Directly Modulated Lasers on Silicon

Livrables

establishing a Data management plan

This deliverable will provide the detailed definitions of the DIMENSION system and the requirements to meet the final project targets.

Report on basic component characterization

This deliverable will report on the performance of the individual devices.

First report on electrical design

This report describes the first finished designs for the single LDD and MD ICs.

Second report on dissemination, exploitation and standardisation activities

This report includes updated dissemination/exploitations plans and achievements including e.g. press releases, IP/IPR activities, organisation of/attendance at work-shops, conferences etc., publications, trainings and relevant business cases.

First report on dissemination, exploitation and standardisation activities

This report includes dissemination/exploitations plans and achievements including e.g. press releases, IP/IPR activities, organisation of/attendance at work-shops, conferences etc., publications, trainings and relevant business cases.

Feasibility study and implementation roadmap

Final deliverable of WP2, reporting on the co-existence and migration scenarios from the current datacentre technologies and standards to the DIMENSION project solutions and commercialisation roadmaps in collaboration with T6.3 (Demonstrators and exploitation of project results).

Report on component-level and single-channel characterization

This deliverable will report on the verification and validity of the individual component’s performance and compliance with the component-level specs.

Report on component specifications

Report defining the final specifications of the optoelectronic and electronic chipsets and the EPIC integration platform with its associated passive function in terms of performance parameters, geometry, layout and integration compatibility.

Interim progress report
Report on techno-economical evaluation

This deliverable reports on techno-economic studies of the DIMENSION developments. The starting point is to take as reference standard technologies, then apply methodological a comparison of cost and power consumption for the solutions developed in the project.

Final report on dissemination, exploitation and standardisation activities

This report summarizes all dissemination/exploitations achievements including e.g. press releases, IP/IPR activities, organisation of/attendance at work-shops, conferences etc., publications, trainings and relevant business cases.

Second periodic report – governing the first fabrication iteration
First periodic report – governing the design phase
Third and final report – governing the full integration process and characterization

Project presentation document, website public, intranet active

Publications

Heterogeneous Co-Integration of BTO/Si and III-V technology on a Silicon Photonics Platform

Auteurs: Pascal Stark, Felix Eltes, Yannick Baumgartner, Daniele Caimi, Youri Popoff, Norbert Meier, Lukas Czornomaz, Jean Fompeyrine, Bert Offrein, Stefan Abel
Publié dans: Optical Fiber Communication Conference (OFC) 2020, 2020, Page(s) T3B.3, ISBN 978-1-943580-71-2
Éditeur: OSA
DOI: 10.1364/ofc.2020.t3b.3

High-performance waveguide-coupled Ge photo detectors for a photonic BiCMOS Technology

Auteurs: Stefan Lischke, Dieter Knoll, Christian Mai, Lars Zimmermann
Publié dans: 2018 23rd Opto-Electronics and Communications Conference (OECC), 2018, Page(s) 1-2, ISBN 978-1-5386-9145-8
Éditeur: IEEE
DOI: 10.1109/oecc.2018.8729865

Performance improvement of a monolithically integrated C-Band receiver enabled by an advanced photonic BiCMOS process

Auteurs: S. Lischke, D. Knoll, M. H. Eissa, M. Kroh, A. Peczek, L. Zimmermann, A. Awny
Publié dans: 2017 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2017, Page(s) 50-53, ISBN 978-1-5090-6383-3
Éditeur: IEEE
DOI: 10.1109/BCTM.2017.8112909

Microcavity III-V lasers monolithically grown on silicon

Auteurs: Kirsten Moselund, Benedikt Mayer, Stephan Wirths, Svenja Mauthe, Yannick Baumgartner, Joel Winniger, Heinz Schmid, Marilyne Souza, Lukas Czornomaz, Philipp Staudinger
Publié dans: Quantum Sensing and Nano Electronics and Photonics XV, 2018, Page(s) 48, ISBN 9781-510615663
Éditeur: SPIE
DOI: 10.1117/12.2291735

On the Power Consumption of MIMO Processing and its Impact on the Performance of SDM Networks

