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(Ultra)Sound Interfaces and Low Energy iNtegrated SEnsors


Demonstrator performance and validation results (D6.4)

Demonstrator performance and validation results for all the project’s demonstrators.

Mid-term dissemination report (D7.4)

Mid-term dissemination report

Dissemination and Communication plans (D7.1)

Report on the dissemination activities. Scientific results of the project will be presented at international conferences related to design and manufacturing of MEMS devices, materials and circuits for acoustic/US transducers, signal processing and ultrasound technologies and published in scientific and industrial journals. Moreover the dissemination activities will be supported through project web pages where project information materials, open access publications and public deliverables will be available to view and download.

Test & validation concept paper (D3.4.1)

In order to enable test and functional validation (i.e. specification conformance) testing and validation concepts need to be specified. Typically every partner is driving its own supply chain, however since ultrasound physics is a relatively new domain for most partners, it asks for a higher level of interaction and collaboration. These to-be-developed concepts will cover test methodologies, test equipment, concepts to interprete measurement data, and, most important, the creation of feedback to the R&D engineers (device, application, technology, software, reliability, …). The target is a testing & validation concept paper in order to reduce the R&D cycle time.

Final Exploitation and Standardization report (D7.7)

Final Exploitation and Standardization report

Electronics concepts document (D3.2.1)

Based on the WP1 results and the outputs of task 3.1.1 and task 3.1.2 the design space will be exploited for the development of electronics concepts to meet the SILENSE use case requirements. The electronics concept will make the functional partitioning and electronics architecture for the different use case demonstrators available. The latter will be achieved by a thorough analysis and simulation of the crucial parts in the (digital) signal processing chain.

Micro Sound Transducers –summary (D2.5)

Report summarizing the Micro Sound Transducers

Standardization plan and review of regulatory situation and standards (D7.3)

In order to rely on current standards and to develop the project well aligned with the existing standards and to make sure that the outcomes of the project will influence the standardization bodies, it is planned, within this task, to develop a standardization plan and to contribute to existing and/or new standards. Especially effort on standardization of gesture events for several application domains (mobile, automotive, smart homes, production lines, etc.) will be of the main focus. Also standards (under development) related to ergonomics of human-system interaction will be addressed. In addition to standards, regulations with respect to privacy, security and safety will be of interest.

Final dissemination report (D7.6)

Final dissemination report

Review of regulatory situation, standards, available information on environmental and health effects and investigation of US interference effects (D1.3)

The regulatory situation for the widespread use of ultrasound will be investigated and possible effects on health or e.g. animals/pets will be assessed. In addition existing standards will be reviewed. The widespread distribution of ultrasound sensors in our living environment has many advantages from a technical point of view. To be able to cover such a widespread distribution, extra attention needs to be paid to the unwanted side-effects of a large number of ultrasound transmitters on man and its environment, and the interference effect of ultrasound devices. A thorough literature study will be performed, resulting in an overview of ultrasonic frequency ranges heard by animals, possible sub-harmonics due to resonance of widespread objects and materials in frequency ranges that may be heard by humans and possible interference with human body tissue. Also legislation concerning the use of ultrasonic frequencies will be researched. This will be combined in an ultrasonic frequency map.

Application analysis and definition of use cases – final (D1.1.2)

This report will describe the work done on analysis on the chosen applications areas automotive, smart buildings/homes, and mobile and wearables. The pros and cons of ultra- infrasound technology versus other technology (such as radar) for these use cases will be assessed as well.

Preliminary application analysis and definition of use cases (D1.1.1)

In this deliverable the chosen applications areas automotive, smart buildings/homes, and mobile and wearables will be analysed and appropriate use cases will be worked out in more details. The pros and cons of ultrasound technology versus other technology (such as radar) for these use cases will be assessed as well. System level models for the different use cases will be developed and the feasibility investigated. One of the main focus points will be consideration of a multi-level system with highly-improved power efficiency. At the use case level, this will translate into the definition of a system dedicated to several applications, and then, several power budget scenarios. Use cases: • Mobile-wearable use cases, the best mobile SOC system architecture/split to optimize cost, performance, latency and power for an ‘always on’ scenario will be defined. An optimum SW architecture in terms of cost, power, performance, latency and SW LoE will be defined. The need of dedicated ultrasound CPU in AP or possibility to time share with current CPUs in AP will be assessed. • Smart home/ smart building use cases will follow a similar approach as for the mobile use cases. • Automotive use cases, requirements collection that a new ultrasonic component should fulfil related to environmental and electrical conditions for automotive industry. Some specific requirements related to automotive industrial process will be defined, to take it into account from the beginning in the new ultrasonic component definition.

