electronic integration, optical physical layer, distributed architecture). These multi-level objectives are:
High-level needs:
Minimum weight, volume and cost, Technology transparency (obsolescence), Interchange-ability, Manufacturability, Modularity/configurability, Re-usability, Growth Capability, Maintainability, Fault Tolerance
PRIMAE technical objectives: The quantified objectives are
• Improved integration capabilities in term of Volume (50%), Weight (30% by use of innovative structure combined with composite shielded materials)
• Compatibility with standard electronic boards & components (e.g. new high speed CPU) to reduce costs (20%)
• Enhanced thermal management to reduce the junction temperature (10 °C) which leads to an improvement of reliability of 50%
• Reduced component failures by limiting the vibration levels (reduction of sensibility factor of 30%) and improvement of locking and damping mechanisms
• Limit EMI (Electro Magnetic Interference) constraint of the new carbon composite fuselage on electronics and connectors (at least equivalent to current technologies)
• Ensure fast production ramp up and fast assembly line production thanks to higher pre integration, test simplicity and health monitoring
• Improve availability and reduce maintenance cost
• Improved modularity by improving the form factor and connection capabilities
PRIMAE Scientific objectives correspond to domains where significant research and studies have to be performed before making any decision on standardization, these fields are:
• The identification and evaluation of new cooling techniques capable of providing a solution to the heat dissipation problems raised by the introduction of the latest processors and dissipative components. The module average heat dissipation should increase from 20W to more than 60W for the next generation IMA2G Line Replaceable Module (LRM) and more importantly the local hot spot and heat density generated should increase from 10W/cm² to >30W/cm² (chip level). These values of heat dissipation and heat densities are no longer compatible with the existing cooling system, and with the requirement of LOC (Loss of Cooling) conditions, i.e. maintain operational conditions at 55° during 30min. The cooling efficiency shall be compliant with the use of components available in the industrial and automotive industries.
• The mechanical optimization of the racks and LRM in terms of integration as well as weight reduction, here, the use of composite materials will be investigated. These materials are already widely used in aircraft structures but the specific requirements of electronic housings do not permit a simple transition of these techniques. This is mainly due to electromagnetic shielding, and the electrical continuity, which has to be maintained between any two points of the structure (10 m under 10 Amp). All these characteristics have to be achieved with very thin walled structures (1.5 to 2mm thick) with enough stiffness to prevent vibrations in the operational range of aircraft mechanical frequencies.
• EMC: Due to the proposed modification of the module layout within the avionics bays and the properties of the material composing the structure of both aircraft and the bay itself, minimization of the Electromagnetic Coupling effects is critical in order to prevent electromagnetic cross contamination between modules. Both radiated and conducted aspects of EMC require close examination in this new environment. Three aspects of EMC shielding will be considered:
- External shielding of the rack in case of composite materials
- Intra bay and inter module shielding
- Incremental qualification of cabinet based on standard definition
Project Results:
Main S&T results : see Attachment 1: Main S&T results
Potential Impact:
Exploitation of results : see Attachment 2: Synthesis and Exploitation
Dissemination activities are :
The website (WWW.primae.org) attracted interest and was visited more than 1000 times per month of it highest rate.
PRIMAE presentations thought conferences and work-shops:
PRIMAE EEAG meeting, Valence, (March 29-30, 2012)
IHPC, Lyon, (May, 2012) International Heat Pipe Conference
IHPC, Kanpur, (October, 2013) International Heat Pipe Conference
AEEC (SAI) Subcommittee meeting, Frankfurt, (June 27-28, 2012) Systems Architecture and Interfaces
IMAPS, 8th European Advanced Technology Workshop on micro packaging and Thermal management (La Rochelle - 6, 7 February 2013)
“Entretiens de Toulouse” (23, 24 april 2013) Equipment packaging: the need for radical changes (Thales)
IMAPS, 9th European Advanced Technology Workshop on micro packaging and Thermal management (La Rochelle - 6, 7 February 2014)
Publication
R. Hodot, , C. Sarno, B. TRUFFART, Vincent POMME, J. Coulloux, C. Zilio, S. MANCIN, Electronic cooling for avionics using loop heat pipes and mini-Vapour Cycle Systems, IMAPS, La Rochelle, France, February 4-5, 2015
R. Hodot, V. Sartre, J. Coulloux, C. Sarno Electornic cooling for avionics using loop heat pipe with cylindrical evaporator, IMAPS, La Rochelle, France, February 6-7, 2014
S. Safouene, T. Barreteau, V. Sartre, R. Hodot, Experimental comparison of loop heat pipes performance with various evaporator designs, 17th International Heat Pipe Conference, Kanpur, India, October 13-17, 2013, 6 p.
