Using existing methods to develop a modular, integrated and autonomous ‘Factory-in-a-box’ production line for manufacturing high volumes of flexible integrated logic circuits

Project Information

FlexLogIC

Grant agreement ID: 696266

DOI

10.3030/696266

Project closed

EC signature date 6 August 2015

Start date 1 September 2015

End date 30 November 2015

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies – Nanotechnologies

Total cost

€ 71 429,00

EU contribution

€ 50 000,00

Coordinated by

PRAGMATIC SEMICONDUCTOR LIMITED
United Kingdom

Periodic Reporting for period 1 - FlexLogIC (Using existing methods to develop a modular, integrated and autonomous ‘Factory-in-a-box’ production line for manufacturing high volumes of flexible integrated logic circuits)

Reporting period: 2015-09-01 to 2015-11-30

Summary of the context and overall objectives of the project

The FlexLogIC Project has developed a comprehensive business plan for the development of ‘Factory in a Box’ equipment to enable high-volume low-cost manufacture of Flexible Integrated Circuits (FlexICs).
In doing so, PragmatIC has quantified the addressable markets both for FlexICs and FlexLogIC equipment. At the same time, we have identified commercial and technical partners to support commercialisation, undertaken a design study covering both hardware and software required for the fully-automated manufacturing units, and produced a fully-costed development plan to realise the opportunity during the next two years.

Work performed from the beginning of the project to the end of the period covered by the report and main results achieved so far

The project has confirmed the technical feasibility of developing a ‘factory-in-a-box’ for a low capital, high capacity manufacturing unit for FlexICs. An entry-level module (ELMo) can be realised within two years, capable of >0.5Bn FlexICs per annum capacity.
Commercial demand for FlexICs has been validated, with the most immediate quantifiable product opportunities within the RFID/NFC market sectors. Although current activity is largely within the EU (UK, Germany, Belgium) and US, there are substantial global opportunities both for sales of FlexICs and deployment of FlexLogIC production units.
The value-chain for FlexICs has also been analysed, and pricing models developed both for FlexICs and FlexLogIC production units. Freedom-to-operate issues have been considered, alongside a consideration of different IP strategies that can protect valuable know-how and generate significant barriers-to-entry for competitors.
Our unique selling point is that while there are other companies and groups pursuing semiconductor devices on plastic, the development of a ‘factory-in-a-box’ manufacturing module is unique to PragmatIC.

Progress beyond the state of the art and expected potential impact (including the socio-economic impact and the wider societal implications of the project so far)

Realisation of the FlexLogIC vision during the coming years can significantly disrupt the current operating model within the semiconductor industry, including opportunities to manufacture within the EU. As volumes of FlexLogIC units increase, the unit cost is expected to fall by 50%. Conservative estimates of 100 units per annum (>>Bns FlexICs) would create a new €0.5 billion market in equipment, much of which can be realised within the EU. A substantial >€1 billion market for FlexICs will also be enabled. As FlexIC demand increases to support the realisation of the Internet of Things, volumes of FlexICs will be in the trillions of units per annum.

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