Design & simulation environment (D3.3.2)

The SILENSE partners will create a design and simulation environment optimized for ultrasound, by further advancing the models and EDA design tools in order to match the electronics with the other elements (for which the MEMS transducers are the most important ones). A MEMS-IC co-design should enable evaluation of the system specification, such as SNR, dynamic range, harmonic distortion or maximum acoustic input. The main challenge for the designers comes from the fact that different design communities have to be aligned. The ultrasound experts are using different tools and are far away from using standard design flow. The advances in this task will enable new application to be developed faster and with much lower risks for design errors.


Multi-Angle Fusion for Low-Cost Near-Field Ultrasonic in-Air Gesture Recognition

Auteurs: Emad A. Ibrahim, Marc Geilen, Min Li, Jose Pineda De Gyvez
Publié dans: IEEE Access, Issue 8, 2020, Page(s) 191204-191218, ISSN 2169-3536
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2020.3031677

Guided Embodiment and Potential Applications of Tutor Systems in Language Instruction and Rehabilitation

Auteurs: Macedonia, Manuela; Hammer, Florian; Weichselbaum, Otto
Publié dans: Frontiers in Psychology, Issue Vol. 9, Article 927, 2018, Page(s) 6, ISSN 1664-1078
Éditeur: Frontiers Research Foundation
DOI: 10.3389/fpsyg.2018.00927

Quality-of-user-experience: a position paper

Auteurs: Florian Hammer, Sebastian Egger-Lampl, Sebastian Möller
Publié dans: Quality and User Experience, Issue 3/1, 2018, Page(s) 15, ISSN 2366-0147
Éditeur: Springer International Publishing
DOI: 10.1007/s41233-018-0022-0

Characterization of polymer-based piezoelectric micromachined ultrasound transducers for short-range gesture recognition applications

Auteurs: Pieter Gijsenbergh, Alexandre Halbach, Yongbin Jeong, Guilherme Brondani Torri, Margo Billen, Libertario Demi, Chih-Hsien Huang, David Cheyns, Xavier Rottenberg, Veronique Rochus
Publié dans: Journal of Micromechanics and Microengineering, Issue 29/7, 2019, Page(s) 074001, ISSN 0960-1317
Éditeur: Institute of Physics Publishing
DOI: 10.1088/1361-6439/ab1f41

Video-Based Point-Cloud-Compression Standard in MPEG: From Evidence Collection to Committee Draft [Standards in a Nutshell]

Auteurs: Euee S. Jang, Marius Preda, Khaled Mammou, Alexis M. Tourapis, Jungsun Kim, Danillo B. Graziosi, Sungryeul Rhyu, Madhukar Budagavi
Publié dans: IEEE Signal Processing Magazine, Issue 36/3, 2019, Page(s) 118-123, ISSN 1053-5888
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/msp.2019.2900721

Point-Cloud Compression: Moving Picture Experts Group's New Standard in 2020

Auteurs: Li Cui, Rufael Mekuria, Marius Preda, Euee S. Jang
Publié dans: IEEE Consumer Electronics Magazine, Issue 8/4, 2019, Page(s) 17-21, ISSN 2162-2256
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/mce.2019.2905483

Emerging MPEG Standards for Point Cloud Compression

Auteurs: Sebastian Schwarz, Marius Preda, Vittorio Baroncini, Madhukar Budagavi, Pablo Cesar, Philip A. Chou, Robert A. Cohen, Maja Krivokuca, Sebastien Lasserre, Zhu Li, Joan Llach, Khaled Mammou, Rufael Mekuria, Ohji Nakagami, Ernestasia Siahaan, Ali Tabatabai, Alexis M. Tourapis, Vladyslav Zakharchenko
Publié dans: IEEE Journal on Emerging and Selected Topics in Circuits and Systems, Issue 9/1, 2019, Page(s) 133-148, ISSN 2156-3357
Éditeur: IEEE Circuits and Systems Society
DOI: 10.1109/jetcas.2018.2885981

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

Auteurs: Ali Roshanghias, Marc Dreissigacker, Christina Scherf, Christian Bretthauer, Lukas Rauter, Johanna Zikulnig, Tanja Braun, Karl-F. Becker, Sven Rzepka, Martin Schneider-Ramelow
Publié dans: Micromachines, Issue 11/6, 2020, Page(s) 564, ISSN 2072-666X
Éditeur: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/mi11060564

