The objective of IBCAR is to select materials suitable for burying capacitors and resistors in low-temperature cofired ceramic (LTCC) tape substrate, and to develop the appropriate processes for the eventual large-volume production of multichip modules containing these buried components.
Materials suitable for burying capacitors and resistors in low temperature cofired ceramic (LTCC) tape substrate have been investigated and the appropriate processes for the eventual large volume production of multichip modules containing these buried components have been examined.
Devices with surface mounted components have been manufactured to give the user partners experience of using the substrate and provide reference cost/performance models (it has hitherto proved very difficult to make ceramic multilayer circuits in a cost effective manner). Demonstrator modules with surface mounted components have been manufactured on LTCC substrate by user partners. Preliminary characterization (electrical and environmental) is satisfactory. Cost/performance models have been developed. In parallel, comparison has been made with current technologies.
The first measurements on test vehicles, using a new manufacturing process for buried capacities layers, is underway, and have given very promising results proving the validity of the concept. Design and lay outs of modules are nearly complete.
IBCAR technology will be developed in three phases. In phase 1, devices with surface-mounted components will be manufactured to give the user partners experience of using the substrate and provide reference cost/performance models (it has hitherto proved very difficult to make ceramic multilayer circuits in a cost-effective manner). Phase 2 will develop prototype modules containing buried capacitors, and phase 3 will produce modules with buried capacitors and resistors.
The IBCAR project involves users with specific requirements for prototype substrates who will test the resulting prototypes in a range of realistic applications in the automotive and telecommunications domains, where the environments are hostile and/or reliability and/or cost a key issue. The electrical, thermal and mechanical properties of the prototypes will be fully characterised, enabling the preparation of a handbook to specify the technology and thus facilitate the design of new applications.
Exploitation will take several forms, ranging from the sale of basic materials to the availability and sale of more compact, more reliable and less expensive electronic modules for use in the manufacture of automotive and telecommunications products.
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