Objective Inorganic-organic polymers for application as dielectric layers in electrical multichip modules (MCMs) and as optical wave guides for electrooptical MCMs will be developed. These materials should possess properties for passivation and cladding purposes, too. They can fulfil many or all of the required demands for MCMs at the same time due to the opportunities for tailoring the properties of these materials in view of required demands.The properties of these materials will be compared with common polymers for MCMs today. The new materials should be easy to process and cheaper to produce than common materials. If not a single material can be used the inorganic-organic polymeric material to be developed and optimised has to be compatible with existing materials and processings. Also new process techniques for the production of MCMs will be studied in view of rentability and enhancement of reliability. Chip embedding technology and thin film metallization are techniques, which seem to be successful and will be checked together with the inorganic-organic polymers. Components like chips and photo diodes will be selected or developed for the different requirements of the partners involved. Thereby, complete system solutions will be established within the proposed project. Fields of science natural scienceschemical sciencespolymer sciencesengineering and technologymaterials engineeringcoating and films Programme(s) FP3-BRITE/EURAM 2 - Specific programme (EEC) of research and technological development in the field of industrial and materials technologies, 1990-1994 Topic(s) 1.3.3 - Polymers and polymer matrix composites Call for proposal Data not available Funding Scheme CSC - Cost-sharing contracts Coordinator FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.* EU contribution No data Address Neunerplatz 2 97082 WUERZBURG Germany See on map Total cost No data Participants (6) Sort alphabetically Sort by EU Contribution Expand all Collapse all BULL SA France EU contribution No data Address Rue Jean Jaurès 78340 Les-Clayes-sous-Bois See on map Total cost No data CEMOTA France EU contribution No data Address 69390 VERNAISON See on map Total cost No data ERICSSON TELECOM AB Sweden EU contribution No data Address 12625 STOCKHOLM See on map Total cost No data IMC MICROSYSTEMS Sweden EU contribution No data Address TEKNIKRINGEN 3 583 30 LINKOPING See on map Total cost No data Motorola Ltd United Kingdom EU contribution No data Address Kelvin Industrial Estate East Kilbride G75 0TG Glasgow See on map Total cost No data Technische Universität Berlin Germany EU contribution No data Address Straße des 17 Juni 135 10623 Berlin See on map Total cost No data
