Deliverables
Demonstrator performance and validation results for all the project’s demonstrators.
Mid-term dissemination report
Dissemination and Communication plans (D7.1)Report on the dissemination activities. Scientific results of the project will be presented at international conferences related to design and manufacturing of MEMS devices, materials and circuits for acoustic/US transducers, signal processing and ultrasound technologies and published in scientific and industrial journals. Moreover the dissemination activities will be supported through project web pages where project information materials, open access publications and public deliverables will be available to view and download.
Test & validation concept paper (D3.4.1)In order to enable test and functional validation (i.e. specification conformance) testing and validation concepts need to be specified. Typically every partner is driving its own supply chain, however since ultrasound physics is a relatively new domain for most partners, it asks for a higher level of interaction and collaboration. These to-be-developed concepts will cover test methodologies, test equipment, concepts to interprete measurement data, and, most important, the creation of feedback to the R&D engineers (device, application, technology, software, reliability, …). The target is a testing & validation concept paper in order to reduce the R&D cycle time.
Final Exploitation and Standardization report (D7.7)Final Exploitation and Standardization report
Electronics concepts document (D3.2.1)Based on the WP1 results and the outputs of task 3.1.1 and task 3.1.2 the design space will be exploited for the development of electronics concepts to meet the SILENSE use case requirements. The electronics concept will make the functional partitioning and electronics architecture for the different use case demonstrators available. The latter will be achieved by a thorough analysis and simulation of the crucial parts in the (digital) signal processing chain.
Micro Sound Transducers –summary (D2.5)Report summarizing the Micro Sound Transducers
Standardization plan and review of regulatory situation and standards (D7.3)In order to rely on current standards and to develop the project well aligned with the existing standards and to make sure that the outcomes of the project will influence the standardization bodies, it is planned, within this task, to develop a standardization plan and to contribute to existing and/or new standards. Especially effort on standardization of gesture events for several application domains (mobile, automotive, smart homes, production lines, etc.) will be of the main focus. Also standards (under development) related to ergonomics of human-system interaction will be addressed. In addition to standards, regulations with respect to privacy, security and safety will be of interest.
Final dissemination report (D7.6)Final dissemination report
Review of regulatory situation, standards, available information on environmental and health effects and investigation of US interference effects (D1.3)The regulatory situation for the widespread use of ultrasound will be investigated and possible effects on health or e.g. animals/pets will be assessed. In addition existing standards will be reviewed. The widespread distribution of ultrasound sensors in our living environment has many advantages from a technical point of view. To be able to cover such a widespread distribution, extra attention needs to be paid to the unwanted side-effects of a large number of ultrasound transmitters on man and its environment, and the interference effect of ultrasound devices. A thorough literature study will be performed, resulting in an overview of ultrasonic frequency ranges heard by animals, possible sub-harmonics due to resonance of widespread objects and materials in frequency ranges that may be heard by humans and possible interference with human body tissue. Also legislation concerning the use of ultrasonic frequencies will be researched. This will be combined in an ultrasonic frequency map.
Application analysis and definition of use cases – final (D1.1.2)This report will describe the work done on analysis on the chosen applications areas automotive, smart buildings/homes, and mobile and wearables. The pros and cons of ultra- infrasound technology versus other technology (such as radar) for these use cases will be assessed as well.
Preliminary application analysis and definition of use cases (D1.1.1)In this deliverable the chosen applications areas automotive, smart buildings/homes, and mobile and wearables will be analysed and appropriate use cases will be worked out in more details. The pros and cons of ultrasound technology versus other technology (such as radar) for these use cases will be assessed as well. System level models for the different use cases will be developed and the feasibility investigated. One of the main focus points will be consideration of a multi-level system with highly-improved power efficiency. At the use case level, this will translate into the definition of a system dedicated to several applications, and then, several power budget scenarios. Use cases: • Mobile-wearable use cases, the best mobile SOC system architecture/split to optimize cost, performance, latency and power for an ‘always on’ scenario will be defined. An optimum SW architecture in terms of cost, power, performance, latency and SW LoE will be defined. The need of dedicated ultrasound CPU in AP or possibility to time share with current CPUs in AP will be assessed. • Smart home/ smart building use cases will follow a similar approach as for the mobile use cases. • Automotive use cases, requirements collection that a new ultrasonic component should fulfil related to environmental and electrical conditions for automotive industry. Some specific requirements related to automotive industrial process will be defined, to take it into account from the beginning in the new ultrasonic component definition.
The SILENSE partners will create a design and simulation environment optimized for ultrasound, by further advancing the models and EDA design tools in order to match the electronics with the other elements (for which the MEMS transducers are the most important ones). A MEMS-IC co-design should enable evaluation of the system specification, such as SNR, dynamic range, harmonic distortion or maximum acoustic input. The main challenge for the designers comes from the fact that different design communities have to be aligned. The ultrasound experts are using different tools and are far away from using standard design flow. The advances in this task will enable new application to be developed faster and with much lower risks for design errors.
