Project description
New printing technology for industrial microfabrication
In recent years, there has been a growing interest in miniaturisation regarding a variety of components for a variety of devices. This trend has been sparked by the increased demand for high-end electronic devices such as smartphones as well as IoT/AI applications. This, along with the constant development of newer and more complicated systems, has made the miniaturisation of parts an ever-increasing necessity. However, despite the rising needs of the industrial sector, companies are facing difficulty in the production of these parts because the microfabrication process exhibits high costs and complexity. The EU-funded NanoDrip project aims to develop and introduce a new printing technology designed for industrial manufacturing that will allow for ultrahigh-resolution microfabrication and flexibility.
Objective
The ongoing global trend of miniaturization is driven by the demand for a huge range of high-end devices such as smartphones, automotive connectivity and IoT/AI applications. This is highly dependent on the fabrication of embedded Integrated Circuits on semiconductor wafers & the advanced semiconductor packaging processes that protect ICs while providing connectivity to printed circuit boards & adjacent ICs. The fabrication of redistribution layers (RDL), is particularly challenging and expensive, representing a major challenge in the industry. Current RDL microfabrication technology constitutes multi-process chain (19 steps) and is incredibly capital intensive. Existing technology impacts the environment through vast consumption of energy and water. It provides limited flexibility at the wafer-level, restricting the use of optimised materials to microfabricate and limiting manufacturers ability to produce different packaging designs between production cycle, incurring high-fixed costs or expensive downtimes.
NanoDrip is the first printing technology which is applicable to advanced packaging, providing ultra-high-resolution microfabrication suitable for industrial manufacturing in merely 2 step-process. It enables digitality, the capability to produced different designs between production cycles with unprecedented flexibility. It introduces a disruptive paradigm shift in the fabrication of advanced electronics at a crucial time for the European industry, allowing European SMEs & large semiconductor manufacturers to gain competitive advantage as demand grows for next-generation of devices. During the phase 1 project, Scrona will establish a go-to-market strategy and a supply chain and will draft further development plan. During the innovation project, Scrona will optimise their proprietary printheads and printing process, optimize in-house printhead manufacturing process, and carry out large-scale demonstration of microfabrication with relevant stakeholders.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology mechanical engineering manufacturing engineering
- natural sciences computer and information sciences internet internet of things
- natural sciences physical sciences electromagnetism and electronics semiconductivity
- engineering and technology electrical engineering, electronic engineering, information engineering information engineering telecommunications mobile phones
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Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
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H2020-EU.2.3. - INDUSTRIAL LEADERSHIP - Innovation In SMEs
MAIN PROGRAMME
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H2020-EU.3. - PRIORITY 'Societal challenges
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H2020-EU.2.1. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies
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Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
SME-1 - SME instrument phase 1
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Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
(opens in new window) H2020-EIC-SMEInst-2018-2020
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Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.
8134 Adliswil
Switzerland
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.