Auteurs: Nikolaos-Panteleimon Diamantopoulos, Behnam Shariati, Ioannis Tomkos
Publié dans: Optical Fiber Communication Conference, 2017, Page(s) Th2A.18, ISBN 978-1-943580-23-1
Éditeur: OSA
DOI: 10.1364/ofc.2017.th2a.18

Photonic Integrated Circuits for Data Center Interconnects

Auteurs: Benjamin Wohlfeil, Danish Rafique, and Michael Eiselt
Publié dans: European Conference on Integrated optics (ECIO), 2017
Éditeur: ECIO

Multi-format 800 – 1600 Gb/s coherent transceiver for inter-data centre interconnects over SMF

Auteurs: P. Torres-Ferrera, R. Gutierrez-Castrejon, I. Tomkos
Publié dans: 2017 19th International Conference on Transparent Optical Networks (ICTON), 2017, Page(s) 1-4, ISBN 978-1-5386-0859-3
Éditeur: IEEE
DOI: 10.1109/icton.2017.8024831

On the benefits of FMF based data center interconnection utilizing MIMO-less PAM-M transceivers

Auteurs: Behnam Shariati, Nikolaos-Panteleimon Diamantopoulos, Dimitrios Klonidis, Jaume Comellas, Ioannis Tomkos
Publié dans: 2017 19th International Conference on Transparent Optical Networks (ICTON), 2017, Page(s) 1-4, ISBN 978-1-5386-0859-3
Éditeur: IEEE
DOI: 10.1109/icton.2017.8024961

Techno-Economic Evaluations of 400G Optical Interconnect Implementations for Datacenter Networks

Auteurs: Theodoros Rokkas, Ioannis Neokosmidis, Behnam Shariati, Ioannis Tomkos
Publié dans: Optical Fiber Communication Conference, 2018, Page(s) M1A.1, ISBN 978-1-943580-38-5
Éditeur: OSA
DOI: 10.1364/ofc.2018.m1a.1

Nonlinearity, noise and bandwidth influence for PAM4 modulation format

Auteurs: N. Neumann, Z. Al-Husseini and D. Plettemeier
Publié dans: 19th ITG-Symposium Photonic Networks, 2018
Éditeur: VDE

Cost and Power Consumption Comparison of 400 Gbps Intra-Datacenter Transceiver Modules

Auteurs: Theodoros Rokkas, Ioannis Neokosmidis, Ioannis Tomkos
Publié dans: 2018 20th International Conference on Transparent Optical Networks (ICTON), 2018, Page(s) 1-4, ISBN 978-1-5386-6605-0
Éditeur: IEEE
DOI: 10.1109/icton.2018.8473747

A 30 Gb/s High-Swing, Open-Collector Modulator Driver in 250 nm SiGe BiCMOS

Auteurs: Alexandru Giuglea, Guido Belfiore, Mahdi Khafaji, Ronny Henker, Frank Ellinger
Publié dans: 2018 IEEE 61st International Midwest Symposium on Circuits and Systems (MWSCAS), 2018, Page(s) 5-8, ISBN 978-1-5386-7392-8
Éditeur: IEEE
DOI: 10.1109/mwscas.2018.8624057

CMOS-Compatible Hybrid III-V/Si Photodiodes Using a Lateral Current Collection Scheme

Auteurs: Yannick Baumgartner, Charles Caer, Marc Seifried, Gustavo Villares, D. Caimi, Thomas Morf, Jerome Faist, Bert J. Offrein, Lukas Czornomaz
Publié dans: 2018 European Conference on Optical Communication (ECOC), 2018, Page(s) 1-3, ISBN 978-1-5386-4862-9
Éditeur: IEEE
DOI: 10.1109/ecoc.2018.8535117

Comparison of Segmented and Traveling-Wave Electro-Optical Transmitters Based on Silicon Photonics Mach-Zehnder Modulators

Auteurs: Alexandru Giuglea, Guido Belfiore, Mahdi Khafaji, Ronny Henker, Despoina Petousi, Georg Winzer, Lars Zimmermann, Frank Ellinger
Publié dans: 2018 Photonics in Switching and Computing (PSC), 2018, Page(s) 1-3, ISBN 978-1-5386-9392-6
Éditeur: IEEE
DOI: 10.1109/ps.2018.8751239

