Periodic Reporting for period 2 - TINKER (FABRICATION OF SENSOR PACKAGES ENABLED BY ADDITIVE MANUFACTURING)
Reporting period: 2022-04-01 to 2024-03-31
Autonomous driving and self-driving cars represent one prominent example for the use of microelectronics and sensors, most importantly RADAR and LiDAR sensors. Their respective markets have a big potential, e.g. it is estimated that the market size of LiDAR in automotive will double itself in the next two years. The public awareness and the industrial need for further miniaturization of such sensor packages is the main driver of ongoing efforts in the automotive sector to be able to integrate such devices into the car body like in the bumpers, grilles and exterior lamps (headlights & rear lamps) instead of attaching them (e.g. on top of the car in case of LiDAR device). Safety (for the driver and others) is the most important key aspect of the automotive sector. Therefore, highly-value and high-performance RADAR and LiDAR systems are required for advanced driver-assistance systems (ADAS) as well as autonomous cars. Current bottlenecks are relevantly large size of such sensor devices, their weight and power consumption. Since these factors are highly limited within cars, further miniaturization and improving functionality and efficient use of resources is highly demanded.
Specific objective 1 – Improving speed, accuracy and reliability of pick and place assembly techniques. The objective was fulfilled by the integration of additional sensors inside the P&P equipment et BESI, e.g. height and tilt enabling the fast commercialization of novel assembly processes.
Specific objective 2 – Improving automation level, process reliability and lowered rejection rate via feedback control. The objective was fulfilled by the realization of a system that can detect defects on a macroscopic level, like airborne particles curing issues or delamination of resist. The setup includes a high resolution imager and two different illumination types combined in a advanced unit for high response of the defects in a very compact dimension.
Specific objective 3 – Improved miniaturization level, fabrication time and efficient use of resources enabled by additive manufacturing. The objective was fulfilled by validation of the Tinker concept - the first integration of the beam scanning device (OPA) on a silicon interposer, so a photonic device on an electronic one using TSV. AM processes we used to realization of 3D radar waveguides and chip wire-bonding using inkjet and NIL. Those new integration processes allow denser, flexible and cheaper processing of the sensor packages.
Specific objective 4: fabrication of RADAR sensor packages. Fabrication of 3D radar waveguides by inkjet printing, precise P&P processing, and gap filling supported by machine learning algorithms, followed by inkjet conductive printing or NIL for wire-bonding, was successfully demonstrated using the TINKER platform.
Specific objective 5: fabrication of LIDAR sensor package. This realization of OPA on a silicon wafer was successfully integrated, and beam steering for LIDAR application was demonstrated.
Specific objective 1 – Improving speed, accuracy and reliability of pick and place assembly techniques. The objective was fulfilled by the integration of additional sensors inside the P&P equipment et BESI, e.g. height and tilt enabling the fast commercialization of novel assembly processes.
Specific objective 2 – Improving automation level, process reliability and lowered rejection rate via feedback control. The objective was fulfilled by the realization of a system that can detect defects on a macroscopic level, like airborne particles curing issues or delamination of resist. The setup includes a high resolution imager and two different illumination types combined in a advanced unit for high response of the defects in a very compact dimension.
Specific objective 3 – Improved miniaturization level, fabrication time and efficient use of resources enabled by additive manufacturing. The objective was fulfilled by validation of the Tinker concept - the first integration of the beam scanning device (OPA) on a silicon interposer, so a photonic device on an electronic one using TSV. AM processes we used to realization of 3D radar waveguides and chip wire-bonding using inkjet and NIL. Those new integration processes allow denser, flexible and cheaper processing of the sensor packages.
Specific objective 4: fabrication of RADAR sensor packages. Fabrication of 3D radar waveguides by inkjet printing, precise P&P processing, and gap filling supported by machine learning algorithms, followed by inkjet conductive printing or NIL for wire-bonding, was successfully demonstrated using the TINKER platform.
Specific objective 5: fabrication of LIDAR sensor package. This realization of OPA on a silicon wafer was successfully integrated, and beam steering for LIDAR application was demonstrated.
The TINKER Pilot Printer was an essential part in the TINKER Project since it was the core equipment for the prototype fabrication of RADAR sensor packages via inkjet printing. Laser sintering device have been integrated in the printer. Feedback loop and interoperability between dislocated line components were demonstrated, and process data, inspection data, and printing files generated by ML algorithms were shared shares over dedicated cloud system.
