Objective
This Project aims to support Rolls Royce in the design of a of high temperature flexible PCB and through trials of flexible laminates manufactured from existing and brand new advanced polymers progress the temperature at which a flexible printed circuit can operate from the current state of the art maximum of 200°C into the desired range of 260°C (minimum) up to 400°C (target).
The Project also aims to develop the materials and manufacturing processes that enable this high temperature performance in a large format, such that the required overall length of 5m can be implemented in a single piece multilayer printed circuit, without joints.
Validation to TRL6 is to be achieved through coupon tests on representative hardware in a bespoke environmental chamber, subjecting the coupons to combined heat and random vibration loading, supported by full size PCBs integrated and tested at engine level.
Fields of science
Call for proposal
SP1-JTI-CS-2011-01
See other projects for this call
Funding Scheme
JTI-CS - Joint Technology Initiatives - Clean SkyCoordinator
GL20 8NB TEWKESBURY
United Kingdom