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NanoWelds:First nanotechnology for the electronic industry based on a room-temperature welding process

Periodic Reporting for period 2 - NanoWelds (NanoWelds:First nanotechnology for the electronic industry based on a room-temperature welding process)

Reporting period: 2019-11-01 to 2020-10-31

NANOWELDS is a patented novel technology developed by NANOWIRED GMBH for joining microelectronics parts.
NANOWELDS is the only room-temperature bond with great electrical, thermal and mechanical properties, including high flexibility, that enables the joining and contacting of electronic components at room temperature. The result is a permanently solid, strong, flexible and highly conductive connection. The concept works in a similar way to Velcro, consisting of two steps
1. NanoWiring (chemical process): our machine grows microscopical metallic filaments (nanowires) on the two surfaces, resulting in pieces coated with a metallic grass-like field.
2. KlettWelding (physical process): these nanowires are pressed at room temperature and become entangled, binding the two surfaces together with a conductive and strong union.
During the project implementation, we will develop the necessary industrial equipment that enables to integrate, the first scalable nanotechnology that can join different surfaces with a fully-metallic conductive union at room temperature, in existing manufacturing lines.
The project challenge is to develop processes and equipment that will push the electronic packaging industry one step beyond by overcoming current limitations of soldering or gluing techniques.
Technical work
- Scale Up to 40x40cm² was successful. We run our machine with this large production area for our standard copper nanowiring process
- Optimize Chemistry and deposition parameters. NanoWired carried out a statistical experimental design to speed up the deposition. We are able to carry out a 50 µm deposition in 1 hour. So we can realize a 1 µm NanoWiring process in 1.2 minutes, what is suitable for most products with planar surfaces.
- Different Materials. We developed the NanoWiring Process for Nickel, Gold, Zinc and Silver. For all of these Materials we developed electrolytes and evaluated different deposition processes.
-Reduction of process variation. The process variation is reduced by different ways: We optimized the copper chemistry and we optimized the deposition parameters. Additionally we achieved a very low length variation of nanowires by using the template foil thickness to adjust the NanoWiring length. The KlettWelding variation is reduced by controlling the angle of the NanoWires.

Dissemination and commercialisation work
- We participated in the Hannover Fair in April 2019. There we won the Hermes Award, the most important industrial prize in Germany.
- We participated in the SMT Hybrid Fair in Nuremberg in May, a very important electronic assembly fair
- We participated in the Productronica Fair in Munich in November 2017 and 2019, a very important electronic fair
- We participated in 2 conferencen in 2020, the NMJ in Leipzig and the IMPACT-EMAP in Taiwan. Both Conferences were online events. We won the “Best Paper Award” at the IMPACT-EMAP Conference
- Additionally, we had several articles in journals throughout the year.
- We were a finalist of the “Falling-Walls” – Venture Competition in 2020
At the end of the project a complete nanowirng machine is supposed to be ready. NanoWirng then can sell these machines.
NanoWired then can equip all important manufacturers with this machine. NanoWiring then will become a key technology. This will keep and generate a lot of jobs all over Europe because it will help to maintain Europe’s Semiconductor industry competitive.
Also it will help to replace processes where today heavy metals, cyanides or other pollutants are needed. The NanoWiring process uses copper with no harmful chemicals.
Prototype V3
nanowiring process