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Content archived on 2024-05-29

Development of comprehensive in-line quality control system for printed circuit board assemblies (MICROSCAN)

Objective

Microscan will produce a powerful tool in the total quality control of PCB assemblies, which can also reduce the cost of the manufacturing process and will provide an impetus to the PCB industry in Europe. It will greatly improve the employment prospects of the region as well as improving the quality of life, initially for Europe but then worldwide. In addition to the above this project will aid in the introduction of Lead free solder by developing the NDT techniques on a selection of lead free samples an d provide genuine environmental benefits. European Parliament Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment and Directive 2002/96EC on waste electrical and electronic equipment. T he project will complete this by developing a Non-Destructive system, which can provide full coverage of all defects in PCB manufacturing. Assembled PCBs can suffer from many defects. It is highly beneficial for these defects to be detected at the product ion stage, as failure in the field can result in massive financial costs tor the manufacturer which is then passed on to the consumer. There is no existing non-destructive testing (NDT) system, which incorporates all of the available techniques to form an integrated in-line quality control system. This gap in the market means that flaws will be missed and adds to the financial burden of the manufacturers and the whole European community. There are currently specific limitations to the NDT techniques and e quipment, which prevent them being combined in an integrated system, which can be operated in-line. The Microscan project will overcome the current limitations and develop new techniques for X-ray detection, develop novel improvements for AOI and innovati ve and novel acoustic and thermal techniques. It is intended that the developed systems will be combined with a PCB assembly system to produce new in-line inspections, providing full quality control of PCB assemblies.

Fields of science (EuroSciVoc)

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Keywords

Project’s keywords as indicated by the project coordinator. Not to be confused with the EuroSciVoc taxonomy (Fields of science)

Topic(s)

Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.

Call for proposal

Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.

FP6-2002-SME-1
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Funding Scheme

Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.

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Coordinator

X-TEK SYSTEMS LTD
EU contribution
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Address
64-66 Akeman Street
TRING. HERTFORDSHIRE
United Kingdom

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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

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Participants (11)

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