Network in Microelectronic System Integration Technologies: Packaging

Objective

The objective of NETPACK is to coordinate the available skills and expertise throughout Europe in the area of packaging and interconnection. The network aims to help European industry to meet the challenges of the world packaging market. To achieve this goal, it will give strategic guidance for future work, initiate multi disciplinary cooperation between companies and institutes, stimulate the exchange of software and hardware tools, and to define adequate education programs.

In Europe, packaging and application expertise is distributed amongst a high number of large and medium-sized companies. Small and medium-sized companies are not able to establish complete packaging processes and master the large variety of technologies required. For these reasons there is a pressing need to establish efficient cooperation between semiconductor manufacturers, design houses, packaging industry and application-oriented companies in the field of microelectronics. A cost-effective procedure for the production of single-chip packages and multi-chip module packaging is a basic requirement for the companies.

The tasks of the proposed network are to:

- create roadmaps for the competitiveness of European industries in system integration (packaging)
- coordinate scientific and technical services provided by the NETPACK partners to each other
- coordinate packaging-related research between NETPACK partners
- coordinate packaging-related training and education in Europe.

Membership of the network is open to all European companies and laboratories able to contribute proven expertise in areas forming the basis of system integration and packaging, for example: expertise in simulation, design, characterisation techniques for materials, structures and interconnections technologies.

Programme(s)

• FP3-ESPRIT 3 - Specific research and technological development programme (EEC) in the field of information technologies, 1990-1994

Topic(s)

Data not available

Call for proposal

Data not available

Funding Scheme

Data not available

Leaflet | Map data © OpenStreetMap contributors, Credit: EC-GISCO, © EuroGeographics for the administrative boundaries

Coordinator

FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Address

Leonrodstrasse 54
80636 Muenchen
Germany

 

Participants (18)

ALCATEL SEL AG

Germany

Address

Lorenzstrasse 10
70435 Stuttgart

 

BPA London

United Kingdom

Address

Abinger House Church Street
RH4 1DF Dorking

 

Bull SA

France

Address

Tour Bull 1 Place Carpeaux
92800 Puteaux

 

Commissariat à l'Energie Atomique (CEA)

France

Address

Centre D'études De Grenoble 17 Avenue Des Martyrs
38041 Grenoble

 

Danfoss A/S

Denmark

Address

Nordborgvej 81
6430 Nordborg

 

ERICSSON TELECOM AB

Sweden

Address

Telefonplan
12625 Stockholm

 

European Silicon Structures SA

France

Address

Zone Industrielle
13106 Rousset

 

GEC Marconi Research Centre

United Kingdom

Address

West Hanningfield Road Great Baddow
CM2 8HN Chelmsford

 

GEC Plessey

United Kingdom

Address

Doddington Road
LN6 3LF Lincoln

 

Inter University Microelectronics Center

Belgium

Address

Kapeldreef 75
3001 Leuven

 

LINKOEPING UNIVERSITY

Sweden

Address

Teknikringen, 3
58183 Link™ping

 

Mietec N.V.

Belgium

Address

Westerring 15
9700 Oudenaarde

 

NED.PHILIPS BEDRIJVEN

Netherlands

Address

Gerstweg, 2
6534 AE Nijmegen

 

National Microelectronics Research Centre, University College Cork

Ireland

Address

Lee Maltings, Prospect Row
Cork

 

SGS-Thomson Microelectronics SrL

Italy

Address

Via C. Olivetti, 23651
20041 Agrate Brianza (Mi)

 

Siemens AG

Germany

Address

Balanstraße 73
81541 München

 

UNIVERSITY OF NEWCASTLE UPON TYNE

United Kingdom

Address

Kensington Terrace 6
NE1 7RU Newcastle Upon Tyne

 

VDI/VDE Technologiezentrum Informationstechnik GmbH

Germany

Address

Potsdamer Straße 12
14513 Teltow