Livrables
Demonstrator performance and validation results for all the project’s demonstrators.
Mid-term dissemination report
Dissemination and Communication plans (D7.1)Report on the dissemination activities. Scientific results of the project will be presented at international conferences related to design and manufacturing of MEMS devices, materials and circuits for acoustic/US transducers, signal processing and ultrasound technologies and published in scientific and industrial journals. Moreover the dissemination activities will be supported through project web pages where project information materials, open access publications and public deliverables will be available to view and download.
Test & validation concept paper (D3.4.1)In order to enable test and functional validation (i.e. specification conformance) testing and validation concepts need to be specified. Typically every partner is driving its own supply chain, however since ultrasound physics is a relatively new domain for most partners, it asks for a higher level of interaction and collaboration. These to-be-developed concepts will cover test methodologies, test equipment, concepts to interprete measurement data, and, most important, the creation of feedback to the R&D engineers (device, application, technology, software, reliability, …). The target is a testing & validation concept paper in order to reduce the R&D cycle time.
Final Exploitation and Standardization report (D7.7)Final Exploitation and Standardization report
Electronics concepts document (D3.2.1)Based on the WP1 results and the outputs of task 3.1.1 and task 3.1.2 the design space will be exploited for the development of electronics concepts to meet the SILENSE use case requirements. The electronics concept will make the functional partitioning and electronics architecture for the different use case demonstrators available. The latter will be achieved by a thorough analysis and simulation of the crucial parts in the (digital) signal processing chain.
Micro Sound Transducers –summary (D2.5)Report summarizing the Micro Sound Transducers
Standardization plan and review of regulatory situation and standards (D7.3)In order to rely on current standards and to develop the project well aligned with the existing standards and to make sure that the outcomes of the project will influence the standardization bodies, it is planned, within this task, to develop a standardization plan and to contribute to existing and/or new standards. Especially effort on standardization of gesture events for several application domains (mobile, automotive, smart homes, production lines, etc.) will be of the main focus. Also standards (under development) related to ergonomics of human-system interaction will be addressed. In addition to standards, regulations with respect to privacy, security and safety will be of interest.
Final dissemination report (D7.6)Final dissemination report
Review of regulatory situation, standards, available information on environmental and health effects and investigation of US interference effects (D1.3)The regulatory situation for the widespread use of ultrasound will be investigated and possible effects on health or e.g. animals/pets will be assessed. In addition existing standards will be reviewed. The widespread distribution of ultrasound sensors in our living environment has many advantages from a technical point of view. To be able to cover such a widespread distribution, extra attention needs to be paid to the unwanted side-effects of a large number of ultrasound transmitters on man and its environment, and the interference effect of ultrasound devices. A thorough literature study will be performed, resulting in an overview of ultrasonic frequency ranges heard by animals, possible sub-harmonics due to resonance of widespread objects and materials in frequency ranges that may be heard by humans and possible interference with human body tissue. Also legislation concerning the use of ultrasonic frequencies will be researched. This will be combined in an ultrasonic frequency map.
Application analysis and definition of use cases – final (D1.1.2)This report will describe the work done on analysis on the chosen applications areas automotive, smart buildings/homes, and mobile and wearables. The pros and cons of ultra- infrasound technology versus other technology (such as radar) for these use cases will be assessed as well.
Preliminary application analysis and definition of use cases (D1.1.1)In this deliverable the chosen applications areas automotive, smart buildings/homes, and mobile and wearables will be analysed and appropriate use cases will be worked out in more details. The pros and cons of ultrasound technology versus other technology (such as radar) for these use cases will be assessed as well. System level models for the different use cases will be developed and the feasibility investigated. One of the main focus points will be consideration of a multi-level system with highly-improved power efficiency. At the use case level, this will translate into the definition of a system dedicated to several applications, and then, several power budget scenarios. Use cases: • Mobile-wearable use cases, the best mobile SOC system architecture/split to optimize cost, performance, latency and power for an ‘always on’ scenario will be defined. An optimum SW architecture in terms of cost, power, performance, latency and SW LoE will be defined. The need of dedicated ultrasound CPU in AP or possibility to time share with current CPUs in AP will be assessed. • Smart home/ smart building use cases will follow a similar approach as for the mobile use cases. • Automotive use cases, requirements collection that a new ultrasonic component should fulfil related to environmental and electrical conditions for automotive industry. Some specific requirements related to automotive industrial process will be defined, to take it into account from the beginning in the new ultrasonic component definition.