TINKER materials (printable and imprintable with high RI, electrically and thermally conductive and dielectric) were used to print 3D waveguide antenna and to connect the radar bare pads as well as to realize beam splitting structure for OPA. Partners closely cooperated together on demonstrator fabrication and their characterization, several workshops have been organized to strengthen the cooperation. Fully functional PIC demonstrator including OPA packaging, mobile mockup design and assembly and software development have been realized and demonstrated
Both RADAR and LIDAR package demonstrators have been demonstrated in several conferences and fairs (in over 15 publications in total). The final dissemination event of TINKER was LOPEC 2024 (Munich) in March 2024. TINKER partners presented project results in a booth, and several contributions to the technical and scientific conference have been submitted. Live demonstration of both use-cases took place during the final and review meeting at NOTION in Swetzingen. Radar 3D waveguides were printed live for the project offices and technical reviewers. Printing and laser sintering processes were showcased as well. The OPA LIDAR demonstrator was transferred from LOPEC presentation directly to the final meeting in Schwetzingen and beam steering was demonstrated live.
TINKER materials (printable and imprintable with high RI, electrically and thermally conductive and dielectric) were used to print 3D waveguide antenna and to connect the radar bare pads as well as to realize beam splitting structure for OPA. Partners closely cooperated together on demonstrator fabrication and their characterization, several workshops have been organized to strengthen the cooperation. Fully functional PIC demonstrator including OPA packaging, mobile mockup design and assembly and software development have been realized and demonstrated
Both RADAR and LIDAR package demonstrators have been demonstrated in several conferences and fairs (in over 15 publications in total). The final dissemination event of TINKER was LOPEC 2024 (Munich) in March 2024. TINKER partners presented project results in a booth, and several contributions to the technical and scientific conference have been submitted. Live demonstration of both use-cases took place during the final and review meeting at NOTION in Swetzingen. Radar 3D waveguides were printed live for the project offices and technical reviewers. Printing and laser sintering processes were showcased as well. The OPA LIDAR demonstrator was transferred from LOPEC presentation directly to the final meeting in Schwetzingen and beam steering was demonstrated live.
According to the work program, TINKER addresses the expected impacts, such as decrease of production time, measurable increase of automation level, higher or similar precision level and reduction in rejection rates during the production process. The main purposes of this project was to widen the range of available miniaturization and microelectronic fabrication possibilities including the novel approaches in assembly processes directly in production steps.
The project includes top EU innovation performers – 10 the most excellent industrial companies, 3 research specialists, 1 consultancy and a service association from 8 European countries, all cooperating together under the roof of TINKER as major players in the field of microelectronic manufacturing and processing and industrial fields applying or interested in applying AM for their needs and defending the European pole position in miniaturization, also by gaining new know-how and skills for involved SMEs and R&D companies.
Tinker has an impact in the following areas: Decrease of production time in additively manufactured electronics, Novel approaches in assembly and fabrication, Increase of automation level and higher precision levels
Innovation capacity
TINKER innovations (Beyond State of the Art) have been identified out of the developments carried out in the project duration in the following areas:
Material development (Imprintable, conductive and thermoconductive materials)
Process and methodology development (Inkjet processing, nanoimprint lithography, waveguide design optimization)
Equipment development (Pick & Place, TINKER printer, curing and tilt sensor)
The project includes top EU innovation performers – 10 the most excellent industrial companies, 3 research specialists, 1 consultancy and a service association from 8 European countries, all cooperating together under the roof of TINKER as major players in the field of microelectronic manufacturing and processing and industrial fields applying or interested in applying AM for their needs and defending the European pole position in miniaturization, also by gaining new know-how and skills for involved SMEs and R&D companies.
Tinker has an impact in the following areas: Decrease of production time in additively manufactured electronics, Novel approaches in assembly and fabrication, Increase of automation level and higher precision levels
Innovation capacity
TINKER innovations (Beyond State of the Art) have been identified out of the developments carried out in the project duration in the following areas:
Material development (Imprintable, conductive and thermoconductive materials)
Process and methodology development (Inkjet processing, nanoimprint lithography, waveguide design optimization)
Equipment development (Pick & Place, TINKER printer, curing and tilt sensor)