Objective The objective of NETPACK is to coordinate the available skills and expertise throughout Europe in the area of packaging and interconnection. The network aims to help European industry to meet the challenges of the world packaging market. To achieve this goal, it will give strategic guidance for future work, initiate multi disciplinary cooperation between companies and institutes, stimulate the exchange of software and hardware tools, and to define adequate education programs.In Europe, packaging and application expertise is distributed amongst a high number of large and medium-sized companies. Small and medium-sized companies are not able to establish complete packaging processes and master the large variety of technologies required. For these reasons there is a pressing need to establish efficient cooperation between semiconductor manufacturers, design houses, packaging industry and application-oriented companies in the field of microelectronics. A cost-effective procedure for the production of single-chip packages and multi-chip module packaging is a basic requirement for the companies. The tasks of the proposed network are to: - create roadmaps for the competitiveness of European industries in system integration (packaging) - coordinate scientific and technical services provided by the NETPACK partners to each other - coordinate packaging-related research between NETPACK partners - coordinate packaging-related training and education in Europe. Membership of the network is open to all European companies and laboratories able to contribute proven expertise in areas forming the basis of system integration and packaging, for example: expertise in simulation, design, characterisation techniques for materials, structures and interconnections technologies. Fields of science natural sciencescomputer and information sciencessoftwarenatural sciencesphysical scienceselectromagnetism and electronicssemiconductivitynatural sciencesphysical scienceselectromagnetism and electronicsmicroelectronics Programme(s) FP3-ESPRIT 3 - Specific research and technological development programme (EEC) in the field of information technologies, 1990-1994 Topic(s) Data not available Call for proposal Data not available Funding Scheme Data not available Coordinator FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. Address Leonrodstrasse 54 80636 Muenchen Germany See on map EU contribution € 0,00 Participants (18) Sort alphabetically Sort by EU Contribution Expand all Collapse all ALCATEL SEL AG Germany EU contribution € 0,00 Address Lorenzstrasse 10 70435 Stuttgart See on map BPA London United Kingdom EU contribution € 0,00 Address Abinger house church street RH4 1DF Dorking See on map Bull SA France EU contribution € 0,00 Address Tour bull 1 place carpeaux 92800 Puteaux See on map Commissariat à l'Energie Atomique (CEA) France EU contribution € 0,00 Address Centre d'études de grenoble 17 avenue des martyrs 38041 Grenoble See on map Danfoss A/S Denmark EU contribution € 0,00 Address Nordborgvej 81 6430 Nordborg See on map ERICSSON TELECOM AB Sweden EU contribution € 0,00 Address Telefonplan 12625 Stockholm See on map European Silicon Structures SA France EU contribution € 0,00 Address Zone industrielle 13106 Rousset See on map GEC Marconi Research Centre United Kingdom EU contribution € 0,00 Address West hanningfield road great baddow CM2 8HN Chelmsford See on map GEC Plessey United Kingdom EU contribution € 0,00 Address Doddington road LN6 3LF Lincoln See on map Inter University Microelectronics Center Belgium EU contribution € 0,00 Address Kapeldreef 75 3001 Leuven See on map LINKOEPING UNIVERSITY Sweden EU contribution € 0,00 Address Teknikringen, 3 58183 Linkping See on map Mietec N.V. Belgium EU contribution € 0,00 Address Westerring 15 9700 Oudenaarde See on map NED.PHILIPS BEDRIJVEN Netherlands EU contribution € 0,00 Address Gerstweg, 2 6534 AE Nijmegen See on map National Microelectronics Research Centre, University College Cork Ireland EU contribution € 0,00 Address Lee maltings, prospect row Cork See on map SGS-Thomson Microelectronics SrL Italy EU contribution € 0,00 Address Via c. olivetti, 23651 20041 Agrate brianza (mi) See on map Siemens AG Germany EU contribution € 0,00 Address Balanstraße 73 81541 München See on map UNIVERSITY OF NEWCASTLE UPON TYNE United Kingdom EU contribution € 0,00 Address Kensington terrace 6 NE1 7RU Newcastle upon tyne See on map VDI/VDE Technologiezentrum Informationstechnik GmbH Germany EU contribution € 0,00 Address Potsdamer straße 12 14513 Teltow See on map
