Project description
Nanotechnology at the service of the electronics industry
Electronics manufacturing is one of the most innovative and fastest evolving industries. Technical challenges though, are slowing the rate of performance increases and size reductions. To address this problem, semiconductor and microelectronics industries have adopted a set of strategies such as the shift to 3D technology and the use of flexible printed circuit boards. However, going 3D is also bringing challenges both at the micro-level and at the industrial level. The German NanoWired GmbH developed a nanotechnology-based process that enables an easy and high-quality assembly and manufacturing of electronics at room temperature. Launching this solution to the market, the EU-funded NanoWelds project aims to push the chip and electronics industry one step beyond.
Objective
NanoWired GmbH is a high-tech startup that aims to introduce a completely new bonding process for the assembly and manufacturing of electronics. Our patented nanotechnology has been successfully scaled-up and now it is getting ready for its integration in real applications and manufacturing environments. In a record time since the creation of the company in 2017, we have achieved 19 pilot contracts with international giants. Electronics manufacturers face technical challenges that are slowing the rate of performance increases and size reductions. Trying to go 3D (stacking microchips vertically) or using flexible PCB’s are some of the new strategies in the semiconductor and microelectronic industry. However, going 3D is bringing challenges at the micro-level (e.g. the tighter density requires better heat dissipation) and at industrial level (e.g. high yields and scalability, cost-reductions, big investments in equipment, and difficult integration). NanoWired GmbH has developed a process that enables the joining and contacting of electronic components at room temperature. The prepared components simply have to be pressed together, like a metallic Velcro. The result is a permanently solid, strong, flexible and highly conductive connection. With this Phase 2, we will launch the equipment that will push the chip and electronic industry one step beyond by overcoming current limitations of soldering, bonding or gluing techniques. The market launch of NanoWelds represents the beginning of our sales activity planned for the second half of 2020. Three years after market launch, we will reach annual sales of 15.8M€ and an EBT of 14.89M€. Considering these projections and the investment needed for Phase 2 (approx. 3M€), the Return of Investment will be 3,96. Furthermore, with the support of the SME Instrument NanoWired GmbH will grow from 10 to 30 employees in the next five years.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- natural sciences chemical sciences inorganic chemistry inorganic compounds
- natural sciences chemical sciences inorganic chemistry transition metals
- engineering and technology nanotechnology
- natural sciences physical sciences electromagnetism and electronics semiconductivity
- natural sciences physical sciences electromagnetism and electronics microelectronics
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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H2020-EU.2.3. - INDUSTRIAL LEADERSHIP - Innovation In SMEs
MAIN PROGRAMME
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H2020-EU.3. - PRIORITY 'Societal challenges
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H2020-EU.2.1. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
SME-2 - SME instrument phase 2
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) H2020-EIC-SMEInst-2018-2020
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
64579 GERNSHEIM
Germany
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.