Objective
Technological Objectives: Produce a water-soluble thermoplastic having a dissolution trigger of 70C. Develop the over moulding process. Achieve a chip over-moulding cycle time of 12 seconds without damaging circuit integrity. Achieve a compatbilised water-soluble polymer chemistry capable of an engineering polymer peel strength >2N/mm2. Develop 2nd stage over-moulding technology to leave a window of no more than 80% of the encapsulated chip projected area exposed for end of life dissolution. Achieve performance and physical objectives at no more than 5% on-cost of a traditional single material product. The economic objectives to improve competitiveness: Provide a cost-effective recycling route for combined electro-polymeric product by improved product design and process technology that adds no more than 5% to the cost of the product. Provide a manufacturing solution for the financial burden that the introduction of the WEEE Directive.
Fields of science
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
- engineering and technologymechanical engineeringmanufacturing engineering
- engineering and technologyenvironmental engineeringwaste managementwaste treatment processesrecycling
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsoptical sensors
- natural scienceschemical sciencespolymer sciences
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsmobile phones
Call for proposal
FP6-2002-SME-1
See other projects for this call
Funding Scheme
Cooperative - SMEs-Co-operative research contractsCoordinator
COLCHESTER, ESSEX
United Kingdom