The SILENSE partners will create a design and simulation environment optimized for ultrasound, by further advancing the models and EDA design tools in order to match the electronics with the other elements (for which the MEMS transducers are the most important ones). A MEMS-IC co-design should enable evaluation of the system specification, such as SNR, dynamic range, harmonic distortion or maximum acoustic input. The main challenge for the designers comes from the fact that different design communities have to be aligned. The ultrasound experts are using different tools and are far away from using standard design flow. The advances in this task will enable new application to be developed faster and with much lower risks for design errors.
Publications
Auteurs:
Emad A. Ibrahim, Marc Geilen, Min Li, Jose Pineda De Gyvez
Publié dans:
IEEE Access, Numéro 8, 2020, Page(s) 191204-191218, ISSN 2169-3536
Éditeur:
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DOI:
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Auteurs:
Macedonia, Manuela; Hammer, Florian; Weichselbaum, Otto
Publié dans:
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Éditeur:
Frontiers Research Foundation
DOI:
10.3389/fpsyg.2018.00927
Auteurs:
Florian Hammer, Sebastian Egger-Lampl, Sebastian Möller
Publié dans:
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Éditeur:
Springer International Publishing
DOI:
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Auteurs:
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Éditeur:
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DOI:
10.1088/1361-6439/ab1f41
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Publié dans:
IEEE Signal Processing Magazine, Numéro 36/3, 2019, Page(s) 118-123, ISSN 1053-5888
Éditeur:
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DOI:
10.1109/msp.2019.2900721
Auteurs:
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Publié dans:
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Éditeur:
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DOI:
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Auteurs:
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Publié dans:
IEEE Journal on Emerging and Selected Topics in Circuits and Systems, Numéro 9/1, 2019, Page(s) 133-148, ISSN 2156-3357
Éditeur:
IEEE Circuits and Systems Society
DOI:
10.1109/jetcas.2018.2885981
Auteurs:
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Publié dans:
Micromachines, Numéro 11/6, 2020, Page(s) 564, ISSN 2072-666X
Éditeur:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/mi11060564
Auteurs:
Huang, Chih-Hsien; Hang, Gao; Torri, Guilherme Brondani; Mao, Shengping; Jeong, Yongbin; Cheyns, David; Rochus, Veronique; Rottenberg, Xavier
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2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Numéro 15-18 April 2018, 2018, Page(s) 4, ISBN 978-1-5386-2359-6
Éditeur:
IEEE
Auteurs:
Ali Roshanghias, Ying Ma, Marc Dreissigacker, Tanja Braun, Christian Bretthauer, Karl-F. Becker, Martin Schneider-Ramelow
Publié dans:
Proceedings, Numéro 2/13, 2018, Page(s) 703, ISSN 2504-3900
Éditeur:
MDPI AG
DOI:
10.3390/proceedings2130703
Auteurs:
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Publié dans:
2018 IEEE International Ultrasonics Symposium (IUS), Numéro 22-25 Oct. 2018, 2018, Page(s) 1-4, ISBN 978-1-5386-3425-7
Éditeur:
IEEE
DOI:
10.1109/ultsym.2018.8579980
Auteurs:
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Publié dans:
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Éditeur:
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Auteurs:
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Publié dans:
2018 IEEE 20th Electronics Packaging Technology Conference, Numéro 4-7 December 2018, 2018, Page(s) 580-584, ISBN 978-1-5386-7668-4
Éditeur:
IEEE
DOI:
10.1109/eptc.2018.8654382