Photonic Integrated Circuits for Data Center Interconnects

Auteurs: Benjamin Wohlfeil, Gilda Raoof Mehrpoor, Annika Dochhan, Danish Rafique, Michael Eiselt, Jorg-Peter Elbers
Publié dans: 2018 Photonics in Switching and Computing (PSC), 2018, Page(s) 1-3, ISBN 978-1-5386-9392-6
Éditeur: IEEE
DOI: 10.1109/ps.2018.8751412

Enabling 64Gbaud Coherent Optical Transceivers

Auteurs: Danish Rafique, Helmut Griesser, Joerg-Peter Elbers
Publié dans: Optical Fiber Communication Conference, 2017, Page(s) W2A.25, ISBN 978-1-943580-23-1
Éditeur: OSA
DOI: 10.1364/OFC.2017.W2A.25

CMOS-embedded lasers for advanced silicon photonic devices

Auteurs: M. Seifried, H. Hahn, G. Villares, F. Horst, D. Caimi, C. Caer, Y. Baumgartner, M. Sousa, R. Dangel, L. Czornomaz, B. J. Offrein
Publié dans: 2017 19th International Conference on Transparent Optical Networks (ICTON), 2017, Page(s) 1-4, ISBN 978-1-5386-0859-3
Éditeur: IEEE
DOI: 10.1109/ICTON.2017.8024828

Digital pre-emphasis based system design trade-offs for 64 Gbaud coherent data center interconnects

Auteurs: Danish Rafique, Nicklas Eiselt, Helmut Griesser, Benjamin Wohlfeil, Michael Eiselt, Jorg-Peter Elbers
Publié dans: 2017 19th International Conference on Transparent Optical Networks (ICTON), 2017, Page(s) 1-4, ISBN 978-1-5386-0859-3
Éditeur: IEEE
DOI: 10.1109/ICTON.2017.8024798

Designing the next generation of intra-and inter-datacentres interconnects

Auteurs: Vasiliki Vgenopoulou, Nikolaos Raptis, Evangelos Grivas, Ioannis Tomkos
Publié dans: 2017 19th International Conference on Transparent Optical Networks (ICTON), 2017, Page(s) 1-6, ISBN 978-1-5386-0859-3
Éditeur: IEEE
DOI: 10.1109/ICTON.2017.8024830

Monolithic photonic BiCMOS technology for high-speed receiver applications

Auteurs: S. Lischke, D. Knoll, C. Mai, A. Awny, G. Winzer, M. Kroh, K. Voigt, L. Zimmermann
Publié dans: 2017 19th International Conference on Transparent Optical Networks (ICTON), 2017, Page(s) 1-4, ISBN 978-1-5386-0859-3
Éditeur: IEEE
DOI: 10.1109/ICTON.2017.8024829

Towards electro-optical integration of hybrid III-V on Si lasers into the BEOL of a CMOS technology

Auteurs: H. Hahn, M. Seifried, G. Villares, Y. Baumgartner, M. Halter, C. Caer, D. Caimi, M. Sousa, R. Dangel, N. Meier, F. Horst, L. Czornomaz, B. J. Offrein
Publié dans: 2017 75th Annual Device Research Conference (DRC), 2017, Page(s) 1-2, ISBN 978-1-5090-6328-4
Éditeur: IEEE
DOI: 10.1109/DRC.2017.7999518

Side-use of a Ge p-i-n photo diode for electrical application in a photonic BiCMOS technology

Auteurs: S. Lischke, D. Knoll, S. Tolunay-Wipf, C. Wipf, C. Mai, A. Fox, F. Herzel, M. Kaynak
Publié dans: 2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2016, Page(s) 126-129, ISBN 978-1-5090-0484-3
Éditeur: IEEE
DOI: 10.1109/BCTM.2016.7738970

