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eXtreme ultraviolet to soft-X-ray Photonic Integrated Circuits

Project description

Pushing photonics operation towards the extreme ultraviolet and soft X-rays

Integration of optical devices and advanced microelectronic circuits on a single semiconductor chip is the backbone of next-generation photonics technologies. Current optical chips operate in the infrared and visible parts of the electromagnetic spectrum as they are limited by the semiconductor band gap. The EU-funded X-PIC project will work on innovative methods to manipulate higher-energy photons in integrated photonics devices. Increasing the spectral range to the extreme ultraviolet and soft X-ray parts could open up exciting new applications in fields as diverse as microelectronics and nanoelectronics, biology, pharmacology, chemistry, material science, physics and metrology.

Objective

This project aims at the realization of a new technological platform for the development of a EUV - soft X-ray integrated photonics.
Integrated photonics is a growing sector of photonics devoted to the realization of optoelectronic devices integrated in a single unit able of complex functionalities, with numerous and increasing applications. Current technology shares several aspects with semiconductor electronics; for this reason, the electromagnetic spectrum involved in integrated photonics is essentially limited to the infrared-to-visible range by the semiconductor band gap.
The development of a novel technology able to manipulate high-energy photons in integrated devices may open integrated photonics to novel frontiers; in particular, the spectral range going form the extreme ultraviolet to the soft X-rays is very attractive for applications in Micro- and Nanoelectronics, Biology, Pharmacology, Material and Surface Sciences, Chemistry, Physics, Metrology and in many other fields.
The ambitious goals of the project will be reached through the synergetic interaction among different disciplines as Ultrafast Laser Technology, Extreme Nonlinear Optics, Femtosecond Laser Micromachining, Fluid Dynamics, Nanotechnology, EUV to soft X-rays technology. The partners involved in this proposal are leaders in those research fields, thus making the ambitious project goals feasible.
The innovative technology demonstrated in this project will be the base for a large variety of future devices offered to industrial and scientific customers, with functionalities tailored to specific applications.

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Topic(s)

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Funding Scheme

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RIA - Research and Innovation action

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Call for proposal

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(opens in new window) H2020-FETOPEN-2018-2020

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Coordinator

POLITECNICO DI MILANO
Net EU contribution

Net EU financial contribution. The sum of money that the participant receives, deducted by the EU contribution to its linked third party. It considers the distribution of the EU financial contribution between direct beneficiaries of the project and other types of participants, like third-party participants.

€ 725 000,00
Address
PIAZZA LEONARDO DA VINCI 32
20133 Milano
Italy

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Region
Nord-Ovest Lombardia Milano
Activity type
Higher or Secondary Education Establishments
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Total cost

The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.

€ 725 000,00

Participants (3)

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