Chip Scale Electrically Powered Optical Frequency Combs

Informations projet

ELECTRIC

N° de convention de subvention: 759483

DOI

10.3030/759483

Projet clôturé

Date de signature de la CE 8 Septembre 2017

Date de début 1 Février 2018

Date de fin 31 Juillet 2023

Financé au titre de

• EXCELLENT SCIENCE - European Research Council (ERC)

Coût total

€ 1 391 250,00

Contribution de l’UE

€ 1 391 250,00

Coordonné par

UNIVERSITEIT GENT
Belgium

Periodic Reporting for period 4 - ELECTRIC (Chip Scale Electrically Powered Optical Frequency Combs)

Période du rapport: 2022-08-01 au 2023-07-31

Résumé du contexte et des objectifs généraux du projet

Optical frequency combs (OFC) are light sources characterized by a spectrum comprising millions of laser lines, evenly distributed in frequency. This uniform frequency spacing establishes a crucial connection between the radiofrequency (RF) and optical frequency bands within the electromagnetic spectrum. This characteristic has profoundly transformed the fields of frequency metrology and precision laser spectroscopy. Recently, their application scope has expanded to encompass numerous new applications. Among these, their distinctive features have been harnessed in precision distance measurement experiments, as well as demonstrations of optical waveform and microwave synthesis.
Moreover, experiments in "dual-comb spectroscopy" have showcased broadband Fourier Transform Infrared (FTIR) spectroscopy with unprecedented resolution, sensitivity, and acquisition speeds. However, many of these demonstrations have relied on bulky experimental setups, hindering widespread deployment.
Our aim is to develop frequency combs on optical chips that can be mass-produced using CMOS technology. Unlike current chip-scale Kerr comb-based solutions, they do not require powerful continuous-wave laser optical pumping and can feature narrower comb spacing. In our project, conducted in collaboration with numerous partners, we have shown the feasibility of this approach. Specifically, we have demonstrated the ability to conduct dual-comb measurements of gases. This indicates low losses with sufficient resolution to resolve gas absorption lines.

Travail effectué depuis le début du projet jusqu’à la fin de la période considérée dans le rapport et principaux résultats atteints jusqu’à présent

We have successfully assembled a team of experts and acquired the necessary equipment to develop these combs. In Ghent, we have now established a critical mass of expertise in both the design and fabrication of these devices. Additionally, we have made investments in integrating lithium niobate into our devices. Currently, several team members are dedicated to this integration, primarily focusing on modulators and frequency converters.
These efforts have resulted in multiple bilateral projects with industry partners for further research. One notable project focuses on commercializing LIDAR technology using combs, while we've recently secured funding for an EIC transition grant (MOLOKAI), where we serve as the coordinator to advance the technology beyond the research phase.
Furthermore, we lead an EIC Pathfinder project (CSOC) investigating the potential use of mode-locked lasers in optical clocks. We've also initiated bilateral projects with several telecom and datacom giants to integrate lithium niobate into silicon photonics and silicon nitride photonics chips.
Lastly, through the Photonixfab JDK project, we are exploring methods to scale heterogeneous fabrication techniques for large-scale foundries such as X-Fab.

Progrès au-delà de l’état des connaissances et impact potentiel prévu (y compris l’impact socio-économique et les conséquences sociétales plus larges du projet jusqu’à présent)

As mentioned above, we have demonstrated the capability to mode-lock lasers with significant performance. This achievement was showcased in a highly demanding dual-comb spectroscopy application. Furthermore, these initial results are currently being scaled to the wafer level, marking the starting point of the transition grant Molokia. Additionally, we have proven our ability to integrate lithium niobate with devices. Although these devices are relatively large, making the transfer difficult, we have successfully shown feasibility. Our ongoing focus lies in scaling this integration to the wafer level. Through several bilateral projects with telecom and datacom companies, we aim to further showcase these capabilities.

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