Achieving ultraviolet (UV) emission has proven to be difficult, in particular for microcavity lasers due to high optical losses and high defect densities in aluminum gallium nitride (AlGaN), the material of choice for UV. The aim of UV-LASE is to develop the first electrically injected blue microcavity laser with good enough performance to be useful in real-world applications and project out of the blue and into the ultraviolet to realize the very first electrically injected UV microcavity laser.
Compared to edge-emitting lasers, microcavity lasers have a number of inherent advantages such as low threshold current, circular-symmetric low-divergent output beam, high modulation speed at low drive currents, ease to fabricate into two-dimensional arrays, and low-cost manufacturing due to on wafer-testing. Such devices would be of interest to numerous applications such as solid-state lighting, photolithography, biomedical applications, enhancing health-promoting substances in plants, gas sensing, UV curing and sterilization.
UV-LASE is based upon two recent breakthroughs by our group:
• The discovery of an overlooked loss mechanism in the AlGaN-laser cavity. Our proposed designs to circumvent this loss are now being implemented worldwide and have led to record-high optical output power in blue-emitting lasers of 15.7 mW in contrast to previous best results of ~1 mW.
• A unique membrane technique to enable microcavity lasers with highly reflective dielectric mirrors on both sides of the cavity. This is a device concept that up to this point was un-realizable for UV-lasers. The new method is based upon an electrochemical etching of the otherwise chemically inert AlGaN, and allows for lift-off of device membranes with record-smooth surfaces from the substrate and mirror-deposition on the bottom side.
The reach the goals, the membrane technology will be pushed to its limits to enable underetching of even higher Al containing materials, i.e. materials for UVC (<280 nm) emission. The underetching is based upon process where highly conductive layers are etched in front of lower conductive layers. It will thus be a challenge to make this technology compatible with doped device structures, ensuring that the electrically conductive device layers do not etch or porosify.