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DEVELOPMENT OF NEW DIELECTRICAL AND OPTICAL MATERIALS, TESTING AND COMPARISON WITH EXISTING POLYMERS AND APPLICATION IN MULTI-CHIP-MODULES

Objective



Inorganic-organic polymers for application as dielectric layers in electrical multichip modules (MCMs) and as optical wave guides for electrooptical MCMs will be developed. These materials should possess properties for passivation and cladding purposes, too. They can fulfil many or all of the required demands for MCMs at the same time due to the opportunities for tailoring the properties of these materials in view of required demands.

The properties of these materials will be compared with common polymers for MCMs today. The new materials should be easy to process and cheaper to produce than common materials. If not a single material can be used the inorganic-organic polymeric material to be developed and optimised has to be compatible with existing materials and processings. Also new process techniques for the production of MCMs will be studied in view of rentability and enhancement of reliability. Chip embedding technology and thin film metallization are techniques, which seem to be successful and will be checked together with the inorganic-organic polymers. Components like chips and photo diodes will be selected or developed for the different requirements of the partners involved. Thereby, complete system solutions will be established within the proposed project.

Funding Scheme

CSC - Cost-sharing contracts

Coordinator

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V.*
Address
Neunerplatz 2
97082 Wuerzburg
Germany

Participants (6)

BULL SA
France
Address
Rue Jean Jaurès
78340 Les-clayes-sous-bois
CEMOTA
France
Address

69390 Vernaison
ERICSSON TELECOM AB
Sweden
Address

12625 Stockholm
IMC MICROSYSTEMS
Sweden
Address
Teknikringen 3
583 30 Linkoping
Motorola Ltd
United Kingdom
Address
Kelvin Industrial Estate East Kilbride
G75 0TG Glasgow
Technische Universität Berlin
Germany
Address
Straße Des 17 Juni 135
10623 Berlin