In this project new ceramic materials and processing methods were utilised to develop basic components for electronics, which can be fabricated at 20-120 C temperatures. Such low temperatures allows direct integration of ceramics with polymer substrates and significant energy savings. Ceramic capacitors and inductors were realised onto polymer substrates by 3D printing. Ceramic antenna with double curved surfaces was also realised with ceramic material processed at 20 C and then dried at 120 C. Furthermore, ceramic multimaterial and multilayer structures with internal electrodes were realised to demonstrate possibility for complex material systems. The results show that high performance materials and components can be obtained even with much lower processing temperatures than typically used in fabrication of traditional electroceramics.
Possible energy savings were calculated utilising new materials and methods. In the concervative estimates 16-31 times less energy would be consumed during the fabrication of the components compared to traditional ceramic counterparts. Moreover, emissions during the fabrication are only water vapor instead of e.g. VOCs and NOx released in the burning of plastics. Thus new materials and processes provide great commercial potential and environmental impacts towards more “green” electronics.
