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NanoWelds:First nanotechnology for the electronic industry based on a room-temperature welding process

Project description

Nanotechnology at the service of the electronics industry

Electronics manufacturing is one of the most innovative and fastest evolving industries. Technical challenges though, are slowing the rate of performance increases and size reductions. To address this problem, semiconductor and microelectronics industries have adopted a set of strategies such as the shift to 3D technology and the use of flexible printed circuit boards. However, going 3D is also bringing challenges both at the micro-level and at the industrial level. The German NanoWired GmbH developed a nanotechnology-based process that enables an easy and high-quality assembly and manufacturing of electronics at room temperature. Launching this solution to the market, the EU-funded NanoWelds project aims to push the chip and electronics industry one step beyond.


NanoWired GmbH is a high-tech startup that aims to introduce a completely new bonding process for the assembly and manufacturing of electronics. Our patented nanotechnology has been successfully scaled-up and now it is getting ready for its integration in real applications and manufacturing environments. In a record time since the creation of the company in 2017, we have achieved 19 pilot contracts with international giants. Electronics manufacturers face technical challenges that are slowing the rate of performance increases and size reductions. Trying to go 3D (stacking microchips vertically) or using flexible PCB’s are some of the new strategies in the semiconductor and microelectronic industry. However, going 3D is bringing challenges at the micro-level (e.g. the tighter density requires better heat dissipation) and at industrial level (e.g. high yields and scalability, cost-reductions, big investments in equipment, and difficult integration). NanoWired GmbH has developed a process that enables the joining and contacting of electronic components at room temperature. The prepared components simply have to be pressed together, like a metallic Velcro. The result is a permanently solid, strong, flexible and highly conductive connection. With this Phase 2, we will launch the equipment that will push the chip and electronic industry one step beyond by overcoming current limitations of soldering, bonding or gluing techniques. The market launch of NanoWelds represents the beginning of our sales activity planned for the second half of 2020. Three years after market launch, we will reach annual sales of 15.8M€ and an EBT of 14.89M€. Considering these projections and the investment needed for Phase 2 (approx. 3M€), the Return of Investment will be 3,96. Furthermore, with the support of the SME Instrument NanoWired GmbH will grow from 10 to 30 employees in the next five years.

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Net EU contribution
€ 2 098 775,00
64579 Gernsheim

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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Hessen Darmstadt Groß-Gerau
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Total cost
€ 2 998 250,00