Design, Modelling, and Characterization of Display Compatible pMUT Device

Auteurs: Huang, Chih-Hsien; Hang, Gao; Torri, Guilherme Brondani; Mao, Shengping; Jeong, Yongbin; Cheyns, David; Rochus, Veronique; Rottenberg, Xavier
Publié dans: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Issue 15-18 April 2018, 2018, Page(s) 4, ISBN 978-1-5386-2359-6
Éditeur: IEEE

The Realization of Redistribution Layers for FOWLP by Inkjet Printing

Auteurs: Ali Roshanghias, Ying Ma, Marc Dreissigacker, Tanja Braun, Christian Bretthauer, Karl-F. Becker, Martin Schneider-Ramelow
Publié dans: Proceedings, Issue 2/13, 2018, Page(s) 703, ISSN 2504-3900
Éditeur: MDPI AG
DOI: 10.3390/proceedings2130703

Feasiblity of Using Printed Polymer Transducers for Mid-Air Haptic Feedback

Auteurs: P.L.M.J. van Neer, A.W.F. Volker, A.P. Berkhoff, H.B. Akkerman, T. Schrama, A. van Breemen, G.H. Gelinck
Publié dans: 2018 IEEE International Ultrasonics Symposium (IUS), Issue 22-25 Oct. 2018, 2018, Page(s) 1-4, ISBN 978-1-5386-3425-7
Éditeur: IEEE
DOI: 10.1109/ultsym.2018.8579980

Display Compatible pMUT Device for Mid Air Ultrasound Gesture Recognition

Auteurs: Cheyns D., Demi L., Huang C.H., Jeong Y., Mao S., Rochus V., Rottenberg X.
Publié dans: TechConnect Briefs, Issue 4, Informatics, Electronics and Microsystems: TechConnect Briefs 2018, 2018, Page(s) 161-164, ISBN 978-0-9988782-1-8
Éditeur: TechConnect

Mechanical Characterization of MEMS-Microphones by Means of Nanoindentation and Coupled Finite Element Analysis

Auteurs: Jan Albrecht ; Marie Weissbach ; Matthias Vobl ; Ulrich Krumbein ; Sven Rzepka
Publié dans: 2018 IEEE 20th Electronics Packaging Technology Conference, Issue 4-7 December 2018, 2018, Page(s) 580-584, ISBN 978-1-5386-7668-4
Éditeur: IEEE
DOI: 10.1109/eptc.2018.8654382

Hand Gesture Recognition Based on Ultrasound Technology: Pre-processing Stage

Auteurs: Raissa Likhonina
Publié dans: 2019 8th Mediterranean Conference on Embedded Computing (MECO), Issue 10-14 June 2019, 2019, Page(s) 1-6, ISBN 978-1-7281-1740-9
Éditeur: IEEE
DOI: 10.1109/meco.2019.8760063

Development of a flexible large-area array based on printed polymer transducers for mid-air haptic feedback

Auteurs: Paul van Neer, Arno Volker, Arthur Berkhoff, Thijs Schrama, Hylke Akkerman, Albert van Breemen, Laurens Peeters, Jan-Laurens van der Steen, Gerwin Gelinck
Publié dans: 2019 International Congress on Ultrasonics, Issue 3-6 September 2019, 2019, Page(s) 045008
Éditeur: ASA
DOI: 10.1121/2.0001068

Keyword Spotting using Time-Domain Features in a Temporal Convolutional Network

Auteurs: Emad A. Ibrahim, Jos Huisken, Hamed Fatemi, Jose Pineda de Gyvez
Publié dans: 2019 22nd Euromicro Conference on Digital System Design (DSD), Issue 28-30 August 2019, 2019, Page(s) 313-319, ISBN 978-1-7281-2862-7
Éditeur: IEEE
DOI: 10.1109/dsd.2019.00053

A Single Ultrasonic Transducer Fast and Robust Short-Range Distance Measurement Method

Auteurs: Daniel Lagler, Sebastian Anzinger, Eugen Pfann, Alessandra Fusco, Christian Bretthauer, Mario Huemer
Publié dans: 2019 IEEE International Ultrasonics Symposium (IUS), Issue 6-9 October 2019, 2019, Page(s) 2533-2536, ISBN 978-1-7281-4596-9
Éditeur: IEEE
DOI: 10.1109/ultsym.2019.8925554

Low-cost monolithic processing of large-area ultrasound transducer arrays

Auteurs: L. C. J. M. Peters, R. Ollearo, R. G. F. A. Verbeek, J. L. P. J. van der Steen, H. B. Akkerman, A. W. F. Volker, P. L. M. J. van Neer, G. H. Gelinck
Publié dans: 2019 IEEE International Ultrasonics Symposium (IUS), Issue 6-9 October 2019, 2019, Page(s) 60-63, ISBN 978-1-7281-4596-9
Éditeur: IEEE
DOI: 10.1109/ultsym.2019.8926238