Publications
Author(s):
Emad A. Ibrahim, Marc Geilen, Min Li, Jose Pineda De Gyvez
Published in:
IEEE Access, Issue 8, 2020, Page(s) 191204-191218, ISSN 2169-3536
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2020.3031677
Author(s):
Macedonia, Manuela; Hammer, Florian; Weichselbaum, Otto
Published in:
Frontiers in Psychology, Issue Vol. 9, Article 927, 2018, Page(s) 6, ISSN 1664-1078
Publisher:
Frontiers Research Foundation
DOI:
10.3389/fpsyg.2018.00927
Author(s):
Florian Hammer, Sebastian Egger-Lampl, Sebastian Möller
Published in:
Quality and User Experience, Issue 3/1, 2018, Page(s) 15, ISSN 2366-0147
Publisher:
Springer International Publishing
DOI:
10.1007/s41233-018-0022-0
Author(s):
Pieter Gijsenbergh, Alexandre Halbach, Yongbin Jeong, Guilherme Brondani Torri, Margo Billen, Libertario Demi, Chih-Hsien Huang, David Cheyns, Xavier Rottenberg, Veronique Rochus
Published in:
Journal of Micromechanics and Microengineering, Issue 29/7, 2019, Page(s) 074001, ISSN 0960-1317
Publisher:
Institute of Physics Publishing
DOI:
10.1088/1361-6439/ab1f41
Author(s):
Euee S. Jang, Marius Preda, Khaled Mammou, Alexis M. Tourapis, Jungsun Kim, Danillo B. Graziosi, Sungryeul Rhyu, Madhukar Budagavi
Published in:
IEEE Signal Processing Magazine, Issue 36/3, 2019, Page(s) 118-123, ISSN 1053-5888
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/msp.2019.2900721
Author(s):
Li Cui, Rufael Mekuria, Marius Preda, Euee S. Jang
Published in:
IEEE Consumer Electronics Magazine, Issue 8/4, 2019, Page(s) 17-21, ISSN 2162-2256
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/mce.2019.2905483
Author(s):
Sebastian Schwarz, Marius Preda, Vittorio Baroncini, Madhukar Budagavi, Pablo Cesar, Philip A. Chou, Robert A. Cohen, Maja Krivokuca, Sebastien Lasserre, Zhu Li, Joan Llach, Khaled Mammou, Rufael Mekuria, Ohji Nakagami, Ernestasia Siahaan, Ali Tabatabai, Alexis M. Tourapis, Vladyslav Zakharchenko
Published in:
IEEE Journal on Emerging and Selected Topics in Circuits and Systems, Issue 9/1, 2019, Page(s) 133-148, ISSN 2156-3357
Publisher:
IEEE Circuits and Systems Society
DOI:
10.1109/jetcas.2018.2885981
Author(s):
Ali Roshanghias, Marc Dreissigacker, Christina Scherf, Christian Bretthauer, Lukas Rauter, Johanna Zikulnig, Tanja Braun, Karl-F. Becker, Sven Rzepka, Martin Schneider-Ramelow
Published in:
Micromachines, Issue 11/6, 2020, Page(s) 564, ISSN 2072-666X
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/mi11060564
Author(s):
Huang, Chih-Hsien; Hang, Gao; Torri, Guilherme Brondani; Mao, Shengping; Jeong, Yongbin; Cheyns, David; Rochus, Veronique; Rottenberg, Xavier
Published in:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Issue 15-18 April 2018, 2018, Page(s) 4, ISBN 978-1-5386-2359-6
Publisher:
IEEE
Author(s):
Ali Roshanghias, Ying Ma, Marc Dreissigacker, Tanja Braun, Christian Bretthauer, Karl-F. Becker, Martin Schneider-Ramelow
Published in:
Proceedings, Issue 2/13, 2018, Page(s) 703, ISSN 2504-3900
Publisher:
MDPI AG
DOI:
10.3390/proceedings2130703
Author(s):
P.L.M.J. van Neer, A.W.F. Volker, A.P. Berkhoff, H.B. Akkerman, T. Schrama, A. van Breemen, G.H. Gelinck
Published in:
2018 IEEE International Ultrasonics Symposium (IUS), Issue 22-25 Oct. 2018, 2018, Page(s) 1-4, ISBN 978-1-5386-3425-7
Publisher:
IEEE
DOI:
10.1109/ultsym.2018.8579980
Author(s):
Cheyns D., Demi L., Huang C.H., Jeong Y., Mao S., Rochus V., Rottenberg X.
