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Content archived on 2022-11-15

CMOS tri-dimensional technology for the set up of integrated networks and high density semiconductors

Objective

The project will enhance the RTD capabilities of the participating firms and university. It will lend to the introduction of new products.

Development of CMOS tri-dimensional technologies for the set up of integrated networks and high density semiconductors; the project involves productive applications in dynamic memory (DRAM) of 4 Mbit and its derivatives.

Call for proposal

Data not available

Funding Scheme

Data not available

Coordinator

Consorzio Eagle
EU contribution
No data
Address
Via Cavour 96
67051 Avezzano L'Aquila
Italy

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Total cost
No data