Design effects on the performance of high-speed Ge photo detectors

Auteurs: S. Lischke, D. Knoll, C. Mai, M. Kroh, D. Schmidt, A. Peczek, J. Kreisl, J.-M. Lee, M. Kim, W.-Y. Choi, L. Zimmermann
Publié dans: 2016 IEEE 13th International Conference on Group IV Photonics (GFP), 2016, Page(s) 22-23, ISBN 978-1-5090-1903-8
Éditeur: IEEE
DOI: 10.1109/GROUP4.2016.7739076

High-speed, high-responsivity Ge photodiode with NiSi contacts for an advanced photonic BiCMOS technology

Auteurs: S. Lischke, D. Knoll, D. Wolansky, M. Kroh, A. Peczek, L. Zimmermann
Publié dans: 2017 IEEE 14th International Conference on Group IV Photonics (GFP), 2017, Page(s) 61-62, ISBN 978-1-5090-6568-4
Éditeur: IEEE
DOI: 10.1109/group4.2017.8082196

Monolithic integration of InAlAs/InGaAs quantum-well on InP-OI micro-substrates on Si for infrared light sources

Auteurs: Y. Baumgartner, B. Mayer, M. Sousa, D. Caimi, K. Moselund, L. Czornomaz
Publié dans: 2017 IEEE 14th International Conference on Group IV Photonics (GFP), 2017, Page(s) 173-174, ISBN 978-1-5090-6568-4
Éditeur: IEEE
DOI: 10.1109/group4.2017.8082252

Transmitters in Photonic BiCMOS

Auteurs: Lars Zimmermann
Publié dans: Advanced Photonics 2017 (IPR, NOMA, Sensors, Networks, SPPCom, PS), 2017, Page(s) PW2D.1, ISBN 978-1-943580-30-9
Éditeur: OSA
DOI: 10.1364/PS.2017.PW2D.1

Novel CMOS-Compatible Ultralow Capacitance Hybrid III-V/Si Photodetectors Tested up to 32 Gbps NRZ

Auteurs: Y. Baumgartner, M. Seifried, C. Caer, P. Stark, D. Caimi, J. Faist, B.J. Offrein, L. Czornomaz
Publié dans: Optical Fiber Communication Conference (OFC) 2019, 2019, Page(s) Th3B.3, ISBN 978-1-943580-53-8
Éditeur: OSA
DOI: 10.1364/ofc.2019.th3b.3

Coherent optical WDM systems for 1.6 Tb/s Ethernet over 40 km of single-mode fiber

Auteurs: P. Torres-Ferrera, M.A. García-Yáñez, R. Gutiérrez-Castrejón, I. Tomkos
Publié dans: Optical Fiber Technology, 2018, ISSN 1068-5200
Éditeur: Academic Press
DOI: 10.1016/j.yofte.2018.01.021

Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications

Auteurs: Christos A. Thraskias, Eythimios N. Lallas, Niels Neumann, Laurent Schares, Bert J. Offrein, Ronny Henker, Dirk Plettemeier, Frank Ellinger, Juerg Leuthold, Ioannis Tomkos
Publié dans: IEEE Communications Surveys & Tutorials, Numéro 20/4, 2018, Page(s) 2758-2783, ISSN 1553-877X
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/comst.2018.2839672

Polymer Waveguides Enabling Scalable Low-Loss Adiabatic Optical Coupling for Silicon Photonics

Auteurs: Roger Dangel, Antonio La Porta, Daniel Jubin, Folkert Horst, Norbert Meier, Marc Seifried, Bert J. Offrein
Publié dans: IEEE Journal of Selected Topics in Quantum Electronics, Numéro 24/4, 2018, Page(s) 1-11, ISSN 1077-260X
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/jstqe.2018.2812603

Monolithically Integrated CMOS-Compatible III–V on Silicon Lasers

Auteurs: Marc Seifried, Gustavo Villares, Yannick Baumgartner, Herwig Hahn, Mattia Halter, Folkert Horst, Daniele Caimi, Charles Caer, Marilyne Sousa, Roger Franz Dangel, Lukas Czornomaz, Bert Jan Offrein
Publié dans: IEEE Journal of Selected Topics in Quantum Electronics, Numéro 24/6, 2018, Page(s) 1-9, ISSN 1077-260X
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/jstqe.2018.2832654