Published in:
TechConnect Briefs, Issue 4, Informatics, Electronics and Microsystems: TechConnect Briefs 2018, 2018, Page(s) 161-164, ISBN 978-0-9988782-1-8
Publisher:
TechConnect
Author(s):
Jan Albrecht ; Marie Weissbach ; Matthias Vobl ; Ulrich Krumbein ; Sven Rzepka
Published in:
2018 IEEE 20th Electronics Packaging Technology Conference, Issue 4-7 December 2018, 2018, Page(s) 580-584, ISBN 978-1-5386-7668-4
Publisher:
IEEE
DOI:
10.1109/eptc.2018.8654382
Author(s):
Raissa Likhonina
Published in:
2019 8th Mediterranean Conference on Embedded Computing (MECO), Issue 10-14 June 2019, 2019, Page(s) 1-6, ISBN 978-1-7281-1740-9
Publisher:
IEEE
DOI:
10.1109/meco.2019.8760063
Author(s):
Paul van Neer, Arno Volker, Arthur Berkhoff, Thijs Schrama, Hylke Akkerman, Albert van Breemen, Laurens Peeters, Jan-Laurens van der Steen, Gerwin Gelinck
Published in:
2019 International Congress on Ultrasonics, Issue 3-6 September 2019, 2019, Page(s) 045008
Publisher:
ASA
DOI:
10.1121/2.0001068
Author(s):
Emad A. Ibrahim, Jos Huisken, Hamed Fatemi, Jose Pineda de Gyvez
Published in:
2019 22nd Euromicro Conference on Digital System Design (DSD), Issue 28-30 August 2019, 2019, Page(s) 313-319, ISBN 978-1-7281-2862-7
Publisher:
IEEE
DOI:
10.1109/dsd.2019.00053
Author(s):
Daniel Lagler, Sebastian Anzinger, Eugen Pfann, Alessandra Fusco, Christian Bretthauer, Mario Huemer
Published in:
2019 IEEE International Ultrasonics Symposium (IUS), Issue 6-9 October 2019, 2019, Page(s) 2533-2536, ISBN 978-1-7281-4596-9
Publisher:
IEEE
DOI:
10.1109/ultsym.2019.8925554
Author(s):
L. C. J. M. Peters, R. Ollearo, R. G. F. A. Verbeek, J. L. P. J. van der Steen, H. B. Akkerman, A. W. F. Volker, P. L. M. J. van Neer, G. H. Gelinck
Published in:
2019 IEEE International Ultrasonics Symposium (IUS), Issue 6-9 October 2019, 2019, Page(s) 60-63, ISBN 978-1-7281-4596-9
Publisher:
IEEE
DOI:
10.1109/ultsym.2019.8926238
Author(s):
Chao Cao, Marius Preda, Titus Zaharia
Published in:
The 24th International Conference on 3D Web Technology, Issue 26-28 July 2019, 2019, Page(s) 1-9, ISBN 9781-450367981
Publisher:
ACM
DOI:
10.1145/3329714.3338130
Author(s):
Sebastian Anzinger, Fabian Lickert, Alessandra Fusco, Gabriele Bosetti, David Tumpold, Christian Bretthauer, Alfons Dehe
Published in:
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Issue 18-22 January 2020, 2020, Page(s) 853-856, ISBN 978-1-7281-3581-6
Publisher:
IEEE
DOI:
10.1109/mems46641.2020.9056182
Author(s):
Emad A. Ibrahim, Min Li, Jose Pineda de Gyvez
Published in:
2019 IEEE International Workshop on Signal Processing Systems (SiPS), Issue 20-23 October 2019, 2019, Page(s) 172-177, ISBN 978-1-7281-1927-4
Publisher:
IEEE
DOI:
10.1109/sips47522.2019.9020579
Author(s):
Sebastian Anzinger, Christian Bretthauer, Johannes Manz, Ulrich Krumbein, Alfons Dehe
Published in:
2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), Issue 23-27 June 2019, 2019, Page(s) 865-868, ISBN 978-1-5386-8104-6
Publisher:
IEEE
DOI:
10.1109/transducers.2019.8808264
Author(s):
Lafruit, G., Schenkel, A., Tulvan, C. L., Preda, M., Yu, L.
Published in:
Proceedings of IBC 2018, Issue 11-14 September 2018, 2018, Page(s) 9
Publisher:
IBC
Author(s):
Roshanghias, A., Dreissigacker, M.
Published in:
2019 MiNaPAD (Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum), 2019
Publisher:
IEEE Electronics Packaging Society
Author(s):
Dreissigacker, M.; Roshanghias, A.; Becker K.-F.; Braun, T.;Schneider-Ramelow, M.; Lang, K.-D.
Published in:
Proceedings of MikroSystemTechnik Kongress 2019, 2019
Publisher:
VDE/VDI-Ges. Mikroelektronik Mikrosystem- u. Feinwerktechnik
Author(s):
Ibrahim, E., Geilen, M. C. W., Huisken, J. A., Li, M., & Pineda de Gyvez, J.
Published in:
Proceedings Design, Automation and Test in Europe Conference, DATE 2020, 2020, ISBN 978-3-9819263-4-7
Publisher:
European Design and Automation Association (EDAA)
Author(s):
Pohl, Zdenek
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2019
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UTIA AV CR, v.v.i.
Author(s):
Kohout, Lukas
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2018
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UTIA AV CR, v.v.i.
Author(s):
Likhonina, Raissa; Kadlec, Jiri
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2018
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UTIA AV CR, v.v.i.
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Kadlec, Jiri; Likhonina, Raissa
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2017
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UTIA AV CR, v.v.i.
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Pohl Zdenek, Kohout Lukas
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2019
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