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Eco-efficient designs for end-of-life, anti-counterfeit electronic device recovery

Objective

Technological Objectives: Produce a water-soluble thermoplastic having a dissolution trigger of 70C. Develop the over moulding process. Achieve a chip over-moulding cycle time of 12 seconds without damaging circuit integrity. Achieve a compatbilised water-soluble polymer chemistry capable of an engineering polymer peel strength >2N/mm2. Develop 2nd stage over-moulding technology to leave a window of no more than 80% of the encapsulated chip projected area exposed for end of life dissolution. Achieve performance and physical objectives at no more than 5% on-cost of a traditional single material product. The economic objectives to improve competitiveness: Provide a cost-effective recycling route for combined electro-polymeric product by improved product design and process technology that adds no more than 5% to the cost of the product. Provide a manufacturing solution for the financial burden that the introduction of the WEEE Directive.

Call for proposal

FP6-2002-SME-1
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Coordinator

HASWELL MOULDING TECHNOLOGIES LIMITED
EU contribution
No data
Address
Butt Cozens, Town Wall House, Balkerne Hill
COLCHESTER, ESSEX
United Kingdom

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Total cost
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Participants (7)