It is estimated that 20.4 billion connected things will be in use worldwide by the end of 2020, requiring devices to have unprecedented processing power, longer battery life and complexity. Therefore, consumer electronic devices are continuously decreasing in size by embedding more complex functionality, and incorporating increased processing power. This in turn leads to an exponential increase in capital expenditures and operational costs for the advanced semiconductor industry. One way for manufacturers to preserve their edge on their circuits’ small sizes, low costs, and high performance is to incorporate newer advanced semiconductor packaging technologies that provide improved device performance while enabling device miniaturization. However, current fabrication technologies involve long process chains, are extremely energy- and capital-intensive, create substantial waste (high environmental impact), and are not sufficiently flexible, thus hindering progress in consumer electronics. The objectives of the feasibility study were to evaluate the technical and economical requirements to disrupt the way semiconductor industrial manufacturing is executed worldwide through innovative printing technologies that allow for micro-level ultra-high resolution. The company evaluated also the optimum market areas for initial roll out of the technology in the semiconductor industry first in EU and then globally, tackling the need for more efficient and sustainable industrial production, thereby addressing critical goals of H2020 and Horizon Europe.