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Network in Microelectronic System Integration Technologies: Packaging

Objective

The objective of NETPACK is to coordinate the available skills and expertise throughout Europe in the area of packaging and interconnection. The network aims to help European industry to meet the challenges of the world packaging market. To achieve this goal, it will give strategic guidance for future work, initiate multi disciplinary cooperation between companies and institutes, stimulate the exchange of software and hardware tools, and to define adequate education programs.

In Europe, packaging and application expertise is distributed amongst a high number of large and medium-sized companies. Small and medium-sized companies are not able to establish complete packaging processes and master the large variety of technologies required. For these reasons there is a pressing need to establish efficient cooperation between semiconductor manufacturers, design houses, packaging industry and application-oriented companies in the field of microelectronics. A cost-effective procedure for the production of single-chip packages and multi-chip module packaging is a basic requirement for the companies.

The tasks of the proposed network are to:

- create roadmaps for the competitiveness of European industries in system integration (packaging)
- coordinate scientific and technical services provided by the NETPACK partners to each other
- coordinate packaging-related research between NETPACK partners
- coordinate packaging-related training and education in Europe.

Membership of the network is open to all European companies and laboratories able to contribute proven expertise in areas forming the basis of system integration and packaging, for example: expertise in simulation, design, characterisation techniques for materials, structures and interconnections technologies.

Coordinator

FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Address
Leonrodstrasse 54
80636 Muenchen
Germany

Participants (18)

ALCATEL SEL AG
Germany
Address
Lorenzstrasse 10
70435 Stuttgart
BPA London
United Kingdom
Address
Abinger House Church Street
RH4 1DF Dorking
Bull SA
France
Address
Tour Bull 1 Place Carpeaux
92800 Puteaux
Commissariat à l'Energie Atomique (CEA)
France
Address
Centre D'études De Grenoble 17 Avenue Des Martyrs
38041 Grenoble
Danfoss A/S
Denmark
Address
Nordborgvej 81
6430 Nordborg
ERICSSON TELECOM AB
Sweden
Address
Telefonplan
12625 Stockholm
European Silicon Structures SA
France
Address
Zone Industrielle
13106 Rousset
GEC Marconi Research Centre
United Kingdom
Address
West Hanningfield Road Great Baddow
CM2 8HN Chelmsford
GEC Plessey
United Kingdom
Address
Doddington Road
LN6 3LF Lincoln
Inter University Microelectronics Center
Belgium
Address
Kapeldreef 75
3001 Leuven
LINKOEPING UNIVERSITY
Sweden
Address
Teknikringen, 3
58183 Link™ping
Mietec N.V.
Belgium
Address
Westerring 15
9700 Oudenaarde
NED.PHILIPS BEDRIJVEN
Netherlands
Address
Gerstweg, 2
6534 AE Nijmegen
National Microelectronics Research Centre, University College Cork
Ireland
Address
Lee Maltings, Prospect Row
Cork
SGS-Thomson Microelectronics SrL
Italy
Address
Via C. Olivetti, 23651
20041 Agrate Brianza (Mi)
Siemens AG
Germany
Address
Balanstraße 73
81541 München
UNIVERSITY OF NEWCASTLE UPON TYNE
United Kingdom
Address
Kensington Terrace 6
NE1 7RU Newcastle Upon Tyne
VDI/VDE Technologiezentrum Informationstechnik GmbH
Germany
Address
Potsdamer Straße 12
14513 Teltow