This research proposal is about Extreme Ultra Violet Lithography (EUVL), the next generation technology chosen by the electronics industry to manufacture integrated circuits in 2010 and beyond. It represents an opportunity to boost the intensive efforts made by industry to reach new standards in lithography and achieve European leadership in the highly competitive sector of electronics manufacturing technology and know-how. The Integrated Project more Moore will involve various large and small manufacturing companies and research institutes or universities, all highly specialised in the key domains of EUVL and at the vanguard of European lithography research and development. Under the co-ordination of a leading European manufacturer of chip making equipment, the consortium constitutes a unique platform to integrate expertise in key branches of lithography, and to produce breakthrough technological solutions. The project will develop, ahead of the ITRS international roadmap (described in the main report), semiconductor devices shrunk by an order of magnitude down to the 5-nm size. The essential elements of the "More Moore" integrated research project can be summarised as follows:
- More Moore will build upon and complement the work done in EUVL under National and EUREKA programmes, especially MEDEA+;
- The research will push the limits of lithography to enable and exceed the requirements for the 22 nm node;
- As an Integrated Project, it will extend the RandD network in this domain by including all capable institutes, universities and SME's.
Funding SchemeIP - Integrated Project
142092 Troisk, Moscow Region
3430 BE Nieuwegein