Final Report Summary - KTTM-OPPUP (Key Technologies of Thermal Management – Optimisation of heat transfer performance and manufacturing process of ultra-thinned sintered heat pipes)
1.1 Summary overview of results
All the tasks in the project have been achieved and the research results satisfied the original objectives of the project. On the aspect of finished tasks, it included advanced research on the manufacturing and testing process of ultra-thin heat pipes, development of wick structures inside ultra-thin heat pipes and performance testing rig, Observation, theoretical & experimental analysis and simulation on wick structures and ultra-thin heat pipes. On the aspect of publications, it included two published SCI Journal papers, one accepted SCI journal paper and three submitted journal papers. There are two abstract submissions to heat transfer/heat pipe conferences as shown in Fig.3 and Fig.4.
One stand-alone publishable report for the REA or the Commission.
1.2 Potential impact
According to the test and application from the Chinese Company (Guangdong Newidea Technology Co.LTD) the ultra-thin heat pipe with thickness of 2.45mm or 2.0mm can be used to cool the LED headlight in Vehicles as shown in the Fig.1 (attached file), which has been proved to dissipate waste heat from power LEDs efficiently. The ultra-thin heat pipe with thickness 0.6mm and 1.0mm could be used in smartphones as show in the Fig.2 which is in experimental progress.
1.3 Socio-economic impact
The ultra-thin heat pipes are expected to apply worldwide on the LED headlight bulbs and smartphones up to billions pieces per year and gain capital value of millions US dollars per year. According to the test on the effect of energy saving, energy consumption in the LED headlights of vehicles can reduce up to 50% compared with normal headlight lamps.
1.4 Real applications
There is a real application of ultra-thin heat pipes during these two years. The company named Guangdong Newidea technology Co. LTD has applied the manufacturing technology of the project to make the ultra-thin heat pipes, and these heat pipes have been used in LED headlights to dissipate waste heat.
1.5 Journal papers
Two journal papers have been published and one journal paper is in press in these two years as shown in section 3 and three manuscripts had been submitted as shown in section 2. There are two abstract submissions to heat transfer/heat pipe conferences as shown in Fig.3 and Fig.4. There is also one publishable report attached here for stand-alone publication by the REA or the Commission.
1.6 Relevant target groups
The research related to several target groups as follows:
(1) Guangdong Newidea Technology Co. Ltd contributed on the production of ultra-thin heat pipes;
(2) Zhongshan Easter Optoelectronics Co., Ltd contributed on the test and production of LED headlights with ultra-thin heat pipes;
(3) Attended many seminars or conferences held in UK on heat transfer.
1.7 Project website
We are now trying to establish a website to show the contribution of this project and promote the technology on thermal management of electronical devices. The main objective is to create a better thermal management system with energy-saving and high efficiency for smartphones and LED bulbs.
All the tasks in the project have been achieved and the research results satisfied the original objectives of the project. On the aspect of finished tasks, it included advanced research on the manufacturing and testing process of ultra-thin heat pipes, development of wick structures inside ultra-thin heat pipes and performance testing rig, Observation, theoretical & experimental analysis and simulation on wick structures and ultra-thin heat pipes. On the aspect of publications, it included two published SCI Journal papers, one accepted SCI journal paper and three submitted journal papers. There are two abstract submissions to heat transfer/heat pipe conferences as shown in Fig.3 and Fig.4.
One stand-alone publishable report for the REA or the Commission.
1.2 Potential impact
According to the test and application from the Chinese Company (Guangdong Newidea Technology Co.LTD) the ultra-thin heat pipe with thickness of 2.45mm or 2.0mm can be used to cool the LED headlight in Vehicles as shown in the Fig.1 (attached file), which has been proved to dissipate waste heat from power LEDs efficiently. The ultra-thin heat pipe with thickness 0.6mm and 1.0mm could be used in smartphones as show in the Fig.2 which is in experimental progress.
1.3 Socio-economic impact
The ultra-thin heat pipes are expected to apply worldwide on the LED headlight bulbs and smartphones up to billions pieces per year and gain capital value of millions US dollars per year. According to the test on the effect of energy saving, energy consumption in the LED headlights of vehicles can reduce up to 50% compared with normal headlight lamps.
1.4 Real applications
There is a real application of ultra-thin heat pipes during these two years. The company named Guangdong Newidea technology Co. LTD has applied the manufacturing technology of the project to make the ultra-thin heat pipes, and these heat pipes have been used in LED headlights to dissipate waste heat.
1.5 Journal papers
Two journal papers have been published and one journal paper is in press in these two years as shown in section 3 and three manuscripts had been submitted as shown in section 2. There are two abstract submissions to heat transfer/heat pipe conferences as shown in Fig.3 and Fig.4. There is also one publishable report attached here for stand-alone publication by the REA or the Commission.
1.6 Relevant target groups
The research related to several target groups as follows:
(1) Guangdong Newidea Technology Co. Ltd contributed on the production of ultra-thin heat pipes;
(2) Zhongshan Easter Optoelectronics Co., Ltd contributed on the test and production of LED headlights with ultra-thin heat pipes;
(3) Attended many seminars or conferences held in UK on heat transfer.
1.7 Project website
We are now trying to establish a website to show the contribution of this project and promote the technology on thermal management of electronical devices. The main objective is to create a better thermal management system with energy-saving and high efficiency for smartphones and LED bulbs.