Objective
Main Objective
LOIS aims to analyse, fabricate, optimise and demonstrate integrated space-switches for operation in the 1.55 µm window using innovative integration technologies that are compatible with large scale production of switches of significant size. It will use physical effects and materials that have already been shown to be compatible with system applications, and have been used in at least a preliminary manufacturing process.
The project will also demonstrate the ability to build, in a compact and manufacturable manner, larger switches than can be achieved cost-effectively in fully integrated devices. This will be achieved by the interconnection of integrated switch modules using optimised shuffles with reliable and low cost technology.
The approach will be shown to be scaleable to space-switches of 8x8, 16x16 and beyond (with a minimum of 8x8 per board), and to be compatible with large-scale production and system requirements.
Technical Approach
Two integration technologies, based on different physical effects, will be evaluated:
-electrostatic control of mechanical cantilevers on silicon substrate, leading to integration compatible electromechanical switches.
-optical gating using semiconductor optical amplifier arrays, flip-chip mounted on silicon motherboard for integration with SiO2 passive waveguides. Compact module interconnection will be based on optimised shuffles realised using a new multilayer flexible interconnect technology.
The scalability of the technologies will be assessed aiming at a switch size of 16x16 and beyond, with a minimum target size of 8x8 per single board. The compatibility of the technologies with optical networking applications will be assessed through experimental validation using routing and switching test-beds.
Generic LOIS switch
Summary of Trial
The switches realised within the project will be tested in optical cross-connect and packet-switching test-beds made available by the ACTS projects OPEN and KEOPS.
Expected Achievements
The expected achievements are:
-fabrication of integrated switches based on LOIS technological approaches
-fabrication of multilayer flexible interconnects for integrated module interconnection
-validation of LOIS approach for switch size of 16x16 and beyond
Expected Impact
Optical networking systems will reduce the cost of routing in future transport networks that exploit the massive transmission potential of WDM techniques. Integration technologies, such as those developed within LOIS, will make it possible to develop and deploy such complex optical networking systems.
Main contributions to the programme objectives:
Main deliverables
Developed the manufacturability of scaleable optical switches
Contribution to the programme
Development of optical cross-connects suitable for WDM
Key Issues
The key technical issues of the project are:
-the development of photonic space-switch integration technologies:
-micro-mechanical switch on silicon substrate
-InP optical gates associated with SiO2/Si wave-guides
-the development of compact and reliable flexible interconnects based on a new multilayer approach
-the demonstration of scalability and compatibility with optical networking requirements
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
- engineering and technologymechanical engineeringmanufacturing engineering
- natural sciencesphysical scienceselectromagnetism and electronicssemiconductivity
- natural scienceschemical sciencesinorganic chemistrymetalloids
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Topic(s)
Call for proposal
Data not availableFunding Scheme
CSC - Cost-sharing contractsCoordinator
91460 Marcoussis
France