The aim of the project is to further advance the technological and theorical basis if Si micromechanics in order to fully exploit its potential for new applications, thereby creating the foundation for a new industry.
A number of achievements have been obtained:
experiments with dry and wet chemistries show that the required deliverable depths can be obtained;
some microstructures stress compensation techniques have been determined;
development of sensor simulation packages is in progress.
This project set out to investigate specific areas that will contribute to the building blocks necessary for the development of Si based sensors for monitoring pressure acceleration, etc> The project will provide the elements needed for :
1. fabricating micromechanical structures with high aspect ratios and compensated for stress. The experiment will determine the best masking material for etching. Various techniques for the stress compensation in dielectric and semiconductor layers will be studied;
2. developing devices with freely movable silicon parts, which can be used for the realization of micromechanical sensors and actuators;
3. allowing the prediction of the behaviour of micromechanical devices using the software packages and simulations. The state and dynamic behaviour of cantilevers, bridges and plates and he influence of temperature on such structures will be considered.