Auteurs:
Raissa Likhonina
Publié dans:
2019 8th Mediterranean Conference on Embedded Computing (MECO), Numéro 10-14 June 2019, 2019, Page(s) 1-6, ISBN 978-1-7281-1740-9
Éditeur:
IEEE
DOI:
10.1109/meco.2019.8760063
Auteurs:
Paul van Neer, Arno Volker, Arthur Berkhoff, Thijs Schrama, Hylke Akkerman, Albert van Breemen, Laurens Peeters, Jan-Laurens van der Steen, Gerwin Gelinck
Publié dans:
2019 International Congress on Ultrasonics, Numéro 3-6 September 2019, 2019, Page(s) 045008
Éditeur:
ASA
DOI:
10.1121/2.0001068
Auteurs:
Emad A. Ibrahim, Jos Huisken, Hamed Fatemi, Jose Pineda de Gyvez
Publié dans:
2019 22nd Euromicro Conference on Digital System Design (DSD), Numéro 28-30 August 2019, 2019, Page(s) 313-319, ISBN 978-1-7281-2862-7
Éditeur:
IEEE
DOI:
10.1109/dsd.2019.00053
Auteurs:
Daniel Lagler, Sebastian Anzinger, Eugen Pfann, Alessandra Fusco, Christian Bretthauer, Mario Huemer
Publié dans:
2019 IEEE International Ultrasonics Symposium (IUS), Numéro 6-9 October 2019, 2019, Page(s) 2533-2536, ISBN 978-1-7281-4596-9
Éditeur:
IEEE
DOI:
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Auteurs:
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Éditeur:
IEEE
DOI:
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Auteurs:
Chao Cao, Marius Preda, Titus Zaharia
Publié dans:
The 24th International Conference on 3D Web Technology, Numéro 26-28 July 2019, 2019, Page(s) 1-9, ISBN 9781-450367981
Éditeur:
ACM
DOI:
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Auteurs:
Sebastian Anzinger, Fabian Lickert, Alessandra Fusco, Gabriele Bosetti, David Tumpold, Christian Bretthauer, Alfons Dehe
Publié dans:
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Numéro 18-22 January 2020, 2020, Page(s) 853-856, ISBN 978-1-7281-3581-6
Éditeur:
IEEE
DOI:
10.1109/mems46641.2020.9056182
Auteurs:
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Publié dans:
2019 IEEE International Workshop on Signal Processing Systems (SiPS), Numéro 20-23 October 2019, 2019, Page(s) 172-177, ISBN 978-1-7281-1927-4
Éditeur:
IEEE
DOI:
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Auteurs:
Sebastian Anzinger, Christian Bretthauer, Johannes Manz, Ulrich Krumbein, Alfons Dehe
Publié dans:
2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), Numéro 23-27 June 2019, 2019, Page(s) 865-868, ISBN 978-1-5386-8104-6
Éditeur:
IEEE
DOI:
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Auteurs:
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Publié dans:
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Éditeur:
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Auteurs:
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Publié dans:
2019 MiNaPAD (Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum), 2019
Éditeur:
IEEE Electronics Packaging Society
Auteurs:
Dreissigacker, M.; Roshanghias, A.; Becker K.-F.; Braun, T.;Schneider-Ramelow, M.; Lang, K.-D.
Publié dans:
Proceedings of MikroSystemTechnik Kongress 2019, 2019
Éditeur:
VDE/VDI-Ges. Mikroelektronik Mikrosystem- u. Feinwerktechnik
Auteurs:
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Publié dans:
Proceedings Design, Automation and Test in Europe Conference, DATE 2020, 2020, ISBN 978-3-9819263-4-7
Éditeur:
European Design and Automation Association (EDAA)
Auteurs:
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Publié dans:
2019
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Kohout, Lukas
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2018
Éditeur:
UTIA AV CR, v.v.i.
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Publié dans:
2018
Éditeur:
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2017
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Publié dans:
2019
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Pohl Zdenek, Kohout Lukas
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