R. Hodot, V. Sartre, F. Lefevre, C. Sarno, 3D modeling and optimization of a loop heat pipe evaporator,17th International Heat Pipe Conference, Kanpur, India, October 13-17, 2013, 6 p.
R. Hodot, Loop heat pipes for the thermal management of hot spots in future electronic equipments, IMAPS, La Rochelle, France, February 6-7, 2013
C. Sarno, C. Tantolin, R. Hodot, Y. Maydanik, S. Vershinin, Loop Thermosyphons for the thermal management of an aircraft electronic box, 16th International Heat Pipe Conference, Lyon, France, May 20-24, 2012, 6 p.
List of Websites:
WWW.PRIMAE.ORG
Project executive summary
Affordable transport for the citizen relies on innovative solutions and technologies that will result in lower costs and lead-time of the aircraft and its systems. In this area, the packaging of on-board computers is an important contributor.
The Packaging of future Integrated ModulAr Electronics (PRIMAE) objective is to develop a new flexible, robust and open aeronautical packaging for the next generation of electronics and particularly to Integrated Modular Avionics. This new concept after standardization will be able to replace the 35 year old existing standard.
PRIMAE technical objectives are:
- Reduce electronics packaging in terms of volume and weight and offer flexibility and growth capability
- Reduce costs using market standard components
- Enhance reliability through thermal and vibratory breakthrough
- Mitigate EMC protection penalties in composite fuselage environment
- Ensure fast production ramp up and support rapid final assembly on aircraft
- Improve availability and reduce maintenance cost.
In these domains significant technological studies, beyond the state of the art (cooling, lightweight composite materials, electromagnetic interferences, power supply, connectivity), have been carried out in respect to airworthiness regulations.This project grouping together the major European aerospace players has been a unique opportunity to define common requirements and propose solutions in the complex and multidomain field of equipment packaging for the future aerospace equipment. The results are positive and several above the state of the art technologies have been successfully implemented (New cooling technologies, direct aircraft connectivity, modular versatile connectors, and composite lightweight structures):
• Three racks versions have been developed during the PRIMAE project. These racks families share the same blades and have been designed for different functions and environments.
• Two Modular connectors have been produced; these connectors propose direct aircraft connectivity and are compatibles for the PRIMAE racks.
• New advanced cooling techniques have been developed and tested positively, these technique are capable of hot spot up to 30 w and 100 w for total power dissipation.
• A composite version of CPC rack has been developed and has demonstrated the feasibility of a weight reduction of minimum 30%, new shielding technique have been implemented.
• A market standard form factor has been proposed for the blades: called “6U”, with standardized interfaces.
• A centralized smart power-supply has been developed in the PRIMAE project and shielding recommendations have been produced, as well as new shielding effectiveness measurement methods.
The concept after harmonization among the project partners has been proposed as a draft standard (ASD-STAN) for the future generation of large and regional aircraft, and helicopters.
The new packaging concept strengthens competitiveness of the market and supports the effort of industrial avionics suppliers to improve costs and environmental impacts.
Project Context and Objectives:
The overall objective of the PRIMAE project is to develop a robust open worldwide packaging standard able to replace the current ARINC 600 standard.
The PRIMAE concept approach is “Modular Integrated Packaging” (MIP) offering the same standard in the form of a mechanical packaging toolbox able to support the following functional modules:
• High power: core processing, mass memory, video, graphics, power supply…
• Low power: remote core processing, network switches…
• I/O intensive: Input /Output data concentrator and gateway
• High emissive: Radio frequency, power supply
With versatile technologies including air & liquid cooling solutions to support large and regional aircraft needs. The packaging will have to fulfill the multi-domain requirements resulting from the breakthrough of new requirements from embedded electronics including Integrated Modular Electronics of 2nd Generation (IMA2G concepts include high electronic integration, optical physical layer, distributed architecture). These multi-level objectives are:
High-level needs:
Minimum weight, volume and cost, Technology transparency (obsolescence), Interchange-ability, Manufacturability, Modularity/configurability, Re-usability, Growth Capability, Maintainability, Fault Tolerance
PRIMAE technical objectives: The quantified objectives are
• Improved integration capabilities in term of Volume (50%), Weight (30% by use of innovative structure combined with composite shielded materials)
• Compatibility with standard electronic boards & components (e.g. new high speed CPU) to reduce costs (20%)
• Enhanced thermal management to reduce the junction temperature (10 °C) which leads to an improvement of reliability of 50%
• Reduced component failures by limiting the vibration levels (reduction of sensibility factor of 30%) and improvement of locking and damping mechanisms
• Limit EMI (Electro Magnetic Interference) constraint of the new carbon composite fuselage on electronics and connectors (at least equivalent to current technologies)
• Ensure fast production ramp up and fast assembly line production thanks to higher pre integration, test simplicity and health monitoring
• Improve availability and reduce maintenance cost
• Improved modularity by improving the form factor and connection capabilities
PRIMAE Scientific objectives correspond to domains where significant research and studies have to be performed before making any decision on standardization, these fields are:
• The identification and evaluation of new cooling techniques capable of providing a solution to the heat dissipation problems raised by the introduction of the latest processors and dissipative components. The module average heat dissipation should increase from 20W to more than 60W for the next generation IMA2G Line Replaceable Module (LRM) and more importantly the local hot spot and heat density generated should increase from 10W/cm² to >30W/cm² (chip level). These values of heat dissipation and heat densities are no longer compatible with the existing cooling system, and with the requirement of LOC (Loss of Cooling) conditions, i.e. maintain operational conditions at 55° during 30min. The cooling efficiency shall be compliant with the use of components available in the industrial and automotive industries.
