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Plastic Components for Advanced Microwave Equipment of New Generation SatCom PAyloads

Objective

Plastic packaging solutions are foreseen as a good candidate to drastically reduce the cost of microwave equipment for future telecom satellite payloads. The objective of PAMPA project is to develop a plastic component technology, from the supply of the packaged microwave component with a reliability level compatible with space constraints up to its assembly on board using SMT (Surface Mount Technology) process. In order to demonstrate the potential of such technology, a flexible, digitally controlled microwave chain, representative of the need for new generation telecom satellite payloads, will be implemented on printed circuit board. Such technologies are particularly appealing for flexible microwave equipment, as the ASIC (Application Specific Integrated Circuit) and the microwave components can be assembled on board using the same SMT process. Furthermore, the use of a multilayer printed circuit board for the microwave chain is convenient for the implementation of dense DC routing of the command signals.
To achieve the objective, the consortium gathers a manufacturer of satellite equipment, a Monolithic Microwave Integrated Circuit (MMIC) foundry, an industrial specialized in SMT manufacturing process and an academic partner with valuable knowledge in reliability of microelectronics packaging. It should be outlined that the MMIC foundry involved in the project is a dual foundry as it provides both plastic packaged components for the Automotive market in QFN (Quad-Flat No-leads) housings and bare MMIC with a Space grade quality.
The main challenge will be to successfully spin-in a plastic technology coming from another harsh environment market that has drastic cost concerns, the Automotive, to the Space domain.

Field of science

  • /engineering and technology/mechanical engineering/vehicle engineering/automotive engineering
  • /engineering and technology/mechanical engineering/vehicle engineering/aerospace engineering/satellite technology

Call for proposal

H2020-COMPET-2014
See other projects for this call

Funding Scheme

RIA - Research and Innovation action

Coordinator

THALES ALENIA SPACE FRANCE SAS
Address
Avenue Jean Francois Champollion 26
31100 Toulouse
France
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
EU contribution
€ 343 562,50

Participants (4)

IKOR TECHNOLOGY CENTER,S.L.
Spain
EU contribution
€ 187 653,14
Address
C/fco Grandmontagne 4
20018 San Sebastian
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium
EU contribution
€ 195 401,25
Address
Kapeldreef 75
3001 Leuven
Activity type
Research Organisations
UNITED MONOLITHIC SEMICONDUCTORS SAS
France
EU contribution
€ 120 010
Address
Av Du Quebec 10 Batiment Charmille Parc Silic De Villebon Courtaboeuf
91140 Villebon Sur Yvette
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
SENCIO BV
Netherlands
EU contribution
€ 190 000
Address
Transistorweg 7
6534 AT Nijmegen
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)