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A generic CMOS-compatible platform for co-integrated plasmonics/photonics/electronics PICs towards volume manufacturing of low energy, small size and high performance photonic devices

Objetivo

PLASMOfab aims to address the ever increasing needs for low energy, small size, high complexity and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-integration of active plasmonics with photonic and supporting electronic. The CMOS-compatible metals Aluminum, Titanium Nitride and Copper, will be thoroughly investigated towards establishing a pool of meaningful elementary plasmonic waveguides on co-planar photonic (Si, SiO2 and SiN) platforms along with the associated photonic-plasmonic interfaces. The functional advantages of PLASMOfab technology will be practically demonstrated by developing two novel functional prototypes with outstanding performances:
1) a compact, plasmonic bio-sensor for label-free inflammation markers detection with multichannel capabilities and record-high sensitivity by combining plasmonic sensors with electrical contacts, Si3N4 photonics, high-speed biofunctionalization techniques and microfluidics
2) a 100 Gb/s NRZ transmitter for datacom applications by consolidating low energy and low footprint plasmonic modulator and ultra high-speed SiGe driving electronics in a single monolithic chip.
The new integration technology will be verified through wafer-scale fabrication of the prototypes at commercial CMOS fabs, demonstrating volume manufacturing and cost reduction capabilities. PLASMOfab technology will be supported by an EDA software design kit library paving the way for a standardized, fabless plasmonic/photonic IC eco-system.

Convocatoria de propuestas

H2020-ICT-2015
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Coordinador

ARISTOTELIO PANEPISTIMIO THESSALONIKIS
Dirección
Kedea Building, Tritis Septemvriou, Aristotle Univ Campus
54636 Thessaloniki
Grecia
Tipo de actividad
Higher or Secondary Education Establishments
Aportación de la UE
€ 612 500

Participantes (9)

UNIVERSITE DIJON BOURGOGNE
Francia
Aportación de la UE
€ 430 200
Dirección
Esplanade Erasme Maison De L Universite
21078 Dijon Cedex
Tipo de actividad
Higher or Secondary Education Establishments
EIDGENOESSISCHE TECHNISCHE HOCHSCHULE ZUERICH
Suiza
Aportación de la UE
€ 0
Dirección
Raemistrasse 101
8092 Zuerich
Tipo de actividad
Higher or Secondary Education Establishments
GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH
Alemania
Aportación de la UE
€ 429 860
Dirección
Otto Blumenthal Strasse
52074 Aachen
Tipo de actividad
Other
AMS-OSRAM AG
Austria
Aportación de la UE
€ 502 833,75
Dirección
Tobelbaderstrasse 30 Schloss Premstatten
8141 Unterpremstatten
Tipo de actividad
Private for-profit entities (excluding Higher or Secondary Education Establishments)
MICRAM MICROELECTRONIC GMBH
Alemania
Aportación de la UE
€ 281 265
Dirección
Konrad Zuse Strasse 16
44801 Bochum
Tipo de actividad
Private for-profit entities (excluding Higher or Secondary Education Establishments)
UNIVERSITAT DES SAARLANDES
Alemania
Aportación de la UE
€ 225 000
Dirección
Campus
66123 Saarbrucken
Tipo de actividad
Higher or Secondary Education Establishments
MELLANOX TECHNOLOGIES LTD - MLNX
Israel
Aportación de la UE
€ 355 000
Dirección
Yokneam Ilit Industrial Zone - Hermon Building
20692 Yokneam
Tipo de actividad
Private for-profit entities (excluding Higher or Secondary Education Establishments)
SYNOPSYS SOFTWARE NETHERLANDS BV
Países Bajos
Aportación de la UE
€ 244 188,75
Dirección
Capitool 50
7521 PL Enschede
Tipo de actividad
Private for-profit entities (excluding Higher or Secondary Education Establishments)
AIT AUSTRIAN INSTITUTE OF TECHNOLOGY GMBH
Austria
Aportación de la UE
€ 499 843,75
Dirección
Giefinggasse 4
1210 Wien
Tipo de actividad
Research Organisations