• The mechanical optimization of the racks and LRM in terms of integration as well as weight reduction, here, the use of composite materials will be investigated. These materials are already widely used in aircraft structures but the specific requirements of electronic housings do not permit a simple transition of these techniques. This is mainly due to electromagnetic shielding, and the electrical continuity, which has to be maintained between any two points of the structure (10 m under 10 Amp). All these characteristics have to be achieved with very thin walled structures (1.5 to 2mm thick) with enough stiffness to prevent vibrations in the operational range of aircraft mechanical frequencies.
• EMC: Due to the proposed modification of the module layout within the avionics bays and the properties of the material composing the structure of both aircraft and the bay itself, minimization of the Electromagnetic Coupling effects is critical in order to prevent electromagnetic cross contamination between modules. Both radiated and conducted aspects of EMC require close examination in this new environment. Three aspects of EMC shielding will be considered:
- External shielding of the rack in case of composite materials
- Intra bay and inter module shielding
- Incremental qualification of cabinet based on standard definition
Project Results:
Main S&T results : see Attachment 1: Main S&T results
Potential Impact:
Exploitation of results : see Attachment 2: Synthesis and Exploitation
Dissemination activities are :
The website (WWW.primae.org) attracted interest and was visited more than 1000 times per month of it highest rate.
PRIMAE presentations thought conferences and work-shops:
PRIMAE EEAG meeting, Valence, (March 29-30, 2012)
IHPC, Lyon, (May, 2012) International Heat Pipe Conference
IHPC, Kanpur, (October, 2013) International Heat Pipe Conference
AEEC (SAI) Subcommittee meeting, Frankfurt, (June 27-28, 2012) Systems Architecture and Interfaces
IMAPS, 8th European Advanced Technology Workshop on micro packaging and Thermal management (La Rochelle - 6, 7 February 2013)
“Entretiens de Toulouse” (23, 24 april 2013) Equipment packaging: the need for radical changes (Thales)
IMAPS, 9th European Advanced Technology Workshop on micro packaging and Thermal management (La Rochelle - 6, 7 February 2014)
Publication
R. Hodot, , C. Sarno, B. TRUFFART, Vincent POMME, J. Coulloux, C. Zilio, S. MANCIN, Electronic cooling for avionics using loop heat pipes and mini-Vapour Cycle Systems, IMAPS, La Rochelle, France, February 4-5, 2015
R. Hodot, V. Sartre, J. Coulloux, C. Sarno Electornic cooling for avionics using loop heat pipe with cylindrical evaporator, IMAPS, La Rochelle, France, February 6-7, 2014
S. Safouene, T. Barreteau, V. Sartre, R. Hodot, Experimental comparison of loop heat pipes performance with various evaporator designs, 17th International Heat Pipe Conference, Kanpur, India, October 13-17, 2013, 6 p.
R. Hodot, V. Sartre, F. Lefevre, C. Sarno, 3D modeling and optimization of a loop heat pipe evaporator,17th International Heat Pipe Conference, Kanpur, India, October 13-17, 2013, 6 p.
R. Hodot, Loop heat pipes for the thermal management of hot spots in future electronic equipments, IMAPS, La Rochelle, France, February 6-7, 2013
C. Sarno, C. Tantolin, R. Hodot, Y. Maydanik, S. Vershinin, Loop Thermosyphons for the thermal management of an aircraft electronic box, 16th International Heat Pipe Conference, Lyon, France, May 20-24, 2012, 6 p.
List of Websites:
WWW.PRIMAE.ORG