3D Point Cloud Compression - A Survey

Auteurs: Chao Cao, Marius Preda, Titus Zaharia
Publié dans: The 24th International Conference on 3D Web Technology, Issue 26-28 July 2019, 2019, Page(s) 1-9, ISBN 9781-450367981
Éditeur: ACM
DOI: 10.1145/3329714.3338130

Low Power Capacitive Ultrasonic Transceiver Array for Airborne Object Detection

Auteurs: Sebastian Anzinger, Fabian Lickert, Alessandra Fusco, Gabriele Bosetti, David Tumpold, Christian Bretthauer, Alfons Dehe
Publié dans: 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Issue 18-22 January 2020, 2020, Page(s) 853-856, ISBN 978-1-7281-3581-6
Éditeur: IEEE
DOI: 10.1109/mems46641.2020.9056182

PRESS/HOLD/RELEASE Ultrasonic Gestures and Low Complexity Recognition Based on TCN

Auteurs: Emad A. Ibrahim, Min Li, Jose Pineda de Gyvez
Publié dans: 2019 IEEE International Workshop on Signal Processing Systems (SiPS), Issue 20-23 October 2019, 2019, Page(s) 172-177, ISBN 978-1-7281-1927-4
Éditeur: IEEE
DOI: 10.1109/sips47522.2019.9020579

Broadband Acoustical MEMS Transceivers for Simultaneous Range Finding and Microphone Applications

Auteurs: Sebastian Anzinger, Christian Bretthauer, Johannes Manz, Ulrich Krumbein, Alfons Dehe
Publié dans: 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), Issue 23-27 June 2019, 2019, Page(s) 865-868, ISBN 978-1-5386-8104-6
Éditeur: IEEE
DOI: 10.1109/transducers.2019.8808264

MPEG-I Coding Performance in Immersive VR AR Applications

Auteurs: Lafruit, G., Schenkel, A., Tulvan, C. L., Preda, M., Yu, L.
Publié dans: Proceedings of IBC 2018, Issue 11-14 September 2018, 2018, Page(s) 9
Éditeur: IBC

Innovative implementations of additive manufacturing for advanced microelectronics packaging

Auteurs: Roshanghias, A., Dreissigacker, M.
Publié dans: 2019 MiNaPAD (Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum), 2019
Éditeur: IEEE Electronics Packaging Society

Die Realisierung von Umverdrahtungslagen mittels Inkjet-Printing im Fan-Out Wafer Level Packaging

Auteurs: Dreissigacker, M.; Roshanghias, A.; Becker K.-F.; Braun, T.;Schneider-Ramelow, M.; Lang, K.-D.
Publié dans: Proceedings of MikroSystemTechnik Kongress 2019, 2019
Éditeur: VDE/VDI-Ges. Mikroelektronik Mikrosystem- u. Feinwerktechnik

Low complexity multi-directional in-air ultrasonic gesture recognition using a TCN

Auteurs: Ibrahim, E., Geilen, M. C. W., Huisken, J. A., Li, M., & Pineda de Gyvez, J.
Publié dans: Proceedings Design, Automation and Test in Europe Conference, DATE 2020, 2020, ISBN 978-3-9819263-4-7
Éditeur: European Design and Automation Association (EDAA)

SILENSE TE0706+TE0720 Ultrasound Capture Platform with Example Application

Auteurs: Pohl, Zdenek
Publié dans: 2019
Éditeur: UTIA AV CR, v.v.i.

Simple Gesture Detector Based on TE0706 with TE0720-2IF and Ultrasonic Range Finder PmodMAXSONAR

Auteurs: Kohout, Lukas
Publié dans: 2018
Éditeur: UTIA AV CR, v.v.i.

Noise Cancellation Using QRD RLS Algorithms

Auteurs: Likhonina, Raissa; Kadlec, Jiri
Publié dans: 2018
Éditeur: UTIA AV CR, v.v.i.

Adaptive RLS Algorithms Reference Implementations

Auteurs: Kadlec, Jiri; Likhonina, Raissa
Publié dans: 2017
Éditeur: UTIA AV CR, v.v.i.

UTIA Evaluation Board v1.7 v1.8 Beamforming Demo

Auteurs: Pohl Zdenek, Kohout Lukas
Publié dans: 2019
Éditeur: UTIA AV CR, v.v.i.

UTIA evBoard v1.0 Beamforming Demo

Auteurs: Pohl Zdenek, Kohout Lukas
Publié dans: 2019
Éditeur: UTIA AV CR, v.v.i.

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