Low-resistive, CMOS-compatible ohmic contact schemes to moderately doped n-InP

Auteurs: Herwig Hahn, Marilyne Sousa, Lukas Czornomaz
Publié dans: Journal of Physics D: Applied Physics, Numéro 50/23, 2017, Page(s) 235102, ISSN 0022-3727
Éditeur: Institute of Physics Publishing
DOI: 10.1088/1361-6463/aa6f7a

Monolithically Integrated High-Extinction-Ratio MZM With a Segmented Driver in Photonic BiCMOS

Auteurs: Despoina Petousi, Pedro Rito, Stefan Lischke, Dieter Knoll, Iria Garcia-Lopez, Marcel Kroh, Rainer Barth, Christian Mai, Ahmet-Cagri Ulusoy, Anna Peczek, Georg Winzer, Karsten Voigt, Dietmar Kissinger, Klaus Petermann, Lars Zimmermann
Publié dans: IEEE Photonics Technology Letters, Numéro 28/24, 2016, Page(s) 2866-2869, ISSN 1041-1135
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/LPT.2016.2624700

A 50–20 Gb/s, 80 mW Photonic Receiver With 59–70 dBΩ Gain and 12.3–8.2 pA/√Hz Input-Referred Noise

Auteurs: Guido Belfiore, Mohammad Mahdi Khafaji, Ronny Henker, Zaid Al-Husseini, Niels Neumann, Dirk Plettemeier, Frank Ellinger
Publié dans: IEEE Photonics Technology Letters, Numéro 32/15, 2020, Page(s) 921-924, ISSN 1041-1135
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/lpt.2020.3003168

Droits de propriété intellectuelle

OPTICAL INTERFERENCE FILTER DEVICE, ESPECIALLY FOR AN OPTICAL WAVELENGTH LOCKING DEVICE

Numéro de demande/publication: EP 16198701
Date: 2016-11-14
Demandeur(s): ADTRAN NETWORKS SE

ELECTRO -OPTICAL AND OPTOELECTRONIC DEVICES

Numéro de demande/publication: US 15/438820
Date: 2017-02-22
Demandeur(s): IBM RESEARCH GMBH

Method to fabricate large-scale III-V substrates on Si using a two-step confined epitaxial growth scheme

Numéro de demande/publication: US 94891706
Date: 2018-09-18
Demandeur(s): IBM RESEARCH GMBH

LOW - RESISTIVE , CMOS - COMPATIBLE, AU - FREE OHMIC CONTACT TO N — INP

Numéro de demande/publication: US 15/216427
Date: 2016-07-21
Demandeur(s): IBM RESEARCH GMBH

HYBRID VERTICAL CURRENT INJECTION ELECTRO-OPTICAL DEVICE WITH REFRACTIVE-INDEX-MATCHED CURRENT BLOCKING LAYER

Numéro de demande/publication: 20 1715846238
Date: 2017-12-19
Demandeur(s): IBM RESEARCH GMBH

ELECTRO - OPTICAL DEVICE WITH ASYMMETRIC, VERTICAL CURRENT INJECTION OHMIC CONTACTS

Numéro de demande/publication: US 15/439425
Date: 2017-02-22
Demandeur(s): IBM RESEARCH GMBH

OPTICAL INTERFERENCE FILTER DEVICE, ESPECIALLY FOR AN OPTICAL WAVELENGTH LOCKING DEVICE

Numéro de demande/publication: US 15/788388
Date: 2017-10-19
Demandeur(s): ADTRAN NETWORKS SE

HYBRID III - V ON SILICON LASER DEVICE WITH TRANSVERSE MODE FILTER

Numéro de demande/publication: US 15/466323
Date: 2017-03-22
Demandeur(s): IBM RESEARCH GMBH

Fabrication of semiconductor substrates

Numéro de demande/publication: US 20200083042A1
Date: 2018-09-11
Demandeur(s): IBM RESEARCH GMBH

Livrables

Publications

Droits de propriété intellectuelle

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