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CORDIS

FABRICATION OF SENSOR PACKAGES ENABLED BY ADDITIVE MANUFACTURING

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Pilot line with inkjet system installed at BOS (opens in new window)

Inkjet hardware and software based on definitions of D2.5 and concept from D5.2, including updates on existing equipment at PRO, printer pilot by NOT and Laser tools by FOR.

Prototype of Placement equipment (opens in new window)

Placement hardware and software based on definitions of D23 and D26 including pick and place gripper setup AI software to improve accuracy 3D inspection systems by SEN and BESI laser ellipsometry by SEN and interface to TINKER platform interoperability

Demonstrator of RADAR sensor package fabricated using TINKER platform (opens in new window)

Small series fabrication of RADAR sensor package demonstrator fabrication via TINKER pilot platform,

Prototype of TINKER platform including closed loop error compensation (opens in new window)

Functional prototype of TINKER pilot, deriving from prototypes for placement (D3.1, 4.1 and 5.1 and 5.4). Closed loop error compensation between devices. Interoperability established between the single TINKER pilot parts.

Prototype of NIL resist with high refractive index (opens in new window)

High refractive index material prototype for OPA application based on the definitions in D22 and D25

Prototypes of TINKER inkjet materials (opens in new window)

Prototypes of Electrically conductive copper ink by PVN Dielectric inks based on BMI material by PVN and based on acrylic material by TIG and thermal conductive ink by TIG Based on the definitions in D21 and D25

Prototype NIL equipment and tools (opens in new window)

NIL hardware and process setup based on D25 to serve the manufacturing of OPA devices

Prototype LIDAR sensor assembly (opens in new window)

PIC – EIC assembly prototypes via TINKER fabrication approaches

Prototype of inspection equipment (opens in new window)

Related to task 41 first set of inspection system equipment hard and software and inspection tools based on thermography spectroscopy and microscopy approaches allowing first collection of raw data of TINKER processes

Prototype RADAR sensor assembly (opens in new window)

Fabricated RADAR prototypes via TINKER fabrication approaches

Demonstrator of LIDAR sensor package fabricated using TINKER platform (opens in new window)

Small series fabrication of LIDAR sensor package demonstrator fabrication via TINKER pilot platform.Conception and realization of a driving electronic board and electric testsFPGA and computer software development

Data set in repository (opens in new window)

Subset of data and meta data collected for publication in a public repository in accordance to data management plan (DMP)

Publications

Autonomes Fahren: Profactor prescht vor

Author(s): Leo Schranzhofer
Published in: Volksblatt, 2021
Publisher: Oberösterreichische Media Data Vertriebs- und Verlags GmbH

Marelli, CEA-LETI in Tinker Project: See it at DVN Lidar Conference

Author(s): Thierry Mourier
Published in: DVN Lidar Conference Newsletter 2022, 2022
Publisher: Driving Vision News

Sensor packages for autonomous cars enabled by additive manufacturing

Author(s): Martina Chopart, MSc. – Amires s.r.o.; Dr Leo Schranzhofer – Profactor GmbH; Bernhard Polzinger – Robert Bosch GmbH; Emmanuel I. Stratakis PhD. – FORTH (Foundation for Research and Technolo gy - Hellas); Dr Maria Pervolaraki – FORTH (Foundation for Research and Technology - Hellas); Dr David Volk – Notion Systems
Published in: OPE Journal, Issue 38, 2022
Publisher: Deutscher Fachverlag GmbH

Versatile use of LiDAR modules into Smart Corner and grille

Author(s): Frederic Chave
Published in: DVN Lidar Conference Newsletter, 2021
Publisher: Driving Vision News

3D Lidar-on-chip

Author(s): Martina Chopart, Pavel Kulha
Published in: PRO Flextronics, Issue 1, 2024, Page(s) 11
Publisher: M2N Media GmbH

Shrinking RADAR and LiDAR sensor packages – an introduction to TINKER

Author(s): Leo Schranzhofer
Published in: Chip Scale Review, Issue Vol. 26, Nr. 1., 2022, Page(s) 11-12
Publisher: Chip Scale Review

TINKER inkjet pilot line celebrates completion

Author(s): Martina Chopart, Pavel Kulha
Published in: OPE journal, Issue 45, 2023, Page(s) 18
Publisher: Deutscher Fachverlag GmbH

AugenundOhren für selbstfahrende Autos aus Steyr

Author(s): HANNES FEHRINGER
Published in: Steyrer Zeitung, 2021
Publisher: OÖ. Online GmbH & Co.KG.

Autonomfahren: Oberösterreich steigtt gtaufs Gas

Author(s): Ulrike Rubasch
Published in: OÖ Nachrichten, 2021
Publisher: OÖ Nachrichten

UV Nanoimprint Lithography—Impact of Coating Techniques on Pattern Quality (opens in new window)

Author(s): Johanna Rimböck, Patrick Schuster, Lisa Vsetecka, Christine Thanner
Published in: Nanomanufacturing, Issue 4, 2024, Page(s) 69-80, ISSN 2673-687X
Publisher: MDPI
DOI: 10.3390/nanomanufacturing4010005

Deep learning for zero-defect inkjet-printing of electronics (opens in new window)

Author(s): Flaig Minnette, Zambal Sebastian
Published in: 2021 IEEE International Workshop on Metrology for Industry 4.0 & IoT (MetroInd4.0&IoT), 2022, Page(s) 458-463
Publisher: IEEE
DOI: 10.1109/metroind4.0iot51437.2021.9488493

Direct patterning of functional materials using nanoimprint lithography (opens in new window)

Author(s): Michael J. Haslinger, Sonja Kopp, Voktorija Jonaityte, Amiya Moharana, Helene Außerhuber, Michael Mühlberger
Published in: 38th European Mask and Lithography Conference (EMLC 2023), 2023
Publisher: SPIE
DOI: 10.1117/12.2674052

Error Compensation of Inkjet-printed Electronics using Incremental Learning and Knowledge Distillation (opens in new window)

Author(s): Abdalla Shahin
Published in: 2024 International Conference on Artificial Intelligence, Computer, Data Sciences and Applications (ACDSA), 2024
Publisher: IEEE
DOI: 10.1109/acdsa59508.2024.10467896

Feedback Error Compensation of Inkjet-Printed ElectronicsUsing Incremental Learning and Knowledge DistillationMethods

Author(s): Abdalla Saber Ali Shahin
Published in: 2023
Publisher: Alpen-Adria-Universität Klagenfurt

Intellectual Property Rights

MEASURING DEVICE BASED ON A COMBINATION OF OPTICAL 2D AND 3D IMAGE CAPTURING METHODS

Application/Publication number: 20 23053349
Date: 2023-04-03
Applicant(s): BESI AUSTRIA GMBH

Messvorrichtung basierend auf kombinierter optischer 2D- und 3D-Bilderfassungsverfahren, Fertigungssystem und Inspektionssystem

Application/Publication number: 10 2022107897
Date: 2022-04-01
Applicant(s): BESI AUSTRIA GMBH

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