Periodic Reporting for period 2 - POETICS (CoPackaging of Terabit direct-detection and coherent Optical Engines and switching circuits in mulTI-Chip moduleS for Datacenter networks and the 5G optical fronthaul)
Reporting period: 2021-07-01 to 2023-12-31
POETICS project started in January 1st 2022, with the strategic objective to develop the underlying technology in Europe for the development of the required transceivers for intra-DC and inter-DC connectivity to allow the graceful scaling of the modern DCs and the transition to the next generation GbE optical interfaces.
More specifically POETICS targeted to develop novel Terabit optical engines and optical switching circuits and co-package them with digital switching chips to realize Multi-Chip Modules for the next generation switching equipment with Tb/s capacities that fit into the roadmap of vendors.
WP2: POETICS identified the application scenarios for the deployment of the targeted Terabit and optical switches in optical networks and intra-DC networks. The most relevant trends in different Data Centers and network architectures have been studied, and meaningful use cases identified. The high-level requirements and specifications of POETICS optical engines, the design concepts and the assembly/packaging processes defined. System-level simulation models for evaluating the transmission performance of the Terabit MCMs and coherent transceivers and DSP configuration algorithms have been developed and evaluated.
WP3: All photonic components and motherboards of POETICS prototypes have been developed. High-speed 4-fold InP EML arrays (see Fig.1) designed and fabricated for uncooled operation in the O-band, together with high-bandwidth PD arrays. InP phase section arrays (edge-coupled and flip-chip compatible), InP gain chips, balanced PD arrays, and a narrow linewidth tunable laser (output power of >40mW, ~140nm wavelength tunability) (see Fig.2) have been successfully developed. 2D PolyBoards for the optical transceiver modules developed and upon significant improvements in the fabrication process and implementation of new basic components the 3D PolyBoard MCF interposer, manufactured. For the coherent modules, 2D PolyBoard fabricated and several building blocks have been developed for the TriPleX part, e.g. 2x4 MMI based hybrid mixers and RF-lines. Finally, a dedicated multilevel etch depth process was developed to enable the flip chip assembly of InP chips onto the TriPleX platform and a completely new manufacturing process was developed for the successful manufacturing of the flip-chip compatible PolyBoard.
WP4: A key milestone of POETICS has been achieved with the development of the monolithically integrated high-bandwidth SiGe electronic circuits for 100Gbaud operation with PAM-4 modulation format. In specific, a fully integrated 100GBaud quad-channel SiGe Transmitter IC including 2:1 analog signal multiplexers, a 100Gbaud quad array of high-bandwidth TIAs and a 100GBaud single-channel SiGe analog 1:4 signal demultiplexer IC have been successfully developed and thoroughly tested, exhibiting very good operation, at full speed (see Fig.3).
An appropriate 800G 5nm DSP device selected from MLNX suppliers and tested for the development of the 800Gb/s multi-chip module POE-1. Moreover the circuits boards for all Terabit modules, the optical switch and the coherent transceiver module POE-5 have been designed and fabricated.
WP5: A key milestone and innovation of POETICS has been achieved with the successful assembly and packaging of two (2) prototypes of the 1.6Tb/s POE-2 module (see Fig.4). In this context, PHIX has introduced innovative RF FlexLine flip-chip bonding processes and techniques, and a high-speed evaluation PCB board has been successfully fabricated and populated. In addition, a 3D 16x16 Benes optical switch demonstrator module (POE-4) has been successfully assembled and delivered and the optical 800 Gb/s POE-1 transceiver has been integrated, and packaged with its corresponding 5 nm DSP chip (open platform POE-1 and the POE-1 CPO module). Finally, the flip-chip integration techniques and processes for the integration of InP dies onto PolyBoard and TriPleX photonic platforms defined and successfully implemented for the integration of InP phase section arrays onto the PolyBoard.
WP6: The experimental testbeds at lab settings and in intra-DC and quasi-real DC interconnect were setup for the characterization of POETICS optical transceivers and optical switch. The tests of the POETICS Multi-chip Modules 1.6 Tb/s transceivers have demonstrated successful operation at single channel 100 GBaud PAM-4 for a total supported capacity of 200 Gb/s. Optical transmission tests have been carried out for typical distances in intra-DC networks of 2 km and 10 km showing exceptional results, and the possibility to extend the distance to 20 km with good quality has been showcased. Extension to higher symbol rates using the same transceiver, showing transmission of 120 GBaud NRZ signals of good quality. Furthermore, transmission tests employing the 3D optical 16x16 Benes switch have been performed showing full reconfigurability, using NRZ and PAM-4 signals of up to 30 GBaud symbol rate.
WP7: Each partner developed its individual exploitation and business plan. On the communication and dissemination front, extroversion was exercised by intensifying the transmissions through the social and other media, and participating in major events. 14 scientific articles, acknowledging POETICS published and are available via ‘gold’ or ‘green’ open access. Techno-economic analysis have been carried out. Market surveys and technology roadmaps were analyzed to ensure the project targets remain relevant and impactful after the project end. IPR in relevant topics are tracked and evaluated.
4-fold EML arrays for uncooled operation in the O-band, with > 67 GHz bandwidth and output power >8dBm and InP phase section arrays, suitable for 64Gbaud operation in the C-bandd were developed. Both single gain and dual gain ECLs have been realized, with optical output power ~150mW, >135 nm tuning range and a SMSR of >45dB that can be used as a high power standalone tunable laser. The expansion of the 3D PolyBoard platform with new basic components and combinations of 3D elements was a significant step forward, as a low-cost way to scale multiple photonic and electronic dies.
Powerful mixed-signal 100Gbaud SiGe BiCMOS electronics were developed for both the optical transmitter and receiver, scalable towards future transceiver generation.
At the system level, POETICS combined innovative RF FlexLine flip-chip bonding processes and integration techniques to realize the targeted high-speed optical transceivers demonstrating >100 Gbaud PAM4 signal transmission per channel, of a total of 1.6 Tb/s per transceiver.
Simulation results and experimental data from the evaluation of POETICS modules, have been gathered and have been made available to the public through the Zenodo repository.