RISC-V Digital Architecture for the Next Generation of Connected Era

Participation in RISC-V Foundation Roadshow (EU, APAC)

Active participation in EPI (European Processor Initiative), RISC-V foundation at the organization committee level, CHIPS Alliance. Further, with both local and interrnational technical marketing teams cooperating, establish and execute a plan to improve awareness of Codasip among companies in the EU and APAC semiconductor market. This includes participation in local alliences, local events, translation of key documents to German, French, Japan, and Chinese and exploitation of local media including social media. Active participation at EUROHPC summit week starting 2020 (European technology platform for HPC). Support of EuroHPC Undertaking in open calls if topics will be relevant.

Next strategic steps for RISC-V standard evolution

Active participation in EPI (European Processor Initiative), RISC-V foundation at the organization committee level, CHIPS Alliance. Further, with both local and interrnational technical marketing teams cooperating, establish and execute a plan to improve awareness of Codasip among companies in the EU and APAC semiconductor market.

Patents filed, Trademarkes and Copyrights registered before market entry

Continue to deploy Codasip IPR strategy on informal protection, ensure all relevant processes reflect IPR and regulatory elements and prevent fraud or leakage of information. Establish review plan covering encryption, secure documentation filing, system access criteria and level of secrecy, etc.

New corporate presentation materials

Prepare new corporate presentation materials.

Press release announcing partnership formation

Prepare and process press release

Minimum of 4 or more industry articles including contributed content to 3rd party articles

Increase outbound marketing communications via all available channels to inform potential customers of Codasip new product development activities, design wins, and partner news. Will use the following marketing tools available to us: · Industry press: enter sponsorship agreements with Design and Reuse and Semiconductor Engineering · Industry events: Attend and exhibit at all RISC-V Foundation sponsored events, ICCAD, Design Solution Forum · Website: update and improve Codasip.com, distribute press releases · Collateral generation: draft and distribute industry relevant technical white papers and product specific application note

Contribute content (articles, blogs) to APAC industry publications

Contribution of content (articles, blogs) to APAC industry publications

Minimum of 5 or more press releases

Increase outbound marketing communications via all available channels to inform potential customers of Codasip new product development activities, design wins, and partner news. Will use the following marketing tools available to us: · Industry press: enter sponsorship agreements with Design and Reuse and Semiconductor Engineering · Industry events: Attend and exhibit at all RISC-V Foundation sponsored events, ICCAD, Design Solution Forum · Website: update and improve Codasip.com, distribute press releases · Collateral generation: draft and distribute industry relevant technical white papers and product specific application note

Datasheet Bk7+

By the end of the third subtask, Bk7+ will be available for the business unit.

Verification report Bk10

The last subtask is dedicated to the verification of the generated RTL and documentation. By the end of the third subtask, Bk10 will be ready for further improvements.

Verification report Bk7+ Multicore

The last subtask is dedicated to the verification of the generated RTL and documentation.

Defined strategic steps towards open source hardware in CHIPS Alliance

Active participation in EPI (European Processor Initiative), RISC-V foundation at the organization committee level, CHIPS Alliance. Further, with both local and interrnational technical marketing teams cooperating, establish and execute a plan to improve awareness of Codasip among companies in the EU and APAC semiconductor market.

Datasheet Bk10

The last subtask is dedicated to the verification of the generated RTL and documentation. By the end of the third subtask, Bk10 will be ready for further improvements.

Datasheet Bk10+

The last subtask is dedicated to the verification of the generated RTL and documentation. By the end of the third subtask, Bk10 will be available for the business unit.

Datasheet Bk7+ Multicore

By the end of the third subtask, Bk7+ multicore cluster will be available for the business unit.

Verification report Bk10+

The last subtask is dedicated to the verification of the generated RTL and documentation. By the end of the third subtask, Bk10 will be available for the business unit.

Verification report Bk7+

The last subtask is dedicated to the verification of the generated RTL and documentation.

Codasip website language versions in German, French and Chinese content

Introduce Codasip website language versions in German, French and Chinese content

FPGA demonstration vehicle if applicable

Prepare and process FPGA demonstration vehicle if applicable

Exhibit at the ICCAD conference in Nanjing/Japan.

Active participation in EPI (European Processor Initiative), RISC-V foundation at the organization committee level, CHIPS Alliance. Further, with both local and interrnational technical marketing teams cooperating, establish and execute a plan to improve awareness of Codasip among companies in the EU and APAC semiconductor market. This includes participation in local alliences, local events, translation of key documents to German, French, Japan, and Chinese and exploitation of local media including social media. Active participation at EUROHPC summit week starting 2020 (European technology platform for HPC). Support of EuroHPC Undertaking in open calls if topics will be relevant.

Contribute to Design Solution Forum in Japan with a presentation in Japanese

Contribution to Design Solution Forum in Japan with a presentation in Japanese

Translation of key documents (product datasheet and corporate overview presentation into German, French and Chinese)

Translate key documents (product datasheet and corporate overview presentation into German, French and Chinese)

OpenOCD and LLDB-MI

OpenOCD Fixes and Improvements and LLDB-MI Fixes and Improvements

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