The project is aimed at the extension of the process of aqueous autocatalytic reduction of metals to incorporate the metals gold, silver and their alloys.
1. An electroless gold formulation based on monovalent gold had been produced and operated on a pilot plant scale. This solution has a low gold content and is suitable for use in producing printed circuit boards where the large surface area being processed can lead to high loss due to 'drag-out'.
2. A second electroless gold formulation, based on trivalent gold, has been produced and operated on a pilot plant scale. This solution is more suited to the production of thicker deposits for microwave applications.
3. An electroless silver formulation has been developed and successfully operated on a pilot plant scale.
4. The deposits produced from all the solutions are smooth, fine-grained and have physical properties comparable to conventional electrodeposits but more uniform in distribution over the object being coated. Good adhesion is obtained on a number of substrates. The solutions are stable and capable of replenishment of the constituents and can be operated for a period of days. A number of demonstrators have been produced, including microwave assemblies and printed circuit boards.
A study of the theoretical considerations of the autocatalytic systems followed by the development of novel formulations is proposed.
Additionally the study of catalytic and methods to deposit electroless metals onto anodized aluminium will be exposed, aimed at developing a process for the production of novel printed circuit substrates.
From this work it is anticipated that novel processes and products can be offered of special use to the electrical and electronic industries.
10024 Moncalieri Torino
7550 KA Hengelo