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Directly Modulated Lasers on Silicon

Objective

DIMENSION establishes a truly integrated electro-optical platform, extending the silicon (Bi)CMOS and silicon photonics platform with III-V photonic functionality. The III-V integration concept is fully CMOS compatible and offers fundamental advantages compared to state-of-the art integration approaches. After bonding and growing ultra-thin III-V structures onto the silicon front-end-of-line, the active optical functions are embedded into the back-end of line stack. This offers great opportunities for new innovative devices and functions at the chip-level but also for the assembly of such silicon devices. As processing takes place on silicon wafers, this project has the unique opportunity to bring the cost of integrated devices, with CMOS, photonic and III-V functionality, down to the cost of silicon volume manufacturing. Such a platform has the potential to allow Europe to take a leading position in the field of high functionality integrated photonics. Moreover, the project demonstrators adhere to standards such as IEEE802.3, 25G optical components and low-power electronics, thus opening a viable route towards ultra-low-cost high-performance optical transceivers for a new era of data centres and cloud systems. DIMENSION will realise three demonstrators:
• A short-reach transmitter for intra-datacenter operation addressing the 400 GbE-LR8 (IEEE 802.3bs) standard making use of an array of directly modulated lasers, pulse-amplitude-modulation (PAM4) techniques and 8 wavelength channels in the telecom O-band.
• A medium-reach transmitter for inter-datacenter applications beyond the 400 GbE-LR8 (IEEE 802.3bs) standard by providing a tuneable coherent transmitter for inter-datacenter and metro applications for link lengths in excess of 10km using a modulator integrated on the same chip.
• A novel laser directly grown on silicon photonics, operated at 25Gb/s in the telecom O-band demonstrating the significant cost-saving potential of the technologies pursued in DIMENSION.

Field of science

  • /natural sciences/chemical sciences/inorganic chemistry/inorganic compounds
  • /natural sciences/physical sciences/optics/laser physics

Call for proposal

H2020-ICT-2015
See other projects for this call

Funding Scheme

RIA - Research and Innovation action

Coordinator

TECHNISCHE UNIVERSITAET DRESDEN
Address
Helmholtzstrasse 10
01069 Dresden
Germany
Activity type
Higher or Secondary Education Establishments
EU contribution
€ 705 500

Participants (5)

IBM RESEARCH GMBH
Switzerland
EU contribution
€ 0
Address
Saeumerstrasse 4
8803 Rueschlikon
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
ADVA OPTICAL NETWORKING SE
Germany
EU contribution
€ 522 500
Address
Maerzenquelle 1-3
98617 Meiningen
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK
Germany
EU contribution
€ 800 633,75
Address
Im Technologiepark 25
15236 Frankfurt Oder
Activity type
Other
RESEARCH AND EDUCATION LABORATORY IN INFORMATION TECHNOLOGIES

Participation ended

Greece
EU contribution
€ 270 625
Address
Adrianiou 2 & Papada
11525 Athens
Activity type
Research Organisations
ALTER TECHNOLOGY TUV NORD UK LIMITED
United Kingdom
EU contribution
€ 322 500
Address
Bain Square 5
EH54 7DQ Livingston
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)