Thermoplastically deformable circuits for embedded randomly shaped electronics

Project Information

TERASEL

Grant agreement ID: 611439

Closed project

Start date 1 October 2013

End date 30 September 2016

Funded under

• Specific Programme "Cooperation": Information and communication technologies

Total cost € 7 358 915,00

EU contribution € 5 000 000,00

Coordinated by

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium