Periodic Reporting for period 1 - PAMPA (Plastic Components for Advanced Microwave Equipment of New Generation SatCom PAyloads)
Reporting period: 2015-01-01 to 2017-09-30
In addition, the microwave integrated circuits-MMIC- in plastic package developed in the project with a European supply chain have passed all the reliability tests at component level. This includes construction analysis, thermal cycling, life test and a test specific to non- hermetic components, 1000h in Temperature (85°C), Humidity (85 % RH) and Bias condition. This accelerated test is performed to make sure that components will not be damaged by humidity before the launch of the satellite, as satellite electronic hardware can stay on Earth up to 3 years before launch.
Through the project, a European supply chain for plastic QFN (Quad Flat No lead) components is proposed. A TRL 6, demonstration of critical function in relevant environment, has been reached for the two MMIC references in plastic package evaluated. These are essential results to promote this technology as an alternative to hermetic packaging for hardware of GEO satellites.
Looking at the impact of project results, the mass improvement on a CAMP unit with PAMPA technology is of 30% compared to current generation, which directly translates in savings for satellite launching. This is a key advantage, in addition to the gain in cost and lead time. Project conclusions are very beneficial for the competitiveness of European Space industry.